AMD Announces Availability of Athlon Processors With Vega Graphics APUs

Subject: Processors | December 22, 2018 - 12:02 AM |
Tagged: Zen, ryzen, rx vega, athlon, APU, amd, 240GE, 220GE

Today AMD announced the availability of its budget Zen-based Athlon Processor with Vega Graphics APUs and released details about the Athlon 220GE and Athlon 240GE APUs that complement the Athlon 200GE it talked about back in September.

AMD Athlon Processor With Radeon Vega Graphics_APU.png

These Athlon 200-series processors are aimed at the budget and mainstream markets to fill the need for a basic processor for everyday tasks such as browsing the internet, checking email, and doing homework. The APUs utilize a 14nm manufacturing process and pair Zen CPU cores with a Vega-based GPU in a 35 watt power envelope, and are aimed at desktops utilizing the AM4 socket.

The Athlon 200GE, 220GE, and 240GE are all dual core, 4-thread processors with 4MB L3 cache and GPUs with 3 compute units (192 cores) clocked at 1 GHz. They all support dual channel DDR4 2667 MHz memory and have 35W TDPs. Where the Athlon APUs differ is in CPU clockspeeds with the higher numbered models having slightly higher base clock speeds.

APU Model Athlon 200GE Athlon 220GE Athlon 240GE
Cores/Threads 2 / 4 2 / 4 2 / 4
Base Freq 3.2 GHz 3.4 GHz 3.5 GHz
Graphics CUs 3 3 3
Graphics Freq 1 GHz 1 GHz 1 GHz
L3 Cache 4MB 4MB 4MB
TDP 35W 35W 35W
Pricing (SEP) $55 $65 $75

The Athlon 200GE starts at 3.2 GHz for $54.98 with an additional $10 buying you the 3.4 GHz 220GE and another $10 premium buying the $74.98 Athlon 240GE's 3.5 GHz CPU clocks. The Athlon 220GE seems to be the best value in that respect, because the extra $10 buys you an extra 200 MHz and the jump to the 240GE only gets an extra 100 MHz for the same extra cost. (Keep in mind that these chips are not unlocked.) Then again, if you are on a tight budget where every dollar counts, the 200GE may be what you end up going with so that you can buy better RAM or more storage.

The new chips are available now but it seems retailers aren't quite ready with their listings as while the 200GE is up for sale at Amazon, the 220GE and 240GE are not yet listed online at the time of writing.

The Athlon 200GE-series APUs introduce a new lower-end option that sits below Ryzen 3 at a lower price point for basic desktops doing typical office or home entertainment duties. With a 35W TDP they might also be useful in fanless home theater PCs and game streaming endpoints for gaming on the big screen.

I am also curious whether these chips will be used for by the DIY and enthusiast community as the base for budget (gaming) builds and if they might see the same popularity as the Athlon X4 860K (note: no built-in graphics). I would be interested in the comparison between the 4c/4t 860K ($57) and the 2c/4t 200GE ($55) to see how they stack up with the newer process node and core design. On the other hand, enthusiasts may well be better served with the overclockable Ryzen 3 2200G ($97) if they want a budget Zen-based part that also has its own GPU.

What are your thoughts on the new Athlon APUs?

Related reading:

Source: AMD

AMD Ryzen Mobile Picasso APUs Spotted in Benchmark Results

Subject: Processors | December 19, 2018 - 08:47 PM |
Tagged: Zen+, ryzen mobile, ryzen, rumor, picasso, geekbench, amd

Twitter user APISAK is at it again with more hardware leaks, and this time the rumors surround AMD's next generation mobile 3000U-series "Picasso" APUs which will replace Raven Ridge in 2019. The new APUs were reportedly spotted by APISAK (@TUM_APISAK on Twitter) as reported by Hexus in two HP laptops in 14" and 17" form factors and offer power efficiency and performance improvements over Raven Ridge's CPU cores along with Vega-based graphics. Searching around online and parsing the various conflicting rumors and speculation on Picasso, I think it is most likely that Picasso is 12nm and utilizes Zen+ CPU cores though it remains to be seen how true that is.

Ryzen Mobile AMD APUs.jpg

Based on previous roadmaps, AMD's APUs have trailed the desktop CPUs in process technology and architecture instead opting to refine the previous generation for mobile rather than operating at its bleeding edge so while 2019 will see Zen 2 architecture-based CPUs and GPUs built on 7nm, APUs in 2019 are likely to stick with 12nm and Zen+ tuned for a mobile power envelope with tweaks to SenseMI and technology like mobile XFR and dynamic power delivery.

