Subject: Processors | November 16, 2017 - 04:38 PM | Jeremy Hellstrom
Tagged: amd, EPYC, 7401P
AMD's new EPYC server chips range in price from around $4000 for the top end 32 core 7601 to around $500 for the 8 core 7251 with the $1000, 24 core EPYC 7401P sitting towards the middle of this family. Phoronix have tested quite a few of these processors, today focusing on the aforementioned 7401P, testing it against several other EPYC processors as well as several Xeon E3 and E5 models as well as a Gold and a Silver. To say that AMD showed up Intel in multithreaded performance is somewhat of an understatement as you can see in their benchmarks. Indeed in many cases you need around $5000 worth of Intel CPU to compete with the 7401P and even then Intel lags behind in many tests. The only shortcoming of the 7401P is that it can only be run in single socket configurations, not that you necessarily need two of these chips!
"We've been looking at the interesting AMD EPYC server processors recently from the high-end EPYC 7601 to the cheapest EPYC 7251 at under $500 as well as the EPYC 7351P that offers 16 cores / 32 threads for only about $750. The latest EPYC processor for testing at Phoronix has been the EPYC 7401P, a 24 core / 48 thread part that is slated to retail for around $1075 USD."
Here are some more Processor articles from around the web:
- AMD EPYC 7551 @ Phoronix
- Core i5-8400 vs. Overclocked Ryzen 5 1600 @ TechSpot
- In Hindsight: Some of the Worst CPU/GPUs Purchases of 2017 @ TechSpot
- The Latest In Our Massive Linux Benchmarking Setup - November 2017 @ Phoronix
- i7-2600K vs. i7-8700K - Is Upgrading Worthwhile? @ Hardware Canucks
Subject: General Tech, Processors | November 9, 2017 - 02:30 PM | Ken Addison
Tagged: Skull Canyon, nuc, kaby lake-g, Intel, Hades Canyon VR, Hades Canyon, EMIL, amd
Hot on the heels of Intel's announcement of new mobile-focused CPUs integrating AMD Radeon graphics, we have our first glimpse at a real-world design using this new chip.
Posted on the infamous Chinese tech forum, Chiphell earlier today, this photo appears to be a small form factor PC design integrating the new Kaby Lake-G CPU and GPU solution.
Looking at the standard size components on the board like the Samsung M.2 SSD and the DDR4 SODIMM memory modules, we can start to get a better idea of the actual size of the Kaby Lake-G module.
Additionally, we get our first look at the type of power delivery infrastructure that devices with Kaby Lake-G are going to require. It's impressive how small the motherboard is taking into account all of the power phases needed to feed the CPU, GPU, and HBM 2 memory.
Looking back at the leaked NUC roadmap from September, the picture starts to become more clear. While the "Hades Canyon" NUCs on this roadmap threw us for a loop when we first saw it months ago, it's now clear that they are referencing the new Kaby Lake-G line of products. The plethora of IO options from the roadmap, including dual Gigabit Ethernet and 2 Thunderbolt 3 ports also seem to match closely with the leaked NUC photo above.
Using this information we also now have a better idea of the thermal and power requirements for Kaby Lake-G. The base "Hades Canyon" NUC is listed with a 65W processor, while the "Hades Canyon VR" is listed with as a 100W part. This means that devices retain the same levels of CPU performance from the existing Kaby Lake-H Quad Core mobile CPUs which clock in at 35W, plus roughly 30 or 65W of graphics performance.
These leaked 3DMark scores might give us an idea of the performance of the Hades Canyon VR NUC.
One thing is clear; Hades Canyon will be the highest power NUC Intel has ever produced, surpassing the 45W Skull Canyon. Considering the already unusual for a NUC footprint of Skull Canyon, I'm interested to see the final form of Hades Canyon as well as the performance it brings!
With what looks to be a first half 2018 release date on the roadmap, it seems likely that we could see this NUC or other similar devices being shown off at CES in January. Stay tuned for more continuing coverage of Intel's Kaby Lake-G and upcoming devices featuring it!
