Subject: Processors | February 20, 2019 - 09:59 AM | Sebastian Peak
Tagged: rumor, report, processor, pentium, Intel, G5620, G5600T, G5420T, G5420, G4950, G4930T, G4930, cpu, celeron
The Pentium processor has been around since the end of the 486 era, introduced in 1993 at a startling cost of $878 for the 60 MHz version, and $964 for 66 MHz (when purchased in quantities of 1000, that is). Now Intel is taking Pentium into uncharted waters for 2019, with the Pentium Gold G5620 reaching 4.0 GHz for the first time for a processor bearing the iconic brand.
Image via Tom's Hardware
According to reports from Tom's Hardware and AnandTech the Pentium G5620, listed early by retailers in Europe, is a 2-core / 4-thread part that will apparently be at the top of the new budget desktop CPU lineup. Alongside the Pentium G5620 there will refreshed Pentium and Celeron CPUs, as listed by Tom's Hardware:
"...the other processors listed include the G5420 (3.8 GHz, 2/4), G5600T (3.3 GHz, 2/4), G5420T (3.2 GHz, 2/4), the Celeron G4950 (3.3 GHz, 2/2), the Celeron G4930 (3.2 GHz, 2/2), and the Celeron G4930T (3.0 GHz, 2/2)."
We do not have an Intel announcement yet of course, so no details about architecture, process tech, or official pricing. March or April is the expected timeframe based on the listings, and with no official release dates we can only speculate on actual availability here in the U.S.
Subject: Processors | February 19, 2019 - 02:57 PM | Tim Verry
Tagged: Zen 2, x570, X500, Ryzen 3000, navi, matisse, amd, 7nm
Spotted by HardOCP, Paul from Red Gaming Tech recently shared leaked information from a source with a reputation of being reliable (from past leaks about 7nm GPUs) who claims that AMD will be announcing a plethora of products at Computex in June to setup for the launch of Zen 2-based 7nm "Matisse" Ryzen 3000 desktop processors, X500 series chipset-based motherboards, and 7nm Navi-based consumer gaming graphics cards on July 7th (The 7th for 7nm I guess).
Image via AnandTech
As a refresher, Zen 2 is the next major architectural jump for AMD while also pushing a new smaller process node. AMD has not yet revealed all the details about Zen 2 especially about consumer chips, but the new microarchitecture is said to feature tweaks to the front end that along with clockspeed bumps from the TSMC 7nm process will allow them to realize notable IPC and single threaded performance gains. When talking about EPYC 2 "Rome" server processors (Zen 2 based) AMD hinted at changes to branch prediction and pre-fetching as well as increased cache sizes and larger FPUs (256-bit), for example. The move to 7nm allegedly allows AMD to hit similar power envelopes to Zen+ (12nm) Ryzen 2000 series processors while hitting much higher clockspeeds at up to 5.1 GHz boost on their top-end chip. While mobile chips may strike a finer balance between power usage and performance with the move to 7nm, on the desktop AMD is spending nearly all the power savings on performance (which makes sense). Note that it is still not officially official that AMD is using a scaled down EPYC setup with more than one 7nm (TSMC) CPU die and a separate IO die (14nm Global Foundries), [they only teased a chip at CES with an IO die and a single CPU die] but I am of the opinion that that particular rumor makes more sense than otherwise so am inclined to believe this is the case.
Ryzen 3000 series processors feature an IO chiplet along with what is rumored to be up to two CPU chiplets (image credit: Tom's Hardware).