In any event, Picasso APUs are rumored to include the Ryzen 3 3200U, Ryzen 3 3300U, and Ryzen 5 3500U based on Geekbench results pages as well as the low-end [Athlon?] 3000U and the high-end Ryzen 5 3700U - according to the source. The 3000U and 3700U are known in name only, but the middle-tier APUs have a bit more information available thanks to Geekbench. The Ryzen 3 3200U is a dual core (four thread) part while the Ryzen 3 3300U and Ryzen 5 3500U are quad core (eight thread) CPUs. All Picasso APUs are rumored to use Vega-based graphics. The dual core APU has the highest base clock at 2.6 Ghz while the 3300U and 3500U start at 2.1 GHz. The Ryzen 5 3700U allegedly clocks from 2.2 GHz to 3.8 GHz and likely has the highest boost clock of the bunch. The parts use the FP5 mobile socket.

Picasso APU Geekbench scores based on HP Laptop 17-ca1xxx except 3200U Compute which is from HP Laptop 14-cm1xxx. Carrizo APU scores based on HP Pavilion. The i5-8359U CPU scores are from. HP Elitebook X360 and Compute score from Dell Latitude 7490.
  Athlon(?) 3000U Ryzen 3 3200U Ryzen 3 3300U Ryzen 5 3500U Ryzen 5 3700U A10-8700P (Carrizo) Intel Core i5-8359U
Cores / Threads ? 2 / 4 4 / 4 4 / 8 4 / 8 2 / 4 4 / 8
Base / Boost Clocks ? 2.6 / ? GHz 2.1 / ? GHz 2.1 / ? GHz 2.2 / 3.8 GHz 1.8 / 3.19 GHz 1.9 / 3.59 GHz
Cache ? 4 MB 4 MB 4 MB 4 MB 2 MB 6 MB
Graphics Vega Vega 3 6 CU (920 MHz) Vega 6 6 CU (1.2 GHz) Vega 8 8 CU (1.2 GHz) Vega R6 6 CUs (GCN 1.2) UHD 620 24 CUs (1.1 GHz)
Socket FP5/AM4 FP5/AM4 FP5/AM4 FP5/AM4 FP5/AM4 FP4 1356 FCBGA
Geekbench Single Core ? 3467 3654 3870 ? 2113 4215
Geekbench Multi Core ? 6735 9686 11284 ? 4328 12768
Geekbench Graphics ? 23698 26540 31947 ? 20009 16279

Looking at the Geekbench results (which you should take with a grain of salt and as just an approximation because final scores would depend on the platform, cooling, and how it ends up clocking within its power envelope) it seems that AMD may have a decent chip on its hands that improves the performance over Raven Ridge a bit and significantly over its older Excavator-based pre-Zen designs. A cursory comparison with Kaby Lake shows that AMD is not quite to par in CPU performance (particularly per core but it comes close in multi-core) but offers notably better compute / GPU performance thanks to the Vega graphics. It seems that AMD is closing the gap at least with Zen+.

I am remaining skeptical but optimistic about AMD's Picasso APUs. I am looking forward to more information on the new chips and the devices that will use them. I am hoping that my educated guess is correct with regard to Picasso being 12nm Zen+ or better as rumor is mainly that Picasso is a Raven Ridge successor that offers power and performance tweaks without going into further detail. I expect more information on Picasso (APU) and Matisse (CPU) to come out as soon as next month at CES 2019.

What are your thoughts on Picasso?

Source: Hexus

Intel Unveils Next-Gen Sunny Cove CPU, Gen11 Graphics, and 3D Stacking Technology

Subject: Processors | December 12, 2018 - 09:00 AM |
Tagged: xeon, Sunny Cove, processor, intel core, Intel, integrated graphics, iGPU, Foveros, cpu, 3D stacking

Intel’s Architecture Day was held yesterday and brought announcements of three new technologies. Intel shared details of a new 3D stacking technology for logic chips, a brand new CPU architecture for desktop and server, and some surprising developments on the iGPU front. Oh, and they mentioned that whole discrete GPU thing…

3D Stacking for Logic Chips

First we have Foveros, a new 3D packaging technology that follows Intel’s previous EMIB (Embedded Multi-die Interconnect Bridge) 2D packaging technology and enables die-stacking of high-performance logic chips for the first time.

2d-and-3d-packaging-drive-new-design-flexibility.jpg

“Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies. Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors for the first time.”

Foveros will allow for a new “chiplet” paradigm, as “I/O, SRAM, and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top”. This new approach would permit design elements to be “mixed and matched”, and allow new device form-factors to be realized as products can be broken up into these smaller chiplets.