Subject: Processors | November 8, 2017 - 02:03 PM | Ryan Shrout
Tagged: qualcomm, centriq 2400, centriq, arm
At an event in San Jose on Wednesday, Qualcomm and partners officially announced that its Centriq 2400 server processor based on the Arm-architecture was shipping to commercial clients. This launch is of note as it becomes the highest-profile and most partner-lauded Arm-based server CPU and platform to be released after years of buildup and excitement around several similar products. The Centriq is built specifically for enterprise cloud workloads with an emphasis on high core count and high throughput and will compete against Intel’s Xeon Scalable and AMD’s new EPYC platforms.
Paul Jacobs shows Qualcomm Centriq to press and analysts
Built on the same 10nm process technology from Samsung that gave rise to the Snapdragon 835, the Centriq 2400 becomes the first server processor in that particular node. While Qualcomm and Samsung tout that as a significant selling point, on its own it doesn’t hold much value. Where it does come into play and impact the product position with the resulting power efficiency it brings to the table. Qualcomm claims that the Centriq 2400 will “offer exceptional performance-per-watt and performance-per dollar” compared to the competition server options.
The raw specifications and capabilities of the Centriq 2400 are impressive.
|Centriq 2460||Centriq 2452||Centriq 2434|
|Process Tech||10nm (Samsung)||10nm (Samsung)||10nm (Samsung)|
|Base Clock||2.2 GHz||2.2 GHz||2.3 GHz|
|Max Clock||2.6 GHz||2.6 GHz||2.5 GHz|
|Memory Speeds||2667 MHz
|Cache||24MB L2, split
|23MB L2, split
|20MB L2, split
|PCIe||32 lanes PCIe 3.0||32 lanes PCIe 3.0||32 lanes PCIe 3.0|
Built on 18 billion transistors a die area of just 398mm2, the SoC holds 48 high-performance 64-bit cores running at frequencies as high as 2.6 GHz. (Interestingly, this appears to be about the same peak clock rate of all the Snapdragon processor cores we have seen on consumer products.) The cores are interconnected by a bi-directional ring bus that is reminiscent of the integration Intel used on its Core processor family up until Skylake-SP was brought to market. The bus supports 250 GB/s of aggregate bandwidth and Qualcomm claims that this will alleviate any concern over congestion bottlenecks, even with the CPU cores under full load.
The caching system provides 512KB of L2 cache for every pair of CPU cores, essentially organizing them into dual-core blocks. 60MB of L3 cache provides core-to-core communications and the cache is physically divided around the die for on-average faster access. A 6-channel DDR4 memory systems, with unknown peak frequency, supports a total of 768GB of capacity.
Connectivity is supplied with 32 lanes of PCIe 3.0 and up to 6 PCIe devices.
As you should expect, the Centriq 2400 supports the ARM TrustZone secure operating environment and hypervisors for virtualized environments. With this many cores on a single chip, it seems likely one of the key use cases for the server CPU.
Maybe most impressive is the power requirements of the Centriq 2400. It can offer this level of performance and connectivity with just 120 watts of power.
With a price of $1995 for the Centriq 2460, Qualcomm claims that it can offer “4X better performance per dollar and up to 45% better performance per watt versus Intel’s highest performance Skylake processor, the Intel Xeon Platinum 8180.” That’s no small claim. The 8180 is a 28-core/56-thread CPU with a peak frequency of 3.8 GHz and a TDP of 205 watts and a cost of $10,000 (not a typo).
Qualcomm had performance metrics from industry standard SPECint measurements, in both raw single thread configurations as well as performance per dollar and per watt. I will have more on the performance story of Centriq later this week.