From previous leaks, Ryzen 3000 is said to cover all the bases from six core Ryzen 3 3300 series chips to midrange eight core Ryzen 5 and on up to 12 and 16 core Ryzen 9 CPUs that move beyond a single CPU die to two 7nm CPU dies that feature eight cores each. In fact, the top end Ryzen 9 3850X is supposedly a 16 core (32 thread) monster of a desktop chip that has a base frequency of 4.3 GHz and can boost up to 5.1 GHz with a 135W TDP (which when overclocked will likely draw dramatically more like we've seen with both AMD and Intel's top end consumer chips) and price tag of around $520 (400 pounds). The Ryzen 7 3700 and 3700X are 12 core (24 thread) models with TDPs of 95W and 105W respectively with the non-x SKU clocked at 3.8 to 4.6 GHz and the 3700X clocked at 4.2 GHz base and 5 GHz boost. The Ryzen 5 3600 and 3600X are the top end single CPU die models (though a 2x single CCX per die chips might be a reality depending on yields) at eight cores and 16 threads. The Ryzen 3 3300 series parts represent the low end which is now interestingly six cores (oh how times have changed!). Perhaps most interesting of the leaked chips are the Ryzen 5 3600G (~$207) and the Ryzen 3 3300G (~$130) though which feature Navi 12 integrated graphics (presumably these processors combine one 7nm CPU die, one 7nm GPU die, and one 14nm IO die) with 15 and 20 CUs respectively.
As for motherboards, in general the new chips will use the AM4 socket and will be compatible with older 300 and 400 series motherboards with a BIOS update though the top end chips may well necessitate a new X570 or other X500 series motherboard with better power delivery especially for enthusiasts planning to attempt stable overclocks.
Unfortunately, on Navi details are still a bit scarce but the new architecture should bring performance enhancements even beyond Radeon VII (Vega on 7nm). Allegedly due to issues with TSMC, Red Gaming Tech's source believes that Navi might be delayed or pushed back beyond the planned mid-summer release date, but we will have to wait and see. As TSMC ramps up its partial EUV enhanced 7nm node it may free up needed production line space of the current 7nm node for AMD (to fight with others over heh) to meet its intended deadline but we will just have to wait and see!
Take these rumors with a grain of salt as usual but it certainly sounds like it is hoing to be an exciting summer for PC hardware! Hopefully more details about Ryzen 3000 and Navi emerge before then though as that's quite a while yet to wait. Of course, Zen 2 APUs are not coming until at least next year and AMD is still not talking Zen 2 Threadripper which may not see release until the fall at the very earliest. I am very interested to see how AMDs chiplet based design fares and how well they are able to scale it across their product stack(s) as well as what Intel's response will be as it presses on with a fine tuned 14nm++ and a less ambitious 10nm node.
- AMD Shows Off Zen 2-Based EPYC "Rome" Server Processor
- Podcast #521 - Zen 2, 7nm Vega, SSD Vulnerabilities, and more!
- Nein, Zeneration 3 is best
Subject: Processors | February 1, 2019 - 04:37 PM | Sebastian Peak
Tagged: xeon, workstation, W-3175X, system integrator, SI, processor, parts, OEM, newegg, Intel, DIY, cpu
In a move that would seem to contradict what we have heard about Intel's new 28-core Xeon W-3175X processor, Newegg currently has it listed as a standalone CPU part for $2977.99.
The official announcement from Intel had only mentioned availability via pre-built workstations from system integrators:
"How You Get It: The Intel Xeon W-3175X processor is available from system integrators that develop purpose-built desktop workstations."
Product page at Newegg.com
Though not available for purchase (yet?), the existence of this product entry in Newegg's system suggests that the DIY community will have access to Intel's most powerful workstation processor after all, and without a markup over the tray price.
Subject: Processors | January 30, 2019 - 08:13 PM | Sebastian Peak
Tagged: xeon, workstation, W-3175X, processor, Intel, cpu
Officially unveiled back in October, Intel's newly-launched Xeon W-3175X processor is now available from system integrators, and it is far more extreme than the Xeon name might indicate.
