Subject: Processors | January 6, 2019 - 03:07 PM | Jim Tanous
Tagged: Zen+, vega APU, ryzen mobile, ces2019, athlon, amd
AMD today officially announced its lineup of 2nd generation Ryzen mobile processors, designated Ryzen 3000 Series Mobile Processors. Unlike AMD’s expected 3000-series desktop launch, which will be based on Zen 2, these new mobile variants stick with AMD’s 12nm Zen+ architecture.
Each 15- or 35-watt model features Vega graphics and core/thread counts ranging from 2 cores/4 threads to 4 cores/8 threads. AMD is touting improvements in battery life and overall performance, claiming that the top-end 15-watt part can best the Intel i7-8550U by up to 29 percent in media editing, while the mid-tier 15-watt Ryzen 5 3500U beats its Intel counterpart, the i5-8250U, by up to 14 percent in website loading speed.
|Model||Cores/Threads||TDP||Boost/Base Freq.||Graphics||GPU Cores||Max GPU Freq.|
|AMD Ryzen 7 3750H||4/8||35W||4.0/2.3GHz||Vega||10||1400MHz|
|AMD Ryzen 7 3700U||4/8||15W||4.0/2.3GHz||Vega||10||14000MHz|
|AMD Ryzen 5 3550H||4/8||35W||3.7/2.1GHz||Vega||8||1200MHz|
|AMD Ryzen 5 3500U||4/8||15W||3.7/2.1GHz||Vega||8||1200MHz|
|AMD Ryzen 3 3300U||4/4||15W||3.5/2.1GHz||Vega||5||1200MHz|
|AMD Ryzen 3 3200U||2/4||15W||3.5/2.6GHz||Vega||3||1200MHz|
|AMD Athlon 300U||2/4||15W||3.3/2.4GHz||Vega||3||1000MHz|
|AMD A6-9220C||2/2||6W||2.7/1.8GHz||R5||3 cores
|AMD A4-9120C||2/2||6W||2.4/1.6GHz||R4||3 cores
The initial batch of laptops featuring Ryzen 3000 Series Mobile Processors will be available in the first quarter from partners Acer, ASUS, Dell, HP, Huawei, Lenovo, and Samsung, with additional product launches coming later in the year.
In addition to its flagship Ryzen mobile lineup, AMD is launching a Zen-based Athlon mobile processor, the Athlon 300U, to target entry-level price points. The company has also announced two new 6-watt A-Series chips aimed at the Chromebook market.
Finally, on the software side, AMD announced that starting this quarter, it will provide Radeon Adrenalin driver support to any laptop with a Ryzen processor and integrated Radeon graphics. This will simplify the driver situation for both consumers and manufacturers, as well as give AMD the ability to directly update gamers’ devices for the latest features and game optimizations.
With AMD getting its arguably less-exciting mobile announcements “out of the way” to start CES, this paves the way for the company to make its big desktop-focused announcements during Dr. Lisa Su’s CES keynote on Wednesday.
Subject: Processors | December 31, 2018 - 09:46 PM | Tim Verry
Tagged: SMT, self driving car, cortex A65AE, armv8-a, arm safety ready, arm
Over the holidays I noticed that ARM released information on a new core design aimed at autonomous driving systems. The Cortex-A65AE is part of the company's Automotive Enhanced lineup and follows on the Cortex-A76AE) with its split-lock and other features that are part of ARM's Safety Ready program.
Aimed at processors that will be used in self driving cars, advanced driver assistance systems (ADAS), aviation, and industrial automation, the Cortex-A65AE core design integrates several safety and redundancy features that meet ASIL D specifications which is a hazard and risk assessment test for an ISO standard (26262) focused on road vehicle safety. Processors will be able to have up to eight cores and will support SMT with each physical core able to run two threads (at different exception levels and/or under different OSes). The cores can be run independently for performance or in lock step for redundancy and integrity checking comparing each other's calculation results (Split-Lock and Dual Core Lock Step respectively). Using the simultaneous multithreading, two threads on a physical core and operate in lock step mode with two other threads on a different physical shadow core according to Anandtech.