3d-packaging-a-catalyst-for-product-innovation.jpg

The first range of products using this technology are expected to launch in the second half of 2019, beginning with a product that Intel states “will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die,” which Intel says “will enable the combination of world-class performance and power efficiency in a small form factor”.

Intel Sunny Cove Processors - Coming Late 2019

Next up is the announcement of a brand new CPU architecture with Sunny Cove, which will be the basis of Intel’s next generation Core and Xeon processors in 2019. No mention of 10nm was made, so it is unclear if Intel’s planned transition from 14nm is happening with this launch (the last Xeon roadmap showed a 10 nm transition with "Ice Lake" in 2020).

Intel_CPUs.jpg

Intel states that Sonny Cove is “designed to increase performance per clock and power efficiency for general purpose computing tasks” with new features included “to accelerate special purpose computing tasks like AI and cryptography”.

Intel provided this list of Sunny Cove’s features:

  • Enhanced microarchitecture to execute more operations in parallel.
  • New algorithms to reduce latency.
  • Increased size of key buffers and caches to optimize data-centric workloads.
  • Architectural extensions for specific use cases and algorithms. For example, new performance-boosting instructions for cryptography, such as vector AES and SHA-NI,  and other critical use cases like compression and decompression.

Integrated Graphics with 2x Performance

Gen11_Pipeline.png

Intel slide image via ComputerBase

Intel did reveal next-gen graphics, though it was a new generation of the company’s integrated graphics announced at the event. The update is nonetheless significant, with the upcoming Gen11 integrated GPU “expected to double the computing performance-per-clock compared to Intel Gen9 graphics” thanks to a huge increase in Execution Units, from 24 EUs with Gen9 to 64 EUs with Gen11. This will provide “>1 TFLOPS performance capability”, according to Intel, who states that the new Gen11 graphics are also expected to feature advanced media encode/decode, supporting “4K video streams and 8K content creation in constrained power envelopes”.

And finally, though hardly a footnote, the new Gen11 graphics will feature Intel Adaptive Sync technology, which was a rumored feature of upcoming discrete GPU products from Intel.

Discrete GPUs?

And now for that little part about discrete graphics: At the event Intel simply “reaffirmed its plan to introduce a discrete graphics processor by 2020”. Nothing new here, and this obviously means that we won’t be seeing a new discrete GPU from Intel in 2019 - though the beefed-up Gen11 graphics should provide a much needed boost to Intel’s graphics offering when Sonny Cove launches “late next year”.

Source: Intel

Getting the most out of the i5-9600K

Subject: Processors | November 30, 2018 - 06:34 PM |
Tagged: Core i5-9600K, overclocking, Intel

For just under $300 and offering decent performance at it's stock clocks of 3.7GHz and 4.6GHz Turbo, the i5-9600K is an attractive chip for many looking to build a new system.  However, by overclocking it you can get even more bang for your buck, which is exactly what [H]ard|OCP has been looking into.  They attached a RX480 V3 Radiator, and D5 Photon Reservoir/Pump Combo V2 to cool the chip which let them hit 5.25GHz perfectly stable with some noticeable results.  See the settings they used as well as some tips in their full review.

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"The Intel Core i5-9600K Processor will likely hit the the sweet spot for a lot of desktop PC enthusiasts and gamers. We have a solid 6-Core count with a Turbo Boost clock of 4.6GHz coming in for right around $270. What kind of overclock will the new 9600K CPU support and remain 100% stable?"

Here are some more Processor articles from around the web:

Processors

Source: [H]ard|OCP

Meet the i9-9980XE

Subject: Processors | November 13, 2018 - 03:36 PM |
Tagged: x299, Threadripper, skylake-x, Intel, i9-9980XE, i9-7980XE, HEDT, core x, amd, 2990wx

The new ~$2000 i9-9980XE is a refreshed Skylake chip, using Intel's 14-nm++ process, with 18 multithreaded cores running at 3GHz with a Boost clock of 4.4GHz.  If you were to lift up the lid, you would find the same Solder Thermal Interface Material we saw in the last few releases so expect some brave soul to run delidding tests at some point in the near future.  As it stands now, The Tech Report's overclocking tests had the same results as Ken, with 4.5GHz across all cores being the best they could manage.  While the chip does offer new features, many of them are aimed specifically at production tasks and will not benefit your gaming experience.

Check out the performance results here and below the fold.

 

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"Intel is bolstering its Core X high-end desktop CPUs with everything in its bag of tricks, including 14-nm++ process technology, higher clock speeds, larger caches, and solder thermal interface material. We put the Core i9-9980XE to the test to see how those refinements add up against AMD's high-end desktop onslaught."