More important than simply showing hardware, Qualcomm and several partners on hand at the press event as well as many statements from important vendors like Alibaba, HPE, Google, Microsoft, and Samsung. Present to showcase applications running on the Arm-based server platforms was an impressive list of the key cloud services providers: Alibaba, LinkedIn, Cloudflare, American Megatrends Inc., Arm, Cadence Design Systems, Canonical, Chelsio Communications, Excelero, Hewlett Packard Enterprise, Illumina, MariaDB, Mellanox, Microsoft Azure, MongoDB, Netronome, Packet, Red Hat, ScyllaDB, 6WIND, Samsung, Solarflare, Smartcore, SUSE, Uber, and Xilinx.
The Centriq 2400 series of SoC isn’t perfect for all general-purpose workloads and that is something we have understood from the outset of this venture by Arm and its partners to bring this architecture to the enterprise markets. Qualcomm states that its parts are designed for “highly threaded cloud native applications that are developed as micro-services and deployed for scale-out.” The result is a set of workloads that covers a lot of ground:
- Web front end with HipHop Virtual Machine
- NoSQL databases including MongoDB, Varnish, Scylladb
- Cloud orchestration and automation including Kubernetes, Docker, metal-as-a-service
- Data analytics including Apache Spark
- Deep learning inference
- Network function virtualization
- Video and image processing acceleration
- Multi-core electronic design automation
- High throughput compute bioinformatics
- Neural class networks
- OpenStack Platform
- Scaleout Server SAN with NVMe
- Server-based network offload
I will be diving more into the architecture, system designs, and partner announcements later this week as I think the Qualcomm Centriq 2400 family will have a significant impact on the future of the enterprise server markets.
Subject: Processors | November 6, 2017 - 02:00 PM | Josh Walrath
Tagged: radeon, Polaris, mobile, kaby lake, interposer, Intel, HBM2, gaming, EMIB, apple, amd, 8th generation core
In what is probably considered one of the worst kept secrets in the industry, Intel has announced a new CPU line for the mobile market that integrates AMD’s Radeon graphics. For the past year or so rumors of such a partnership were freely flowing, but now we finally get confirmation as to how this will be implemented and marketed.
Intel’s record on designing GPUs has been rather pedestrian. While they have kept up with the competition, a slew of small issues and incompatibilities have plagued each generation. Performance is also an issue when trying to compete with AMD’s APUs as well as discrete mobile graphics offerings from both AMD and NVIDIA. Software and driver support is another area where Intel has been unable to compete due largely to economics and the competitions’ decades of experience in this area.
There are many significant issues that have been solved in one fell swoop. Intel has partnered with AMD’s Semi-Custom Group to develop a modern and competent GPU that can be closely connected to the Intel CPU all the while utilizing HBM2 memory to improve overall performance. The packaging of this product utilizes Intel’s EMIB (Embedded Multi-die Interconnect Bridge) tech.
EMIB is an interposer-like technology that integrates silicon bridges into the PCB instead of relying upon a large interposer. This allows a bit more flexibility in layout of the chips as well as lowers the Z height of the package as there is not a large interposer sitting between the chips and the PCB. Just as interposer technology allows the use of chips from different process technologies to work seamlessly together, EMIB provides that same flexibility.
The GPU looks to be based on the Polaris architecture which is a slight step back from AMD’s cutting edge Vega architecture. Polaris does not implement the Infinity Fabric component that Vega does. It is more conventional in terms of data communication. It is a step beyond what AMD has provided for Sony and Microsoft, who each utilize a semi-custom design for the latest console chips. AMD is able to integrate the HBM2 controller that is featured in Vega. Using HBM2 provides a tremendous amount of bandwidth along with power savings as compared to traditional GDDR-5 memory modules. It also saves dramatically on PCB space allowing for smaller form factors.
EMIB provides nearly all of the advantages of the interposer while keeping the optimal z-height of the standard PCB substrate.