ARM has not yet released full details about the Cortex-A65AE core but it utilizes a 6A65AE4-bit out of order execution pipeline with the. ARMv8-A. It can be customized to suit the needs of ARM's partners so exact chip specifications will differ, but in general Cortex-A65AE cores can have 16 to 64 KB L1 instruction and data caches, 64 to 256 KB L2 cache, an optional L3 cache up to 4MB. Other features include support for ARM TrustZone, ECC memory, and ACP connections for accelerators. The new cores are built with ARM's DynamIQ technology and are slated to be used in chips built on the 7nm process node.
According to ARM, Cortex-A65AE cores are 70% faster in integer performance per core and offer up to 3.5 times the memory throughput and six times the read bandwidth for ACP accelerators versus the existing Cortex-A53 cores. The notable performance jump is likely the result of a combination of moving to a smaller process node, the addition of SMT, and architectural improvements and cache and inter-chip routing optimizations.
ARM is positioning the Cortex-A65AE as complementary to the Cortex-A76AE which is to say that the new core is not a direct replacement for it. While the Cortex-A76AE is high performance, the A65AE is high throughput and both cores reportedly have their place in future ADAS and self-driving cars. The Cortex-A65AE cores can be clustered together to do the initial processing and sensor fusion calculations from all of the inputs from cameras, radar, lidar, and other hardware. From there, clusters including Cortex A76AE chips (or a mix of the two) along with other accelerators can be responsible for making the decisions based on the sensor information. How well it works in practice and how this heterogenous setup will compare to competing offerings from NVIDIA, Intel/MobileEye, and others remains to be seen. I am all for the self-driving car future though so the more competition and developments in that space is always nice to see even if it's still a ways off yet!
The Cortex-A65AE being the first Cortex-A core to feature multithreading is also interesting and I am very curious if we will see that capability expanded to other ARM processors outside of the AE series. While SMT may not be worth it for mobile devices like smartphones and even tablets, perhaps future ARM-powered Always Connecred Windows notebook PCs will use processors with SMT capable cores as it would be easier to justify the extra cost in power and size to include multithreading.
What are your thoughts?
(PS I hope everyone had a safe holiday or at least a good week if you don't celebrate! I am looking forward to 2019 and continuing to serve you with
bad puns and allegedlys technology coverage!)
Subject: Processors | December 26, 2018 - 11:52 AM | Jeremy Hellstrom
Tagged: overclock, 200GE, amd, msi, b350, b450, AM4
If you happen to have an MSI B450 or B350 motherboard, get out there and grab the latest UEFI BIOS which updates support for AGESA version 188.8.131.52 as it may be pulled soon. The reason it may not last is because it will let you overclock your Athlon 200GE processor, something which is generally impossible to pull off. TechSpot tried it out successfully on a variety of MSI boards, such as the Gaming Pro Carbon AC and managed to bump the $55 processor from 3.2GHz to 3.8GHz. You won't see a huge increase in performance, though you will see some and it makes for an interesting experiment.
"In an unexpected turn of events, it's now possible to overclock the otherwise-locked $55 Athlon 200GE processor. In what appears to be a slip up by MSI, the component maker has enabled Athlon overclocking with their latest BIOS release across its entire AM4 motherboard lineup."
Here are some more Processor articles from around the web:
- AMD Athlon 200GE @ Guru of 3D
- Battlefield V Multiplayer CPU Benchmark: Ryzen 7 2700X vs. Core i9-9900K @ Techspot
- Intel Core i9-9980XE Extreme Edition Review – It Hertz! @ Kitguru
- Windows Server 2019 vs. Linux vs. FreeBSD Performance On A 2P EPYC Server @ Phoronix
Subject: Processors | December 22, 2018 - 12:02 AM | Tim Verry
Tagged: Zen, ryzen, rx vega, athlon, APU, amd, 240GE, 220GE
Today AMD announced the availability of its budget Zen-based Athlon Processor with Vega Graphics APUs and released details about the Athlon 220GE and Athlon 240GE APUs that complement the Athlon 200GE it talked about back in September.