The Xeon W-3175X in action (image via Intel)
Here is a look at the specs from Intel:
- Base Clock Speed: 3.1 GHz
- Maximum Single Core Turbo Frequency: 4.3 GHz
- Cores/Threads: 28/56
- TDP: 255W
- Intel Smart Cache: 38.5 MB
- Unlocked: Yes
- Platform PCIE Lanes: Up to 68
- Memory Support: Six Channels, DDR4-2666
- Standard RAS Support: Yes
- ECC Support: Yes
- RCP Pricing (USD 1K): $2,999
This unlocked 28-core/56-thread CPU offers a base clock speed of 3.1 GHz and Turbo of up to 4.3 GHz (single-thread), and that level of performance comes with a 255-watt TDP. In fact a special cooler from Asetek was also announced today which was developed with Intel for this CPU.
Image credit: Asetek
And while a $3000 price tag is obviously not going to drive this into mainstream adoption, this processor only being offered through system integrators at this time, and is aimed at the high-end workstation segment. As to performance, there are some day-one reviews out there from GamersNexus, AnandTech, and PC World, among others, and the consensus seems to be that this is an impressive performer, with particular workload the key to performance relative to competing options such as AMD's Threadripper 2990WX (which currently sells for $1730).
Image credit: PC World
We don't have the answers yet about about total platform costs with motherboard pricing currently an unknown, and (more importantly) system integrators the only way to obtain it, but performance in Adobe CS applications alone will likely make this attractive to content creators at the very least.
Subject: Processors | January 6, 2019 - 03:07 PM | Jim Tanous
Tagged: Zen+, vega APU, ryzen mobile, ces2019, athlon, amd
AMD today officially announced its lineup of 2nd generation Ryzen mobile processors, designated Ryzen 3000 Series Mobile Processors. Unlike AMD’s expected 3000-series desktop launch, which will be based on Zen 2, these new mobile variants stick with AMD’s 12nm Zen+ architecture.
Each 15- or 35-watt model features Vega graphics and core/thread counts ranging from 2 cores/4 threads to 4 cores/8 threads. AMD is touting improvements in battery life and overall performance, claiming that the top-end 15-watt part can best the Intel i7-8550U by up to 29 percent in media editing, while the mid-tier 15-watt Ryzen 5 3500U beats its Intel counterpart, the i5-8250U, by up to 14 percent in website loading speed.
|Model||Cores/Threads||TDP||Boost/Base Freq.||Graphics||GPU Cores||Max GPU Freq.|
|AMD Ryzen 7 3750H||4/8||35W||4.0/2.3GHz||Vega||10||1400MHz|
|AMD Ryzen 7 3700U||4/8||15W||4.0/2.3GHz||Vega||10||14000MHz|
|AMD Ryzen 5 3550H||4/8||35W||3.7/2.1GHz||Vega||8||1200MHz|
|AMD Ryzen 5 3500U||4/8||15W||3.7/2.1GHz||Vega||8||1200MHz|
|AMD Ryzen 3 3300U||4/4||15W||3.5/2.1GHz||Vega||5||1200MHz|
|AMD Ryzen 3 3200U||2/4||15W||3.5/2.6GHz||Vega||3||1200MHz|
|AMD Athlon 300U||2/4||15W||3.3/2.4GHz||Vega||3||1000MHz|
|AMD A6-9220C||2/2||6W||2.7/1.8GHz||R5||3 cores
|AMD A4-9120C||2/2||6W||2.4/1.6GHz||R4||3 cores
The initial batch of laptops featuring Ryzen 3000 Series Mobile Processors will be available in the first quarter from partners Acer, ASUS, Dell, HP, Huawei, Lenovo, and Samsung, with additional product launches coming later in the year.
In addition to its flagship Ryzen mobile lineup, AMD is launching a Zen-based Athlon mobile processor, the Athlon 300U, to target entry-level price points. The company has also announced two new 6-watt A-Series chips aimed at the Chromebook market.
Finally, on the software side, AMD announced that starting this quarter, it will provide Radeon Adrenalin driver support to any laptop with a Ryzen processor and integrated Radeon graphics. This will simplify the driver situation for both consumers and manufacturers, as well as give AMD the ability to directly update gamers’ devices for the latest features and game optimizations.