Intel did have to do quite a bit of extra work on the power side of the equation. AMD utilizes their latest Infinity Fabric for fine grained power control in their upcoming Raven Ridge based Ryzen APUs. Intel had to modify their current hardware to be able to do much the same work with 3rd party silicon. This is no easy task as the CPU needs to monitor and continually adjust for GPU usage in a variety of scenarios. This type of work takes time and a lot of testing to fine tune as well as the inevitable hardware revisions to get thing to work correctly. This then needs to be balanced by the GPU driver stack which also tends to take control of power usage in mobile scenarios.
This combination of EMIB, Intel Kaby Lake CPU, HBM2, and a current AMD GPU make this a very interesting combination for the mobile and small form factor markets. The EMIB form factor provides very fast interconnect speeds and a smaller footprint due to the integration of HBM2 memory. The mature AMD Radeon software stack for both Windows and macOS environments provides Intel with another feature in which to sell their parts in areas where previously they were not considered. The 8th Gen Kaby Lake CPU provides the very latest CPU design on the new 14nm++ process for greater performance and better power efficiency.
This is one of those rare instances where such cooperation between intense rivals actually improves the situation for both. AMD gets a financial shot in the arm by signing a large and important customer for their Semi-Custom division. The royalty income from this partnership should be more consistent as compared to the console manufacturers due to the seasonality of the console product. This will have a very material effect on AMD’s bottom line for years to come. Intel gets a solid silicon solution with higher performance than they can offer, as well as aforementioned mature software stack for multiple OS. Finally throw in the HBM2 memory support for better power efficiency and a smaller form factor, and it is a clear win for all parties involved.
The PCB savings plus faster interconnects will allow these chips to power smaller form factors with better performance and battery life.
One of the unknowns here is what process node the GPU portion will be manufactured on. We do not know which foundry Intel will use, or if they will stay in-house. Currently TSMC manufactures the latest console SoCs while GLOBALFOUNDRIES handles the latest GPUS from AMD. Initially one would expect Intel to build the GPU in house, but the current rumor is that AMD will work to produce the chips with one of their traditional foundry partners. Once the chip is manufactured then it is sent to Intel to be integrated into their product.
Apple is one of the obvious candidates for this particular form factor and combination of parts. Apple has a long history with Intel on the CPU side and AMD on the GPU side. This product provides all of the solutions Apple needs to manufacture high performance products in smaller form factors. Gaming laptops also get a boost from such a combination that will offer relatively high performance with minimal power increases as well as the smaller form factor.
The potential (leaked) performance of the 8th Gen Intel CPU with Radeon Graphics.
The data above could very well be wrong about the potential performance of this combination. What we see is pretty compelling though. The Intel/AMD product performs like a higher end CPU with discrete GPU combo. It is faster than a NVIDIA GTX 1050 Ti and trails the GTX 1060. It also is significantly faster than a desktop AMD RX 560 part. We can also see that it is going to be much faster than the flagship 15 watt TDP AMD Ryzen 7 2700U. We do not yet know how it compares to the rumored 65 watt TDP Raven Ridge based APUs from AMD that will likely be released next year. What will be fascinating here is how much power the new Intel combination will draw as compared to the discrete solutions utilizing NVIDIA graphics.
To reiterate, this is Intel as a customer for AMD’s Semi-Custom group rather than a licensing agreement between the two companies. They are working hand in hand in developing this solution and then both profiting from it. AMD getting royalties from every Intel package sold that features this technology will have a very positive effect on earnings. Intel gets a cutting edge and competent graphics solution along with the improved software and driver support such a package includes.
Update: We have been informed that AMD is producing the chips and selling them directly to Intel for integration into these new SKUs. There are no royalties or licensing, but the Semi-Custom division should still receive the revenue for these specialized products made only for Intel.
Overview and CPU Performance
When Intel announced their quad-core mobile 8th Generation Core processors in August, I was immediately interested. As a user who gravitates towards "Ultrabook" form-factor notebooks, it seemed like a no-brainer—gaining two additional CPU cores with no power draw increase.