These Athlon 200-series processors are aimed at the budget and mainstream markets to fill the need for a basic processor for everyday tasks such as browsing the internet, checking email, and doing homework. The APUs utilize a 14nm manufacturing process and pair Zen CPU cores with a Vega-based GPU in a 35 watt power envelope, and are aimed at desktops utilizing the AM4 socket.
The Athlon 200GE, 220GE, and 240GE are all dual core, 4-thread processors with 4MB L3 cache and GPUs with 3 compute units (192 cores) clocked at 1 GHz. They all support dual channel DDR4 2667 MHz memory and have 35W TDPs. Where the Athlon APUs differ is in CPU clockspeeds with the higher numbered models having slightly higher base clock speeds.
|APU Model||Athlon 200GE||Athlon 220GE||Athlon 240GE|
|Cores/Threads||2 / 4||2 / 4||2 / 4|
|Base Freq||3.2 GHz||3.4 GHz||3.5 GHz|
|Graphics Freq||1 GHz||1 GHz||1 GHz|
The Athlon 200GE starts at 3.2 GHz for $54.98 with an additional $10 buying you the 3.4 GHz 220GE and another $10 premium buying the $74.98 Athlon 240GE's 3.5 GHz CPU clocks. The Athlon 220GE seems to be the best value in that respect, because the extra $10 buys you an extra 200 MHz and the jump to the 240GE only gets an extra 100 MHz for the same extra cost. (Keep in mind that these chips are not unlocked.) Then again, if you are on a tight budget where every dollar counts, the 200GE may be what you end up going with so that you can buy better RAM or more storage.
The new chips are available now but it seems retailers aren't quite ready with their listings as while the 200GE is up for sale at Amazon, the 220GE and 240GE are not yet listed online at the time of writing.
The Athlon 200GE-series APUs introduce a new lower-end option that sits below Ryzen 3 at a lower price point for basic desktops doing typical office or home entertainment duties. With a 35W TDP they might also be useful in fanless home theater PCs and game streaming endpoints for gaming on the big screen.
I am also curious whether these chips will be used for by the DIY and enthusiast community as the base for budget (gaming) builds and if they might see the same popularity as the Athlon X4 860K (note: no built-in graphics). I would be interested in the comparison between the 4c/4t 860K ($57) and the 2c/4t 200GE ($55) to see how they stack up with the newer process node and core design. On the other hand, enthusiasts may well be better served with the overclockable Ryzen 3 2200G ($97) if they want a budget Zen-based part that also has its own GPU.
What are your thoughts on the new Athlon APUs?
Subject: Processors | December 19, 2018 - 08:47 PM | Tim Verry
Tagged: Zen+, ryzen mobile, ryzen, rumor, picasso, geekbench, amd
Twitter user APISAK is at it again with more hardware leaks, and this time the rumors surround AMD's next generation mobile 3000U-series "Picasso" APUs which will replace Raven Ridge in 2019. The new APUs were reportedly spotted by APISAK (@TUM_APISAK on Twitter) as reported by Hexus in two HP laptops in 14" and 17" form factors and offer power efficiency and performance improvements over Raven Ridge's CPU cores along with Vega-based graphics. Searching around online and parsing the various conflicting rumors and speculation on Picasso, I think it is most likely that Picasso is 12nm and utilizes Zen+ CPU cores though it remains to be seen how true that is.
Based on previous roadmaps, AMD's APUs have trailed the desktop CPUs in process technology and architecture instead opting to refine the previous generation for mobile rather than operating at its bleeding edge so while 2019 will see Zen 2 architecture-based CPUs and GPUs built on 7nm, APUs in 2019 are likely to stick with 12nm and Zen+ tuned for a mobile power envelope with tweaks to SenseMI and technology like mobile XFR and dynamic power delivery.