With AMD getting its arguably less-exciting mobile announcements “out of the way” to start CES, this paves the way for the company to make its big desktop-focused announcements during Dr. Lisa Su’s CES keynote on Wednesday.
Subject: Processors | December 31, 2018 - 09:46 PM | Tim Verry
Tagged: SMT, self driving car, cortex A65AE, armv8-a, arm safety ready, arm
Over the holidays I noticed that ARM released information on a new core design aimed at autonomous driving systems. The Cortex-A65AE is part of the company's Automotive Enhanced lineup and follows on the Cortex-A76AE) with its split-lock and other features that are part of ARM's Safety Ready program.
Aimed at processors that will be used in self driving cars, advanced driver assistance systems (ADAS), aviation, and industrial automation, the Cortex-A65AE core design integrates several safety and redundancy features that meet ASIL D specifications which is a hazard and risk assessment test for an ISO standard (26262) focused on road vehicle safety. Processors will be able to have up to eight cores and will support SMT with each physical core able to run two threads (at different exception levels and/or under different OSes). The cores can be run independently for performance or in lock step for redundancy and integrity checking comparing each other's calculation results (Split-Lock and Dual Core Lock Step respectively). Using the simultaneous multithreading, two threads on a physical core and operate in lock step mode with two other threads on a different physical shadow core according to Anandtech.
ARM has not yet released full details about the Cortex-A65AE core but it utilizes a 6A65AE4-bit out of order execution pipeline with the. ARMv8-A. It can be customized to suit the needs of ARM's partners so exact chip specifications will differ, but in general Cortex-A65AE cores can have 16 to 64 KB L1 instruction and data caches, 64 to 256 KB L2 cache, an optional L3 cache up to 4MB. Other features include support for ARM TrustZone, ECC memory, and ACP connections for accelerators. The new cores are built with ARM's DynamIQ technology and are slated to be used in chips built on the 7nm process node.
According to ARM, Cortex-A65AE cores are 70% faster in integer performance per core and offer up to 3.5 times the memory throughput and six times the read bandwidth for ACP accelerators versus the existing Cortex-A53 cores. The notable performance jump is likely the result of a combination of moving to a smaller process node, the addition of SMT, and architectural improvements and cache and inter-chip routing optimizations.
ARM is positioning the Cortex-A65AE as complementary to the Cortex-A76AE which is to say that the new core is not a direct replacement for it. While the Cortex-A76AE is high performance, the A65AE is high throughput and both cores reportedly have their place in future ADAS and self-driving cars. The Cortex-A65AE cores can be clustered together to do the initial processing and sensor fusion calculations from all of the inputs from cameras, radar, lidar, and other hardware. From there, clusters including Cortex A76AE chips (or a mix of the two) along with other accelerators can be responsible for making the decisions based on the sensor information. How well it works in practice and how this heterogenous setup will compare to competing offerings from NVIDIA, Intel/MobileEye, and others remains to be seen. I am all for the self-driving car future though so the more competition and developments in that space is always nice to see even if it's still a ways off yet!
The Cortex-A65AE being the first Cortex-A core to feature multithreading is also interesting and I am very curious if we will see that capability expanded to other ARM processors outside of the AE series. While SMT may not be worth it for mobile devices like smartphones and even tablets, perhaps future ARM-powered Always Connecred Windows notebook PCs will use processors with SMT capable cores as it would be easier to justify the extra cost in power and size to include multithreading.
What are your thoughts?
(PS I hope everyone had a safe holiday or at least a good week if you don't celebrate! I am looking forward to 2019 and continuing to serve you with
bad puns and allegedlys technology coverage!)
