Google's Daydream View Available on November 10th

Subject: Mobile | November 7, 2016 - 07:01 AM |
Tagged: VR, google, daydream

Now that Android 7.0 Nougat is beginning to ship on phones, and the holidays are around the corner, Google is releasing accessories to support it. The Daydream View, which you can dock phones into for VR purposes, will be on sale on November 10th. The viewer will cost $79 USD, minus the phone of course, and can be purchased in the US, Canada, UK, Germany, and Australia.

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Currently, the only Daydream-compatible phone is Google's Pixel. As mentioned before, Nougat is only beginning to ship on phones, and the OS is required for this feature. One thing that's not entirely clear to me, after reading several sites, is whether all Daydream-compatible phones will be able to use this specific viewer, or if some will need a different chassis. You would think that variations in attributes like screen size might complicate things, but we know it will support other, non-Pixel phones; I'm just not clear whether it's some or all.

Anyway, that concern aside, it's almost cheap enough to be a “why not?” addition to any phone that is compatible. It certainly will not put the HTC Vive PC-based VR system out of business, but I'm interested in how it works with mobile content, especially linear video, going forward.

Source: Google

NES Classic PCB Pictured Online

Subject: Systems, Mobile | November 6, 2016 - 07:00 AM |
Tagged: Nintendo, nes, Cortex A7, arm, Allwinner

It looks like Peter Brown, Senior Reviews Editor at GameSpot received an NES Classic and promptly disassembled it for a single photo. From there, users on Reddit searched the component model numbers and compiled specifications. According to their research, the system (unless Nintendo made multiple, interchangeable models) is based on an Allwinner R16 SoC, which has four ARM Cortex A7 cores and an ARM Mali 400 MP2 GPU. Attached to this is 256MB of DDR3 RAM and 512 MB of flash.

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Image Credit: Peter Brown

Thankfully, the packaging of each chip has quite large, mostly legible branding, so it's easy to verify.

In terms of modern phone technology, this is about the bottom of the barrel. The Allwinner R16 should be roughly comparable to the Raspberry Pi 2, only that system has about four times the RAM as Nintendo's. This is not a bad thing, of course, because its entire goal is to emulate a device that was first released in 1983 (in Japan) albeit at high resolution. Not all of the games will be free for them to include, either. Mega Man 2, PAC-MAN, Final Fantasy, Castlevania 1 and 2, Ninja Gaiden, Double Dragon II, Bubble Bobble, Tecmo Bowl, Super C, and Galaga are all from third-party publishers, who will probably need some cut of sales.

Users are claiming that it doesn't look like it could be updated. Counting the ports, it doesn't look like there's any way in, but I could be wrong. That said, I never expected it to be upgradeable so I guess that's that?

The NES Classic Edition goes on sale on November 11th for $59.99 USD MSRP.

Huawei Announces Mate 9 Smartphone with Kirin 960 and Dual-Lens Leica Camera

Subject: Mobile | November 3, 2016 - 09:58 PM |
Tagged: smartphone, phablet, Mate 9, Mate 8, Mali-G71, Leica, Kirin 960, Kirin 950, Huawei, dual camera

Huawei announced their flagship Mate 9 smartphone earlier today, successor to the Mate 8 we reviewed a few months back. A hair smaller than last year's phablet design, the Mate 9 boasts improved internals and the dual-lens Leica camera recently introduced with the company's P9 phone.

Mate_9_1.jpg

The biggest change inside the Mate 9 is the new Kirin 960 SoC, which makes use of the latest ARM Cortex architecture in an 8-core big.LITTLE design. Importantly, the Kirin 960 also includes the latest Mali-G71 MP8 graphics, and with GPU power a low point with the Kirin 950 this is a welcome change.

Mate_9_2.jpg

Specifications:

  • Display: 
    • 5.9” FHD display
    • 2.5D glass
    • 1080p (1920 x 1080), 373ppi
    • 16.7M colors, Color saturation (NTSC) 96% High contrast 1500:1 (Typical)
  • CPU: HUAWEI Kirin 960; Octa-core (4 x 2.4 GHz A73 + 4 x 1.8 GHz A53) + i6 co-processor
  • GPU: Mali-G71 MP8
  • Memory and Storage: 
    • 4GB RAM
    • 64GB Storage
    • microSD card slot, supports up to 256GB (uses secondary SIM slot) 
  • Camera: 
    • Front: 8MP AF, F1.9
    • Main: Dual, 20MP Monochrome + 12MP RGB, F2.2 OIS (Optical Image Stabilization)
    • 4K video
  • Connectivity:
    • Wi-Fi 2.4G/5G, 802.11a/b/g/n/ac with Wi-Fi Direct support
    • BT4.2, BLE support
    • USB Type-C (Hi-Speed USB)
  • Battery 4000 mAh
  • Operating System: Android 7.0 (Emotion UI 5.0)
  • Colors: Space Gray, Moonlight Silver, Champagne Gold, Mocha Brown, Ceramic White, Black
  • Size and Weight: 
    • (H x W x D): 156.9 x 78.9 x 7.9 mm
    • Approx. 190 g