In any event, Picasso APUs are rumored to include the Ryzen 3 3200U, Ryzen 3 3300U, and Ryzen 5 3500U based on Geekbench results pages as well as the low-end [Athlon?] 3000U and the high-end Ryzen 5 3700U - according to the source. The 3000U and 3700U are known in name only, but the middle-tier APUs have a bit more information available thanks to Geekbench. The Ryzen 3 3200U is a dual core (four thread) part while the Ryzen 3 3300U and Ryzen 5 3500U are quad core (eight thread) CPUs. All Picasso APUs are rumored to use Vega-based graphics. The dual core APU has the highest base clock at 2.6 Ghz while the 3300U and 3500U start at 2.1 GHz. The Ryzen 5 3700U allegedly clocks from 2.2 GHz to 3.8 GHz and likely has the highest boost clock of the bunch. The parts use the FP5 mobile socket.
|Athlon(?) 3000U||Ryzen 3 3200U||Ryzen 3 3300U||Ryzen 5 3500U||Ryzen 5 3700U||A10-8700P (Carrizo)||Intel Core i5-8359U|
|Cores / Threads||?||2 / 4||4 / 4||4 / 8||4 / 8||2 / 4||4 / 8|
|Base / Boost Clocks||?||2.6 / ? GHz||2.1 / ? GHz||2.1 / ? GHz||2.2 / 3.8 GHz||1.8 / 3.19 GHz||1.9 / 3.59 GHz|
|Cache||?||4 MB||4 MB||4 MB||4 MB||2 MB||6 MB|
|Graphics||Vega||Vega 3 6 CU (920 MHz)||Vega 6 6 CU (1.2 GHz)||Vega 8 8 CU (1.2 GHz)||Vega||R6 6 CUs (GCN 1.2)||UHD 620 24 CUs (1.1 GHz)|
|Geekbench Single Core||?||3467||3654||3870||?||2113||4215|
|Geekbench Multi Core||?||6735||9686||11284||?||4328||12768|
Looking at the Geekbench results (which you should take with a grain of salt and as just an approximation because final scores would depend on the platform, cooling, and how it ends up clocking within its power envelope) it seems that AMD may have a decent chip on its hands that improves the performance over Raven Ridge a bit and significantly over its older Excavator-based pre-Zen designs. A cursory comparison with Kaby Lake shows that AMD is not quite to par in CPU performance (particularly per core but it comes close in multi-core) but offers notably better compute / GPU performance thanks to the Vega graphics. It seems that AMD is closing the gap at least with Zen+.
I am remaining skeptical but optimistic about AMD's Picasso APUs. I am looking forward to more information on the new chips and the devices that will use them. I am hoping that my educated guess is correct with regard to Picasso being 12nm Zen+ or better as rumor is mainly that Picasso is a Raven Ridge successor that offers power and performance tweaks without going into further detail. I expect more information on Picasso (APU) and Matisse (CPU) to come out as soon as next month at CES 2019.
What are your thoughts on Picasso?
Subject: Processors | December 12, 2018 - 09:00 AM | Sebastian Peak
Tagged: xeon, Sunny Cove, processor, intel core, Intel, integrated graphics, iGPU, Foveros, cpu, 3D stacking
Intel’s Architecture Day was held yesterday and brought announcements of three new technologies. Intel shared details of a new 3D stacking technology for logic chips, a brand new CPU architecture for desktop and server, and some surprising developments on the iGPU front. Oh, and they mentioned that whole discrete GPU thing…
3D Stacking for Logic Chips
First we have Foveros, a new 3D packaging technology that follows Intel’s previous EMIB (Embedded Multi-die Interconnect Bridge) 2D packaging technology and enables die-stacking of high-performance logic chips for the first time.
“Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies. Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors for the first time.”
Foveros will allow for a new “chiplet” paradigm, as “I/O, SRAM, and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top”. This new approach would permit design elements to be “mixed and matched”, and allow new device form-factors to be realized as products can be broken up into these smaller chiplets.
The first range of products using this technology are expected to launch in the second half of 2019, beginning with a product that Intel states “will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die,” which Intel says “will enable the combination of world-class performance and power efficiency in a small form factor”.
Intel Sunny Cove Processors - Coming Late 2019
Next up is the announcement of a brand new CPU architecture with Sunny Cove, which will be the basis of Intel’s next generation Core and Xeon processors in 2019. No mention of 10nm was made, so it is unclear if Intel’s planned transition from 14nm is happening with this launch (the last Xeon roadmap showed a 10 nm transition with "Ice Lake" in 2020).
Intel states that Sonny Cove is “designed to increase performance per clock and power efficiency for general purpose computing tasks” with new features included “to accelerate special purpose computing tasks like AI and cryptography”.