Here are some more Processor articles from around the web:

Processors

 

Author:
Subject: Processors
Manufacturer: Intel

Overview

Shopping for a CPU in 2018 has been a bit of a moving target. Between the launch of AMD's Ryzen 2000 series processors in the beginning of the year, new AMD Threadripper X and WX-series products, and a consumer CPU refresh from Intel last month, it's been difficult to keep track of.

Now we are rounding out 2018 with new products for the last remaining platform that hasn't seen a refresh this year, Intel's Core X-series of processors, namely the Intel Core i9-9980XE.

intel-9980xe-icon.jpg

Join us, as we talk about Intel's new 9th-generation Core X-series processors, and the current landscape of HEDT desktop platforms.

  Core i9-9980XE Core i9-7980XE Threadripper 2990WX Threadripper 2970WX Threadripper 2950X Threadripper 2920X
Architecture Skylake-X Skylake-X Zen+ Zen+ Zen+ Zen+
Process Tech 14nm++ 14nm+ 12nm 12nm 12nm 12nm
Cores/Threads 18/36 18/36 32/64 24/48 16/32 12/24
Base Clock 3.0 GHz 2.6 GHz 3.0 GHz 3.0 GHz 3.5 GHz 3.5 GHz
Boost Clock 4.4 GHz 4.2 GHz 4.2 GHz 4.2 GHz 4.4 GHz 4.3 GHz
L3 Cache 24.75MB 24.75MB 64MB 64MB 32MB 32 MB
Memory Support DDR4-2666 (Quad-Channel) DDR4-2666 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel)
PCIe Lanes 44 44 64 64 64 64
TDP 165 Watts 165 Watts 250 Watts 250 Watts 180 Watts 180 Watts
Socket LGA-2066 LGA-2066 TR4 TR4 TR4 TR4
Price (MSRP) $1979 $1999 $1799 $1299 $899 $649

Click here to continue reading our review of the Intel Core i9-9980XE! 

AMD Shows Off Zen 2-Based EPYC "Rome" Server Processor

Subject: Processors | November 7, 2018 - 11:00 PM |
Tagged: Zen 2, rome, PCI-e 4, Infinity Fabric, EPYC, ddr4, amd, 7nm

In addition to AMD's reveal of 7nm GPUs used in its Radeon Instinct MI60 and MI50 graphics cards (aimed at machine learning and other HPC acceleration), the company teased a few morsels of information on its 7nm CPUs. Specifically, AMD teased attendees of its New Horizon event with information on its 7nm "Rome" EPYC processors based on the new Zen 2 architecture.

AMD EPYC Rome Zen 2.jpg

Tom's Hardware spotted the upcoming Epyc processor at AMD's New Horizon event.

The codenamed "Rome" EPYC processors will utilize a MCM design like its EPYC and Threadripper predecessors, but increases the number of CPU dies from four to eight (with each chiplet containing eight cores with two CCXs) and adds a new 14nm I/O die that sits in the center of processor that consolidates memory and I/O channels to help even-out the latency among all the cores of the various dies. This new approach allows each chip to directly access up to eight channels of DDR4 memory (up to 4TB) and will no longer have to send requests to neighboring dies connected to memory which was the case with, for example, Threadripper 2. The I/O die is speculated by TechPowerUp to also be responsible for other I/O duties such as PCI-E 4.0 and the PCH communication duties previously integrated into each die.

"Rome" EPYC processors with up to 64 cores (128 threads) are expected to launch next year with AMD already sampling processors to its biggest enterprise clients. The new Zen 2-based processors should work with existing Naples and future Milan server platforms. EPYC will feature from four to up to eight 7nm Zen 2 dies connected via Infinity Fabric to a 14nm I/O die.

AMD Lisa Su Holding Rome EPYC Zen 2 CPU.png

AMD CEO Lisa Su holding up "Rome" EPYC CPU during press conference earlier this year.

The new 7nm Zen 2 CPU dies are much smaller than the dies of previous generation parts (even 12nm Zen+). AMD has not provided full details on the changes it has made with the new Zen 2 architecutre, but it has apparently heavily tweaked the front end operations (branch prediction, pre-fetching) and increased cache sizes as well as doubling the size of the FPUs to 256-bit. The architectural improvements alogn with the die shrink should allow AMD to show off some respectable IPC improvements and I am interested to see details and how Zen 2 will shake out.