Mate_9_Lens.jpg

The other major improvement for the Mate 9 vs. the 8 is the primary camera, which now incorporates a dual-lens system. The dual Leica lenses in the Mate 9 are backed by two different cameras, with separate color and monochrome image sensors. This unusual setup has the potential to offer more detailed images, and the camera system can also produce simulated depth-of-field effects.

We have day-one review hardware in hand here at PC Perspective, so stay tuned for the full review!

Source: Huawei

The Dell Alienware 13 arrives, with a 1440p OLED screen and GTX 1060

Subject: General Tech, Mobile | November 1, 2016 - 12:25 PM |
Tagged: oled, GTX1060, dell, Alienware 13, alienware

Dell has announced four base models of Alienware 13 gaming notebooks, a TN model, a 1080p IPS model and two 1440p OLED models; one with 8GB of DDR4 and one with double that amount.  The two non-OLED models are powered by an i5-6300HQ while the OLED models contain an i7-6700HQ and all four have a desktop class GTX 1060.  That should offer you enough to power an Oculus or Vive, especially if you opt to purchase the Alienware Graphics Amplifier which is an external GPU dock that uses a proprietary connection from Dell.  It is described as a proprietary PCIe connection which provides four lanes of PCIe 3.0, which sounds very similar to Thunderbolt 3.0 which also provides four lanes when done correctly.

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It is also nice to see that all use SSDs for storage, the TN model a SATA drive and the other four base models a PCIe SSD.  One must assume that the pink can be turned off in the BIOS, though there are those guaranteed to like the glow.  You can check out all of the additional features and options on Dell's page and perhaps even pick one up as they are available as of today.  Hopefully we will have a chance to test Dell's external GPU connection against the more common Thunderbolt solutions in the near future.

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Here is some more Tech News from around the web:

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Source: Dell

Nexus has been Pixel-ated by Motorola ... Google it!

Subject: Mobile | October 20, 2016 - 05:45 PM |
Tagged: pixel, pixel xl, google, Android, Snapdragon 821, nougat

Ah, the tech industry; blink and suddenly familiar things disappear and yet you are also simultaneously overcome with a sense of deja vu.  Former Motorola President Rick Osterloh now heads a team at Google which is the combination of Nexus, Pixel Chromebooks, Chromecast, OnHub, ATAP, and Google Glass and this team have just released two new Google phones.  The 5" 1920x1080 Pixel and the 5.5" 2560x1440 Pixel XL have arrived on the market, priced to compete with Apple's new lineup, though still far less expensive than the Chromebooks which bore the same name up until recently.  The phones run Android 7.1 Nougat on a quad-core Qualcomm Snapdragon 821 and are manufactured by HTC.  Ars Technica considers them to now be the best Android phones on the market and yet somehow bland; read their full review to see if you agree.

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"Welcome to the age of Google Hardware. Apparently tired of letting third-party Android OEMs serve as the stewards of Android handsets, Google has become a hardware company. (Again)."

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Source: Ars Technica

NVIDIA Tegra SoC powers new Nintendo Switch gaming system

Subject: Processors, Mobile | October 20, 2016 - 11:40 AM |
Tagged: Nintendo, switch, nvidia, tegra

It's been a hell of a 24 hours for NVIDIA and the Tegra processor. A platform that many considered dead in the water after the failure of it to find its way into smartphones or into an appreciable amount of consumer tablets, had two major design wins revealed. First, it was revealed that NVIDIA is powered the new fully autonomous driving system in the Autopilot 2.0 hardware implementation in Tesla's current Model S, X and upcoming Model 3 cars.

Now, we know that Nintendo's long rumored portable and dockable gaming system called Switch is also powered by a custom NVIDIA Tegra SoC.

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We don't know much about the hardware that gives the Switch life, but NVIDIA did post a short blog with some basic information worth looking at. Based on it, we know that the Tegra processor powering this Nintendo system is completely custom and likely uses Pascal architecture GPU CUDA cores; though we don't know how many and how powerful it will be. It will likely exceed the performance of the Nintendo Wii U, which was only 0.35 TFLOPS and consisting of 320 AMD-based stream processors. How much faster we just don't know yet.

On the CPU side we assume that this is built using an ARM-based processor, most likely off-the-shelf core designs to keep things simple. Basing it on custom designs like Denver might not be necessary for this type of platform. 