Subject: Processors | December 26, 2018 - 11:52 AM | Jeremy Hellstrom
Tagged: overclock, 200GE, amd, msi, b350, b450, AM4
If you happen to have an MSI B450 or B350 motherboard, get out there and grab the latest UEFI BIOS which updates support for AGESA version 126.96.36.199 as it may be pulled soon. The reason it may not last is because it will let you overclock your Athlon 200GE processor, something which is generally impossible to pull off. TechSpot tried it out successfully on a variety of MSI boards, such as the Gaming Pro Carbon AC and managed to bump the $55 processor from 3.2GHz to 3.8GHz. You won't see a huge increase in performance, though you will see some and it makes for an interesting experiment.
"In an unexpected turn of events, it's now possible to overclock the otherwise-locked $55 Athlon 200GE processor. In what appears to be a slip up by MSI, the component maker has enabled Athlon overclocking with their latest BIOS release across its entire AM4 motherboard lineup."
Here are some more Processor articles from around the web:
- AMD Athlon 200GE @ Guru of 3D
- Battlefield V Multiplayer CPU Benchmark: Ryzen 7 2700X vs. Core i9-9900K @ Techspot
- Intel Core i9-9980XE Extreme Edition Review – It Hertz! @ Kitguru
- Windows Server 2019 vs. Linux vs. FreeBSD Performance On A 2P EPYC Server @ Phoronix
Subject: Processors | December 22, 2018 - 12:02 AM | Tim Verry
Tagged: Zen, ryzen, rx vega, athlon, APU, amd, 240GE, 220GE
Today AMD announced the availability of its budget Zen-based Athlon Processor with Vega Graphics APUs and released details about the Athlon 220GE and Athlon 240GE APUs that complement the Athlon 200GE it talked about back in September.
These Athlon 200-series processors are aimed at the budget and mainstream markets to fill the need for a basic processor for everyday tasks such as browsing the internet, checking email, and doing homework. The APUs utilize a 14nm manufacturing process and pair Zen CPU cores with a Vega-based GPU in a 35 watt power envelope, and are aimed at desktops utilizing the AM4 socket.
The Athlon 200GE, 220GE, and 240GE are all dual core, 4-thread processors with 4MB L3 cache and GPUs with 3 compute units (192 cores) clocked at 1 GHz. They all support dual channel DDR4 2667 MHz memory and have 35W TDPs. Where the Athlon APUs differ is in CPU clockspeeds with the higher numbered models having slightly higher base clock speeds.
|APU Model||Athlon 200GE||Athlon 220GE||Athlon 240GE|
|Cores/Threads||2 / 4||2 / 4||2 / 4|
|Base Freq||3.2 GHz||3.4 GHz||3.5 GHz|
|Graphics Freq||1 GHz||1 GHz||1 GHz|
The Athlon 200GE starts at 3.2 GHz for $54.98 with an additional $10 buying you the 3.4 GHz 220GE and another $10 premium buying the $74.98 Athlon 240GE's 3.5 GHz CPU clocks. The Athlon 220GE seems to be the best value in that respect, because the extra $10 buys you an extra 200 MHz and the jump to the 240GE only gets an extra 100 MHz for the same extra cost. (Keep in mind that these chips are not unlocked.) Then again, if you are on a tight budget where every dollar counts, the 200GE may be what you end up going with so that you can buy better RAM or more storage.
The new chips are available now but it seems retailers aren't quite ready with their listings as while the 200GE is up for sale at Amazon, the 220GE and 240GE are not yet listed online at the time of writing.
The Athlon 200GE-series APUs introduce a new lower-end option that sits below Ryzen 3 at a lower price point for basic desktops doing typical office or home entertainment duties. With a 35W TDP they might also be useful in fanless home theater PCs and game streaming endpoints for gaming on the big screen.
I am also curious whether these chips will be used for by the DIY and enthusiast community as the base for budget (gaming) builds and if they might see the same popularity as the Athlon X4 860K (note: no built-in graphics). I would be interested in the comparison between the 4c/4t 860K ($57) and the 2c/4t 200GE ($55) to see how they stack up with the newer process node and core design. On the other hand, enthusiasts may well be better served with the overclockable Ryzen 3 2200G ($97) if they want a budget Zen-based part that also has its own GPU.