Intel provided this list of Sunny Cove’s features:
- Enhanced microarchitecture to execute more operations in parallel.
- New algorithms to reduce latency.
- Increased size of key buffers and caches to optimize data-centric workloads.
- Architectural extensions for specific use cases and algorithms. For example, new performance-boosting instructions for cryptography, such as vector AES and SHA-NI, and other critical use cases like compression and decompression.
Integrated Graphics with 2x Performance
Intel slide image via ComputerBase
Intel did reveal next-gen graphics, though it was a new generation of the company’s integrated graphics announced at the event. The update is nonetheless significant, with the upcoming Gen11 integrated GPU “expected to double the computing performance-per-clock compared to Intel Gen9 graphics” thanks to a huge increase in Execution Units, from 24 EUs with Gen9 to 64 EUs with Gen11. This will provide “>1 TFLOPS performance capability”, according to Intel, who states that the new Gen11 graphics are also expected to feature advanced media encode/decode, supporting “4K video streams and 8K content creation in constrained power envelopes”.
And finally, though hardly a footnote, the new Gen11 graphics will feature Intel Adaptive Sync technology, which was a rumored feature of upcoming discrete GPU products from Intel.
And now for that little part about discrete graphics: At the event Intel simply “reaffirmed its plan to introduce a discrete graphics processor by 2020”. Nothing new here, and this obviously means that we won’t be seeing a new discrete GPU from Intel in 2019 - though the beefed-up Gen11 graphics should provide a much needed boost to Intel’s graphics offering when Sonny Cove launches “late next year”.
Subject: Processors | November 30, 2018 - 06:34 PM | Jeremy Hellstrom
Tagged: Core i5-9600K, overclocking, Intel
For just under $300 and offering decent performance at it's stock clocks of 3.7GHz and 4.6GHz Turbo, the i5-9600K is an attractive chip for many looking to build a new system. However, by overclocking it you can get even more bang for your buck, which is exactly what [H]ard|OCP has been looking into. They attached a RX480 V3 Radiator, and D5 Photon Reservoir/Pump Combo V2 to cool the chip which let them hit 5.25GHz perfectly stable with some noticeable results. See the settings they used as well as some tips in their full review.
"The Intel Core i5-9600K Processor will likely hit the the sweet spot for a lot of desktop PC enthusiasts and gamers. We have a solid 6-Core count with a Turbo Boost clock of 4.6GHz coming in for right around $270. What kind of overclock will the new 9600K CPU support and remain 100% stable?"
Here are some more Processor articles from around the web:
- A Look At Intel’s Core i9-9900K Performance In Linux @ Techgage
- Intel’s 9th Gen Core i9 9900K processor hits 5GHz—just at a price @ Ars Technica
- The Spectre/Meltdown Performance Impact On Linux 4.20, Decimating Benchmarks With New STIBP Overhead @ Phoronix
- The Best CPUs 2018 @ Techspot
Subject: Processors | November 13, 2018 - 03:36 PM | Jeremy Hellstrom
Tagged: x299, Threadripper, skylake-x, Intel, i9-9980XE, i9-7980XE, HEDT, core x, amd, 2990wx
The new ~$2000 i9-9980XE is a refreshed Skylake chip, using Intel's 14-nm++ process, with 18 multithreaded cores running at 3GHz with a Boost clock of 4.4GHz. If you were to lift up the lid, you would find the same Solder Thermal Interface Material we saw in the last few releases so expect some brave soul to run delidding tests at some point in the near future. As it stands now, The Tech Report's overclocking tests had the same results as Ken, with 4.5GHz across all cores being the best they could manage. While the chip does offer new features, many of them are aimed specifically at production tasks and will not benefit your gaming experience.
Check out the performance results here and below the fold.
"Intel is bolstering its Core X high-end desktop CPUs with everything in its bag of tricks, including 14-nm++ process technology, higher clock speeds, larger caches, and solder thermal interface material. We put the Core i9-9980XE to the test to see how those refinements add up against AMD's high-end desktop onslaught."