However, the hardware reviewer in me was skeptical. Could this "Kaby Lake Refresh" CPU provide the headroom to fit two more physical cores on a die while maintaining the same 15W TDP? Would this mean that the processor fans would have to run out of control? What about battery life?
Now that we have our hands on our first two notebooks with the i7-8550U in, it's time to take a more in-depth look at Intel's first mobile offerings of the 8th Generation Core family.
A potential game changer?
I thought we were going to be able to make it through the rest of 2017 without seeing AMD launch another family of products. But I was wrong. And that’s a good thing. Today AMD is launching the not-so-cleverly-named Ryzen Processor with Radeon Vega Graphics product line that will bring the new Zen processor architecture and Vega graphics architecture onto a single die for the ultrathin mobile notebook platforms. This is no minor move for them – just as we discussed with the AMD EPYC processor launch, this is a segment that has been utterly dominated by Intel. After all, Intel created the term Ultrabook to target these designs, and though that brand is gone, the thin and light mindset continues to this day.
The claims AMD makes about its Ryzen mobile APU (combination CPU+GPU accelerated processing unit, to use an older AMD term) are not to be made lightly. Right up front in our discussion I was told this is going to be the “world’s fastest for ultrathin” machines. Considering that AMD had previously been unable to even enter those markets with previous products, both due to some technological and business roadblocks, AMD is taking a risk by painting this launch in such a light. Thanks to its ability combine CPU and GPU technology on a single die though, AMD has some flexibility today that simply did not have access to previously.
From the days that AMD first announced the acquisition of ATI graphics, the company has touted the long-term benefits of owning both a high-performance processor and graphics division. By combining the architectures on a single die, they could become greater than the sum of the parts, leveraging new software directions and the oft-discussed HSA (heterogenous systems architecture) that AMD helped create a foundation for. Though the first rounds of APUs were able to hit modest sales, the truth was that AMD’s advantage over Intel’s on the graphics technology front was often overshadowed by the performance and power efficiency advantages that Intel held on the CPU front.
But with the introduction of the first products based on Zen earlier this year, AMD has finally made good on the promises of catching up to Intel in many of the areas where it matters the most. The new from-the-ground-up design resulted in greater than 50% IPC gains, improved area efficiency compared to Intel’s latest Kaby Lake core design, and enormous gains in power efficiency compared to the previous CPU designs. When looking at the new Ryzen-based APU products with Vega built-in, AMD claims that they tower over the 7th generation APUs with up to 200% more CPU performance, 128% more GPU performance, and 58% lower power consumption. Again, these are bold claims, but it gives AMD confidence that it can now target premium designs and form factors with a solution that will meet consumer demands.
AMD is hoping that the release of the Ryzen 7 2700U and Ryzen 5 2500U can finally help turn the tides in the ultrathin notebook market.
|Core i7-8650U||Core i7-8550U||Core i5-8350U||Core i5-8250U||Ryzen 7 2700U||Ryzen 5 2500U|
|Architecture||Kaby Lake Refresh||Kaby Lake Refresh||Kaby Lake Refresh||Kaby Lake Refresh||Zen+Vega||Zen+Vega|
|Base Clock||1.9 GHz||1.8 GHz||1.7 GHz||1.6 GHz||2.2 GHz||2.0 GHz|
|Max Turbo Clock||4.2 GHz||4.0 GHz||3.8 GHz||3.6 GHz||3.8 GHz||3.6 GHz|
|System Bus||DMI3 - 8.0 GT/s||DMI3 - 8.0 GT/s||DMI2 - 6.4 GT/s||DMI2 - 5.0 GT/s||N/A||N/A|
|Graphics||UHD Graphics 620||UHD Graphics 620||UHD Graphics 620||UHD Graphics 620||Vega (10 CUs)||Vega (8 CUs)|
|Max Graphics Clock||1.15 GHz||1.15 GHz||1.1 GHz||1.1 GHz||1.3 GHz||1.1 GHz|
The Ryzen 7 2700U will run 200 MHz higher on the base and boost clocks for the CPU and 200 MHz higher on the peak GPU core clock. Though both systems have 4-cores and 8-threads, the GPU on the 2700U will have two additional CUs / compute units.