What are your thoughts on the new Athlon APUs?
Subject: Processors | December 19, 2018 - 08:47 PM | Tim Verry
Tagged: Zen+, ryzen mobile, ryzen, rumor, picasso, geekbench, amd
Twitter user APISAK is at it again with more hardware leaks, and this time the rumors surround AMD's next generation mobile 3000U-series "Picasso" APUs which will replace Raven Ridge in 2019. The new APUs were reportedly spotted by APISAK (@TUM_APISAK on Twitter) as reported by Hexus in two HP laptops in 14" and 17" form factors and offer power efficiency and performance improvements over Raven Ridge's CPU cores along with Vega-based graphics. Searching around online and parsing the various conflicting rumors and speculation on Picasso, I think it is most likely that Picasso is 12nm and utilizes Zen+ CPU cores though it remains to be seen how true that is.
Based on previous roadmaps, AMD's APUs have trailed the desktop CPUs in process technology and architecture instead opting to refine the previous generation for mobile rather than operating at its bleeding edge so while 2019 will see Zen 2 architecture-based CPUs and GPUs built on 7nm, APUs in 2019 are likely to stick with 12nm and Zen+ tuned for a mobile power envelope with tweaks to SenseMI and technology like mobile XFR and dynamic power delivery.
In any event, Picasso APUs are rumored to include the Ryzen 3 3200U, Ryzen 3 3300U, and Ryzen 5 3500U based on Geekbench results pages as well as the low-end [Athlon?] 3000U and the high-end Ryzen 5 3700U - according to the source. The 3000U and 3700U are known in name only, but the middle-tier APUs have a bit more information available thanks to Geekbench. The Ryzen 3 3200U is a dual core (four thread) part while the Ryzen 3 3300U and Ryzen 5 3500U are quad core (eight thread) CPUs. All Picasso APUs are rumored to use Vega-based graphics. The dual core APU has the highest base clock at 2.6 Ghz while the 3300U and 3500U start at 2.1 GHz. The Ryzen 5 3700U allegedly clocks from 2.2 GHz to 3.8 GHz and likely has the highest boost clock of the bunch. The parts use the FP5 mobile socket.
|Athlon(?) 3000U||Ryzen 3 3200U||Ryzen 3 3300U||Ryzen 5 3500U||Ryzen 5 3700U||A10-8700P (Carrizo)||Intel Core i5-8359U|
|Cores / Threads||?||2 / 4||4 / 4||4 / 8||4 / 8||2 / 4||4 / 8|
|Base / Boost Clocks||?||2.6 / ? GHz||2.1 / ? GHz||2.1 / ? GHz||2.2 / 3.8 GHz||1.8 / 3.19 GHz||1.9 / 3.59 GHz|
|Cache||?||4 MB||4 MB||4 MB||4 MB||2 MB||6 MB|
|Graphics||Vega||Vega 3 6 CU (920 MHz)||Vega 6 6 CU (1.2 GHz)||Vega 8 8 CU (1.2 GHz)||Vega||R6 6 CUs (GCN 1.2)||UHD 620 24 CUs (1.1 GHz)|
|Geekbench Single Core||?||3467||3654||3870||?||2113||4215|
|Geekbench Multi Core||?||6735||9686||11284||?||4328||12768|
Looking at the Geekbench results (which you should take with a grain of salt and as just an approximation because final scores would depend on the platform, cooling, and how it ends up clocking within its power envelope) it seems that AMD may have a decent chip on its hands that improves the performance over Raven Ridge a bit and significantly over its older Excavator-based pre-Zen designs. A cursory comparison with Kaby Lake shows that AMD is not quite to par in CPU performance (particularly per core but it comes close in multi-core) but offers notably better compute / GPU performance thanks to the Vega graphics. It seems that AMD is closing the gap at least with Zen+.