Here are some more Processor articles from around the web:
- Intel Core i9-9980XE vs AMD Ryzen Threadripper @ [H]ard|OCP
- Intel Core i9-9980XE Extreme Edition Processor Review @ Legit Reviews
- Intel Core i9-9900K @ Techspot
- Raptor Talos II POWER9 Benchmarks Against AMD Threadripper & Intel Core i9 @ Phoronix
- The Best Entry Level Gaming CPU: Athlon 200GE vs. Pentium G5400 vs. Ryzen 3 2200G @ Techspot
Shopping for a CPU in 2018 has been a bit of a moving target. Between the launch of AMD's Ryzen 2000 series processors in the beginning of the year, new AMD Threadripper X and WX-series products, and a consumer CPU refresh from Intel last month, it's been difficult to keep track of.
Now we are rounding out 2018 with new products for the last remaining platform that hasn't seen a refresh this year, Intel's Core X-series of processors, namely the Intel Core i9-9980XE.
Join us, as we talk about Intel's new 9th-generation Core X-series processors, and the current landscape of HEDT desktop platforms.
|Core i9-9980XE||Core i9-7980XE||Threadripper 2990WX||Threadripper 2970WX||Threadripper 2950X||Threadripper 2920X|
|Base Clock||3.0 GHz||2.6 GHz||3.0 GHz||3.0 GHz||3.5 GHz||3.5 GHz|
|Boost Clock||4.4 GHz||4.2 GHz||4.2 GHz||4.2 GHz||4.4 GHz||4.3 GHz|
|L3 Cache||24.75MB||24.75MB||64MB||64MB||32MB||32 MB|
|Memory Support||DDR4-2666 (Quad-Channel)||DDR4-2666 (Quad-Channel)||DDR4-2933 (Quad-Channel)||DDR4-2933 (Quad-Channel)||DDR4-2933 (Quad-Channel)||DDR4-2933 (Quad-Channel)|
|TDP||165 Watts||165 Watts||250 Watts||250 Watts||180 Watts||180 Watts|
Subject: Processors | November 7, 2018 - 11:00 PM | Tim Verry
Tagged: Zen 2, rome, PCI-e 4, Infinity Fabric, EPYC, ddr4, amd, 7nm
In addition to AMD's reveal of 7nm GPUs used in its Radeon Instinct MI60 and MI50 graphics cards (aimed at machine learning and other HPC acceleration), the company teased a few morsels of information on its 7nm CPUs. Specifically, AMD teased attendees of its New Horizon event with information on its 7nm "Rome" EPYC processors based on the new Zen 2 architecture.
Tom's Hardware spotted the upcoming Epyc processor at AMD's New Horizon event.
The codenamed "Rome" EPYC processors will utilize a MCM design like its EPYC and Threadripper predecessors, but increases the number of CPU dies from four to eight (with each chiplet containing eight cores with two CCXs) and adds a new 14nm I/O die that sits in the center of processor that consolidates memory and I/O channels to help even-out the latency among all the cores of the various dies. This new approach allows each chip to directly access up to eight channels of DDR4 memory (up to 4TB) and will no longer have to send requests to neighboring dies connected to memory which was the case with, for example, Threadripper 2. The I/O die is speculated by TechPowerUp to also be responsible for other I/O duties such as PCI-E 4.0 and the PCH communication duties previously integrated into each die.
"Rome" EPYC processors with up to 64 cores (128 threads) are expected to launch next year with AMD already sampling processors to its biggest enterprise clients. The new Zen 2-based processors should work with existing Naples and future Milan server platforms. EPYC will feature from four to up to eight 7nm Zen 2 dies connected via Infinity Fabric to a 14nm I/O die.
AMD CEO Lisa Su holding up "Rome" EPYC CPU during press conference earlier this year.
The new 7nm Zen 2 CPU dies are much smaller than the dies of previous generation parts (even 12nm Zen+). AMD has not provided full details on the changes it has made with the new Zen 2 architecutre, but it has apparently heavily tweaked the front end operations (branch prediction, pre-fetching) and increased cache sizes as well as doubling the size of the FPUs to 256-bit. The architectural improvements alogn with the die shrink should allow AMD to show off some respectable IPC improvements and I am interested to see details and how Zen 2 will shake out.