Samsung 850 Pro 512GB Full Review - NAND Goes 3D!
Specifications, Packaging, Internals, Testing Methodology and System Setup
Straight from Samsung:
Packaging is identical to that of the 840 series products from Samsung.
Even though we already took the *really* deep dive on the intro page, let's zoom back out a little and check things out at the chip and packaging level:
With the disassembly complete, we can get a good look at the admittedly small PCB:
The trusty MEX controller drives four packages (K9HQGY8S5M) on the top...
...and another four packages (K9PRGY8S7M) on the bottom. I highlighted a bit of a difference there. Why different chips on the top and bottom? I suspect the red letters there denote the die layers within the packages. Half of the packages contain 4 dies each, the other half contain 8 dies each. 4*4+4*8 adds up to 48 dies, which is 4GB larger than the rated 512GB capacity of this unit when assuming 86Gbit density per die.
Our tests are a mix of synthetic and real-world benchmarks. PCMark, IOMeter, HDTach, HDTune, Yapt and our custom File Copy test round out the selection to cover just about all bases. If you have any questions about our tests just drop into the Storage Forum and we'll help you out!
Test System Setup
We currently employ a pair of testbeds. A newer ASUS P8Z77-V Pro/Thunderbolt and an ASUS Z87-PRO. Variance between both boards has been deemed negligible.
PC Perspective would like to thank ASUS, Corsair, and Kingston for supplying some of the components of our test rigs.
|Hard Drive Test System Setup|
|CPU||Intel Core i7-4770K|
|Motherboard||ASUS P8Z77-V Pro/TB / ASUS Z87-PRO|
|Memory||Kingston HyperX 4GB DDR3-2133 CL9|
|Hard Drive||G.Skill 32GB SLC SSD|
|Video Card||Intel® HD Graphics 4600|
|Power Supply||Corsair CMPSU-650TX|
|Operating System||Windows 8.1 X64|
- PCPer File Copy Test