Also read:

Intel unveils Xeon Cascade Lake Advanced Performance Platform

Subject: Processors | November 5, 2018 - 02:00 AM |
Tagged: xeon e-2100, xeon, MCP, Intel, Infinity Fabric, EPYC, cxl-ap, cascade lake, amd, advanced performance

Ahead of the Supercomputing conference next week, Intel has announced a new market segment for Xeons called Cascade Lake Advanced Platform (CXL-AP). This represents a new, higher core count option in the Xeon Scalable family, which currently tops out at 28 cores. 

cxl-ap.png

Through the use of a multi-chip package (MCP), Intel will now be able to offer up to 48-cores, with 12 DDR4 memory channels per socket. Cascade Lake AP is being targeted at dual socket systems bringing the total core count up to 96-cores.

UPI.jpg

Intel's Ultra Path Interconnect (UPI), introduced in Skylake-EP for multi-socket communication, is used to connect both the MCP packages on a single processor together, as well as the two processors in a 2S configuration. 

Given the relative amount of shade that Intel has thrown towards AMD's multi-die design with Epyc, calling it "glued-together," this move to an MCP for a high-end Xeon offering will garner some attention.

When asked about this, Intel says that the issues they previously pointed out with aren't inherently because it's a multi-die design, but rather the quality of the interconnect. By utilizing UPI for the interconnect, Intel claims their MCP design will provide performance consistency not found in other solutions. They were also quick to point out that this is not their first Xeon design utilizing multiple packages.

Intel provided some performance claims against the current 32-core Epyc 7601, of up to 3.4X greater performance in Linpack, and up to 1.3x in Stream Triad.

As usual, whether or not these claims are validated will come down to external testing when people have these new Cascade Lake AP processors in-hand, which is set to be in the first half of 2019.

More details on the entire Cascade Lake family, including Cascade Lake AP, are set to come at next week's Supercomputing conference, so stay tuned for more information as it becomes available!

Source: Intel

Crack a PB 2 with AMD

Subject: Processors | October 30, 2018 - 03:30 PM |
Tagged: threadripper 2, precision boost 2, amd, 2970wx, 2920x

Now that you've had some time to digest Ken's look at the 2920X and 2970WX, take a look at how AMD's new silicon performed on other test beds.  Over at The Tech Report they ran the 2920X paired with DDR4-3200 and spent a fair amount of time testing workstation tasks including DAWBench VI tests.  There are also a number of games they tested which are not included in our suite so start your reading over there.

DSC05249.JPG

"While those figures may seem little changed from those of the Ryzen Threadripper 1920X, AMD's Precision Boost 2 technology promises a more graceful descent to that base clock as cores and threads become loaded down.""

Here are some more Processor articles from around the web:

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Author:
Subject: Processors
Manufacturer: AMD

A quick refresher and Dynamic Local Mode

In general, the rollout of AMD's second-generation Ryzen Threadripper processors has been a bit unconventional. While the full lineup was announced back in August, there has been a staggered release period.

Later in August, we first got our hands on the Threadripper 2950X and 2990WX, the 16 and 32-core variants. Even though both of these parts were reviewed at the same time, the 2990WX was available first, with the 2950X coming a few weeks later.

Now more than two months later, we are taking a look at the 12-core Threadripper 2920X and the 24-core Threadripper 2970WX which were announced alongside the Threadipper parts that have already been shipping for quite a while now.

Will these new Threadripper processors be worth the wait?

DSC05252.JPG

  Threadripper 2990WX Threadripper 2970WX Threadripper 2950X Threadripper 2920X Core i9-7980XE Core i9-9900K
Architecture Zen+ Zen+ Zen+ Zen+ Skylake-X Coffee Lake Refresh
Process Tech 12nm 12nm 12nm 12nm 14nm+ 14nm++
Cores/Threads 32/64 24/48 16/32 12/24 18/36 8/16
Base Clock 3.0 GHz 3.0 GHz 3.5 GHz 3.5 GHz 2.6 GHz 3.6 GHz
Boost Clock 4.2 GHz 4.2 GHz 4.4 GHz 4.3 GHz 4.2 GHz 5.0 GHz
L3 Cache 64MB 64MB 32MB 32 MB 24.75MB 16MB
Memory Support DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2933 (Quad-Channel) DDR4-2666 (Quad-Channel) DDR4-2666 (Dual-Channel)
PCIe Lanes 64 64 64 64 44 16
TDP 250 Watts 250 Watts 180 Watts 180 Watts 165 Watts 95 Watts
Socket TR4 TR4 TR4 TR4 LGA-2066 LGA1151
Price (MSRP) $1799 $1299 $899 $649 $1999 $499 MSRP ($580 street)

Click here to continue reading our review of the AMD Ryzen Threadripper 2920X and 2970WX.