Nintendo has traditionally used custom operating systems for its consoles and that seems to be what is happening with the Switch as well. NVIDIA mentions a couple of times how much work the technology vendor put into custom APIs, custom physic engines, new libraries, etc. 

The Nintendo Switch’s gaming experience is also supported by fully custom software, including a revamped physics engine, new libraries, advanced game tools and libraries. NVIDIA additionally created new gaming APIs to fully harness this performance. The newest API, NVN, was built specifically to bring lightweight, fast gaming to the masses.

We’ve optimized the full suite of hardware and software for gaming and mobile use cases. This includes custom operating system integration with the GPU to increase both performance and efficiency.

The system itself looks pretty damn interesting, with the ability to switch (get it?) between a docked to your TV configuration to a mobile one with attached or wireless controllers. Check out the video below for a preview.

I've asked both NVIDIA and Nintendo for more information on the hardware side but these guys tend to be tight lipped on the custom silicon going into console hardware. Hopefully one or the other is excited to tell us about the technology so we can some interesting specifications to discuss and debate!

UPDATE: A story on The Verge claims that Nintendo "took the chip from the Shield" and put it in the Switch. This is more than likely completely false; the Shield is a significantly dated product and that kind of statement could undersell the power and capability of the Switch and NVIDIA's custom SoC quite dramatically.

Source: Nintendo

Qualcomm Announces Snapdragon 653, 626, and 427 SoCs

Subject: Processors, Mobile | October 18, 2016 - 11:32 AM |
Tagged: SoC, Snapdragon 653, Snapdragon 626, Snapdragon 427, snapdragon, smartphone, qualcomm, mobile

Qualcomm has announced new 400 and 600-series Snapdragon parts, and these new SoCs (Snapdragon 653, 626, and 427) inherit technology found previously on the 800-series parts, including fast LTE connectivity and dual-camera support.

qualcomm-snapdragon-mobile-processor.jpg

The integrated LTE modem has been significantly for each of these SoCs, and Qualcomm lists these features for each of the new products:

  • X9 LTE with CAT 7 modem (300Mbps DL; 150Mbps UL) designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
  • LTE Advanced Carrier Aggregation with up to 2x20 MHz in the downlink and uplink
  • Support for 64-QAM in the uplink
  • Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.

In addition to the new X9 modem, all three SoCs offer faster CPU and GPU performance, with the Snapdragon 653 (which replaces the 652) now supporting up to 8GB of memory - up from a max of 4GB previously. Each of the new SoCs also feature Qualcomm's Quick Charge 3.0 for fast charging.

SD_600_400.png

Full specifications for these new products can be found on the updated Snapdragon product page.

Availability of the new 600-series Snapdragon processors is set for the end of this year, so we could start seeing handsets with the faster parts soon; while the Snapdragon 427 is expected to ship in devices early in 2017.

Source: Qualcomm

Qualcomm Announces Snapdragon X50 5G Modem

Subject: Networking, Mobile | October 17, 2016 - 11:00 PM |
Tagged: Snapdragon X50, snapdragon, qualcomm, modem, mobile, mmWave, LTE, cellular, 5G

Qualcomm has officially unveiled the development of a new 5G modem with the Snapdragon X50, which targets OEMs and early 5G development. The X50 supports milimeter wave (mmWave) technology initially, and rather than replace existing LTE solutions the X50 is designed to work alongside LTE modems integrated into Snapdragon SoCs, for a seamless handoff between 5G and 4G networks.

X50_Modem_Logo.jpg

"The Snapdragon X50 5G modem will initially support operation in millimeter wave (mmWave) spectrum in the 28GHz band. It will employ Multiple-Input Multiple-Output (MIMO) antenna technology with adaptive beamforming and beam tracking techniques, which facilitates robust and sustained mobile broadband communications in non-line-of-sight (NLOS) environments. With 800 MHz bandwidth support, the Snapdragon X50 5G modem is designed to support peak download speeds of up to 5 gigabits per second. 

Designed to be used for multi-mode 4G/5G mobile broadband, as well as fixed wireless broadband devices, the Snapdragon X50 5G modem can be paired with a Qualcomm® Snapdragon™ processor with an integrated Gigabit LTE modem and interwork cohesively via dual-connectivity. Gigabit LTE will become an essential pillar for the 5G mobile experience, as it can provide a wide coverage layer for nascent 5G networks."

Ratification of an official “5G” standard has not taken place, but Qualcomm hopes to position itself at the forefront of its development. The mmWave technology (which is explained in this video) is only one part of the puzzle:

"Work has begun on defining, standardizing and designing the new OFDM-based 5G New Radio (NR) as part of the global 3GPP standard. 5G NR is being designed to support a wide variation of device-types, services and deployments. It is also being designed to get the most out of every bit of spectrum across a wide array of available spectrum bands and regulatory paradigms."