Subject: Processors | October 24, 2017 - 02:12 AM | Josh Walrath
Tagged: arm, cortex, mali, PSA, security, TrustZone, Platform Security Architecture, amd, cortex-m, Armv8-m
It is no wonder that device security dominates news. Every aspect of our lives is approaching always connected status. Whether it is a major company forgetting to change a default password or an inexpensive connected webcam that is easily exploitable, security is now more important than ever.
ARM has a pretty good track record in providing solutions to their partners to enable a more secure computing experience in this online world. Their first entry to address this was SecurCore which was introduced in 2000. Later they released their TrustZone in 2003. Eventually that technology made it into multiple products as well as being adopted by 3rd party chip manufacturers.
Today ARM is expanding the program with this PSA announcement. Platform Security Architecture is a suite of technologies that encompasses software, firmware, and hardware. ARM technology has been included in over 100 billion chips shipped since 1991. ARM expects that another 100 billion will be shipped in the next four years. To get a jump on the situation ARM is introducing this comprehensive security architecture to enable robust security features for products from the very low end IoT to the highest performing server chips featuring ARM designs.
PSA is not being rolled out in any single product today. It is a multi-year journey for ARM and its partners and it can be considered a framework to provide enhanced security across a wide variety of products. The first products to be introduced using this technology will be the Armv8-M class of processors. Cortex-M processors with Trusted Firmware running on the Mbed OS will be the start of the program. Eventually it will branch out into other areas, but ARM is focusing much of its energy on the IoT market and ensuring that there is a robust security component to what could eventually scale out to be a trillion connected products.
There are two new hardware components attached to PSA. The first is the CryptoIsland 300 on-die security enclave. It is essentially a second layer of hardware security beyond that of the original TrustZone. The second is the SDC-600. This is a secure debug port that can be enabled and disabled using certificates. This cuts off a major avenue for security issues. These technologies are integrated into the CPUs themselves and are not offered as a 3rd party chip.
If we truly are looking at 1 trillion connected devices over the next 10 years, security is no longer optional. ARM is hoping to get ahead of this issue by being more proactive in developing these technologies and working with their partners to get them implemented. This technology will evolve over time to include more and more products in the ARM portfolio and hopefully will be adopted by their many licensees.
Subject: Processors | October 23, 2017 - 05:22 PM | Jeremy Hellstrom
Tagged: i5-8600K, Intel, delidding, coffee lake
[H]ard|OCP have once again voided a warranty in the goal of better overclocking. The past several generations of Intel chips have sparked debate on the effectiveness of their thermal solutions, prompting numerous users to delid their processor to replace the thermal compound inside to improve cooling performance. With the results of the tests it is clear that the TIM in Coffee Lake is limiting the processor, temperatures decreased by 10C or more at stock and [H] could reach higher stable overclocks once they replaced the TIM that Intel used. Delidding is not for the faint of heart however, many a CPU has met its death during the process so do be aware of that. Let us hope this trend does not continue for much longer.
"We've gotten to spend some quality time with our Intel Core i5-8600K Coffee Lake CPU, and of course we have spent our time finding out just how far we could push the processor's clock under both Air Cooling and Water Cooling. We relid and delid as well. The results look to be very promising for the overclocking enthusiast and gamer."