I am remaining skeptical but optimistic about AMD's Picasso APUs. I am looking forward to more information on the new chips and the devices that will use them. I am hoping that my educated guess is correct with regard to Picasso being 12nm Zen+ or better as rumor is mainly that Picasso is a Raven Ridge successor that offers power and performance tweaks without going into further detail. I expect more information on Picasso (APU) and Matisse (CPU) to come out as soon as next month at CES 2019.
What are your thoughts on Picasso?
Subject: Processors | December 12, 2018 - 09:00 AM | Sebastian Peak
Tagged: xeon, Sunny Cove, processor, intel core, Intel, integrated graphics, iGPU, Foveros, cpu, 3D stacking
Intel’s Architecture Day was held yesterday and brought announcements of three new technologies. Intel shared details of a new 3D stacking technology for logic chips, a brand new CPU architecture for desktop and server, and some surprising developments on the iGPU front. Oh, and they mentioned that whole discrete GPU thing…
3D Stacking for Logic Chips
First we have Foveros, a new 3D packaging technology that follows Intel’s previous EMIB (Embedded Multi-die Interconnect Bridge) 2D packaging technology and enables die-stacking of high-performance logic chips for the first time.
“Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies. Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors for the first time.”
Foveros will allow for a new “chiplet” paradigm, as “I/O, SRAM, and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top”. This new approach would permit design elements to be “mixed and matched”, and allow new device form-factors to be realized as products can be broken up into these smaller chiplets.
The first range of products using this technology are expected to launch in the second half of 2019, beginning with a product that Intel states “will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die,” which Intel says “will enable the combination of world-class performance and power efficiency in a small form factor”.
Intel Sunny Cove Processors - Coming Late 2019
Next up is the announcement of a brand new CPU architecture with Sunny Cove, which will be the basis of Intel’s next generation Core and Xeon processors in 2019. No mention of 10nm was made, so it is unclear if Intel’s planned transition from 14nm is happening with this launch (the last Xeon roadmap showed a 10 nm transition with "Ice Lake" in 2020).
Intel states that Sonny Cove is “designed to increase performance per clock and power efficiency for general purpose computing tasks” with new features included “to accelerate special purpose computing tasks like AI and cryptography”.
Intel provided this list of Sunny Cove’s features:
- Enhanced microarchitecture to execute more operations in parallel.
- New algorithms to reduce latency.
- Increased size of key buffers and caches to optimize data-centric workloads.
- Architectural extensions for specific use cases and algorithms. For example, new performance-boosting instructions for cryptography, such as vector AES and SHA-NI, and other critical use cases like compression and decompression.
Integrated Graphics with 2x Performance
Intel slide image via ComputerBase
Intel did reveal next-gen graphics, though it was a new generation of the company’s integrated graphics announced at the event. The update is nonetheless significant, with the upcoming Gen11 integrated GPU “expected to double the computing performance-per-clock compared to Intel Gen9 graphics” thanks to a huge increase in Execution Units, from 24 EUs with Gen9 to 64 EUs with Gen11. This will provide “>1 TFLOPS performance capability”, according to Intel, who states that the new Gen11 graphics are also expected to feature advanced media encode/decode, supporting “4K video streams and 8K content creation in constrained power envelopes”.
And finally, though hardly a footnote, the new Gen11 graphics will feature Intel Adaptive Sync technology, which was a rumored feature of upcoming discrete GPU products from Intel.
And now for that little part about discrete graphics: At the event Intel simply “reaffirmed its plan to introduce a discrete graphics processor by 2020”. Nothing new here, and this obviously means that we won’t be seeing a new discrete GPU from Intel in 2019 - though the beefed-up Gen11 graphics should provide a much needed boost to Intel’s graphics offering when Sonny Cove launches “late next year”.