(More information is available on Qualcomm's 5G Technologies page.)

The Snapdragon X50 modem is set to begin sampling to OEMs in the second half of 2017, with the first half of 2018 projected for the first commercial products featuring the new modem.

Source: Qualcomm

Samsung Begins Mass Production of 10nm LPE SoCs

Subject: Mobile | October 17, 2016 - 07:01 AM |
Tagged: Samsung, 10nm

Earlier today, Samsung announced that mass production has started for system-on-a-chip (SoC) products on their first-generation 10nm process, which is called Low Power Early (10LPE). Chips produced from this node will begin to ship in devices starting early 2017. The press release claims that, for integrated circuits manufactured under the 10LPE process, die area could decrease up to 30%, with either an increase in performance of up to 27% or a decrease in power of up to 40%.

samsung-logo.png

This is a little higher than the 10% increase in performance that AnandTech claimed in April. On the plus side, it was also expected that any design that was created for 10LPE could be migrated, pretty much without change, to the second-generation, Low Power Plus (10LPP) node. Jumping back to today's press release, Samsung claims that 10LPP will begin mass production in the second half of next year. So basically, early 10nm parts will launch in a couple of months, then a second wave will arrive the year after, using a more refined fabrication method.

Source: Samsung
Subject: Mobile
Manufacturer: Apple

Introduction and Specifications

The iPhone 7 and 7 Plus are here, and while outwardly they look very similar to last year’s 6s models, there have been some significant upgrades (and a highly controversial change) to the new phones. Is there enough in this iterative update to justify an upgrade? After spending a couple of weeks using one as my primary device, I will attempt to answer this question.

DSC_0746.jpg

While there had been rumors swirling of an all-new design featuring an OLED display, Apple appears to be holding back until next year - which just happens to be the 10th anniversary of the iPhone. Considering this fact, it may just be that the iPhone 7 is something of a stop-gap for 2017. Some of the rumored elements are here, however; with the elimination of the physical home button (it's a solid-state version now) and 3.5 mm headphone jack (the latter causing much consternation). The camera on both phones is completely new as well, with a special dual-lens version exclusive to the 7 Plus.

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First we'll go over the specs of these phones. As you can see, there are still some areas that are not fully known, such as the exact speed of the low-power cores in the new quad-core SoC, and the specifics about this year's GPU.

  Apple iPhone 7 Apple iPhone 7 Plus
Processor Apple A10 Fusion SoC
2.34 GHz dual-core + 2x low-power cores (? MHz)
Graphics 6-core (unknown GPU)
Memory 2GB 3GB
Screen 4.7-inch IPS, DCI-P3 capable 5.5-inch IPS, DCI-P3 capable
Storage 32GB/128GB/256GB
Cameras Back: 12MP, ƒ/1.8, OIS
Front: 7MP, ƒ/2.2
Back: 12MP, f /1.8, OIS
Dual-camera with 2x telephoto lens
Front: 7MP, ƒ/2.2
Video Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps
Audio Stereo Speakers
Wireless 802.11a/b/g/n/ac Wi‑Fi with MIMO 
Bluetooth 4.2, NFC
Cellular
(Model A1778/1784)
FDD-LTE (Bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26, 27, 28, 29, 30) 
TD-LTE (Bands 38, 39, 40, 41) 
UMTS/HSPA+/DC-HSDPA (850, 900, 1700/2100, 1900, 2100 MHz) 
GSM/EDGE (850, 900, 1800, 1900 MHz)
Connection Lightning
Battery 1960 mAh 2900 mAh
Dimensions 138.3 x 67.1 x 7.1 mm
(5.44 x 2.64 x 0.28 inches)
138 g (4.87 oz)
158.2 x 77.9 x 7.3 mm
(6.23 x 3.07 x 0.29 inches)
188 g (6.63 oz)
OS iOS 10
Price $649 - $849 $769 - $969

Nearly a Decade of iPhone

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The iPhone was introduced in 2007 (Image credit: Apple, via archive.org)

It’s hard to believe it’s been nine years since the original iPhone launched. Announced in January of 2007 by Steve Jobs during his keynote speech at CES, it set a standard that the rest of the industry would take some time to meet (remember, the first Android phone was over a year away at this point.) But nine years is an age in technology years, and that first version seems like an antique now. (The original iPhone specs: 3.5-inch display with 320x480 resolution, single-core ARM processor running at 412 MHz, 128 MB of system memory, 4GB/8GB storage.)

Continue reading our review of the Apple iPhone 7 and iPhone 7 Plus!!