Here are some more Processor articles from around the web:
- Intel Core i5 8600K @ Guru of 3D
- Intel Core i5-8400 @ TechSpot
- Core i7-8700K, i5-8600K, 8400 vs. Ryzen 7 1800X, R5 1600X, 1500X @ TechSpot
- AMD EPYC 7351P @ Phoronix
- AMD Ryzen 3 1300X & Ryzen 3 1200 Review @ OCC
- AMD EPYC 7251 Provides Great Value At Less Than $500 USD @ Phoronix
Subject: Graphics Cards, Processors | October 16, 2017 - 05:07 PM | Ryan Shrout
Tagged: amd, raven ridge, APU, ryzen 7 2700u, Ryzen 5 2500U, ryzen 7 pro 2700u
Hot on the heels of the HP leak that showed the first AMD Raven Ridge based notebook that may be hitting store shelves later this year, another leak of potential Raven Ridge APU performance is cycling through. The AMD Ryzen 7 2700U with integrated Vega-based graphics architecture, and also rumored to have a ~35-watt TDP, is showing 3DMark11 graphics scores near that of the discrete NVIDIA GeForce MX150.
With a graphics score of 4072, the integrated graphics on the upcoming AMD APU is slightly behind the score of 4570 from the MX150, a difference of 11.5%. Interestingly, the Physics score on the Raven Ridge APU of 6419 is solid as well, and puts an interesting light on the 8th gen KBL-R processors. As you can see in the graph below, from two systems we already have in-house with quad-core parts, CPU performance is going to vary dramatically from one machine to the next depending on the thermal headroom of the physical implementation.
The HP Spectre x360 with the Core i7-8550U and the MX150 GPU is able to generate a Physics score of 8278, well above the leaked result of the Raven Ridge APU. However, when we ran the 3DMark11 on the ASUS Zenbook 3 UX490UA with the same Core i7-8550U, the Physics score was 6627, a 19% drop! Clearly there are configurability shifts that will adjust the performance of the 8th gen Intel parts. We are diving more into this effect in a couple of upcoming reviews.
Though the true power consumption of these Ryzen 7 2700U systems is still up in the air, AMD has claimed for some time that it would have the ability to compete with Intel for the first time in several generations. If these solutions turn out to be in the 35-watt range, which would be at or lower than the typical 15-watt Intel CPU and 25-watt NVIDIA discrete GPU combined, AMD may have a winning combination for mobile performance users to entertain.
Subject: Processors | October 10, 2017 - 06:35 PM | Jeremy Hellstrom
Tagged: Intel, coffee lake, i7 8700k
The Tech Report addresses two questions about Intel's i7-8700K in their latest review, how to keep it running cool and how the multi-core enhancement feature changes that answer. Multi-core enhancement is a BIOS level overclocking feature which allows all cores on Coffee Lake processors to hit the full boost clock instead of only a single core. In this example, a single core could hit 4.7 GHz while the other cores are being limited to 4.3GHz, however with multi-core enhancement enabled that limit is removed and all cores can hit 4.7GHz simultaneously. As with any type of overclock this produces significantly more heat and requires more cooling.
This enhancement means there are two answers to the question about cooling your Coffee. With the enhancement feature disabled you should be just fine with a CM Hyper 212 Evo or equivalent heatsink, however with MCE enabled even a Corsair H115i shows a 90° C package temperature with core temps between 84-90C. Keep this in mind when shopping for parts; it is nice to have all cores running at their full Boost Clock but you will need to be able to cool them or else see throttling as the chip sense Tjunction temps in excess of 100C.
"Intel's Core i7-8700K proved an exceptionally well-rounded chip in our testing, but the company's choice of thermal interface material has left many wondering whether the Coffee Lake flagship will prove a challenge to keep cool. We establish a handy baseline for what might make a chip "difficult" to cool and see whether the Core i7-8700K falls on the wrong side of the line."
Here are some more Processor articles from around the web:
- Intel Core i3-8100 & i3-8350K Review: RIP Ryzen 3? @ Techspot
- Intel Core i3 8100: 3.6GHz Quad-Core With UHD Graphics For Less Than $120 USD @ Phoronix
- Intel Core i3-8350K 4.0 GHz @ TechPowerUp
- Four Cores for Ultrabooks: Core i7-8550U @ TechSpot
- AMD Ryzen 3 1300X Quad-Core @ TechARP