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Subject: Storage | May 18, 2017 - 04:26 PM | Jeremy Hellstrom
Tagged: corsair, corsair force mp500, mp500, M.2, NVMe, PS5007-E7, toshiba mlc
Corsair have entered the NVMe market with a new Force Series product, the MP500 drive which contains Toshiba's 15-nm MLC, run by the popular Phison PS5007-E7 controller. There is a difference which The Tech Report noticed right away, that sticker is for more than just show, it hides a layer of heat-dissipating copper inside just like we have seen in Samsung products. It may have been the sticker, or some sort of secret sauce which Corsair added but the MP500's performance pulled ahead of Patriot's Hellfire SSD overall. Read the full review to see where the drive showed the most performance differential.
"Corsair is throwing its hat into the NVMe SSD ring with the Force Series MP500 drive. We subjected this gumstick to our testing gauntlet to see how well the 240GB version fares against the rest of the formidable NVMe field."
Here are some more Storage reviews from around the web:
- Toshiba N300 6TB NAS HDD @ eTeknix
- ASUSTOR AS1004T NAS Server @ NikKTech
- ioSafe 216 2-Bay NAS @ Kitguru
- LaCie D2 Thunderbolt 3 10TB Professional Storage Drive Review @ NikKTech
- LaCie d2 Thunderbolt 3 10TB @ Kitguru
- Thecus N2810 Pro 2-Bay NAS @ techPowerUp
Subject: Cases and Cooling | May 18, 2017 - 03:11 PM | Jeremy Hellstrom
Tagged: Lian Li, PC-O12, e-atx
Lian Li's new PC-O12 is an interesting case. It bears many similarities to cases currently on the market, with tempered glass windows, cable management features and a separated chamber at the bottom which holds the PSU and drive cages.
The way it differs is obvious when you look at the back panel and alignment of the four expansion slots for graphics cards. They are designed to allow you to mount your GPUs vertically with the use of a 440mm PCI-E 16X Riser cable. This will let you show off the artwork and LEDs on your card and is touted as increasing cooling efficiency. While this will give you a unique looking system it also adds an impressive price tag of $399.99.
You can read the full PR below the specifications.
May 18, 2017, Keelung, Taiwan - Lian-Li Industrial Co. Ltd launches the PC-O12; a compact mid-tower chassis that combines sleek tempered glass panels with strong, but lightweight, steel and aluminum. This new addition to Lian Li’s latest generation O-series chassis range offers unsurpassed style, plus slim design with ample space for a powerful but compact PC build. Thanks to its unique design, it offers space for two vertically placed graphics cards in a separate compartment for gorgeous PC builds.
Tempered glass adds a touch of class
The PC-O12’s flawless tempered glass front and side panels make it a sleek and sophisticated showcase for the latest cutting edge computing technologies. Tempered glass is tough, safe and very durable, providing a ‘fresh from the showroom’ appearance indefinitely. The PC-O12’s alluring black aluminum outer body and panels complete the picture. Internally, a rigid steel frame provides a firm foundation for state of the art features.
Ideal balance of chassis size and features
Despite it’s space-saving format, this mid-tower enclosure offers plenty of room for the most powerful hardware. The 440mm full bandwidth PCI Express 16x riser cable allows flexible vertical graphics card mounting to enhance cooling and to show off the latest graphics technology through the tempered glass side panel. The roomy case interior fits graphics cards up to 340mm long and CPU coolers up to 75mm high.
There’s internal space for up to eight hard disk and SSD drives for terabytes of fast storage capacity. In addition, the newest ultra speedy, powerful external USB 3.1 type C devices are supported, and there are a total of four external USB connectors as standard.
A case with great low-noise cooling performance
With up to five large-format fans, this chassis ensures valuable PC components keep running cool, prolonging life, enhancing performance and reducing noise. There’s space for three 120mm fans at the top of the case, plus two 140mm or 120mm fans at the front. With so many airflow options, users are able to reduce fan speed and reduce noise. In addition, removable mesh dust filters cover the primary fan mounts. The drive cages and PSU mount include rubber vibration dampeners to minimize noise.
Price and Availability
The PC-O12 is now available at Newegg for $399.99 Find detailed specifications for the PC-O12 here
Additional PCI Express riser cables are available at Performance PC starting in June 2017
Subject: General Tech | May 18, 2017 - 12:29 PM | Jeremy Hellstrom
Tagged: cyborgs, arm
Researchers at the Center for Sensorimotor Neural Engineering are working on a way you can truly have SoC on the brain, partnering with ARM to develop chips which can be implanted in the brain. The goal is not to grant you a neural interface nor add a couple of petabytes to your long term memory but to help treat people suffering from paralysis due to stroke or other damage to the brain. There is the small problem of heat, brain tissue will be much more susceptible to damage from implanted devices than an organ in the torso; a pacemaker has space in which to dissipate excess heat. We are still a long way off but you can read up on the current state of the research by following the links at The Inquirer.
"CHIP GIANT ARM is teaming up with US researchers on a project develop human brain implants aimed at helping paralysed patients as well as stroke and Alzheimer's patients."
Here is some more Tech News from around the web:
- Yo, patch that because scum still wanna exploit WannaCrypt-linked vuln @ The Register
- Intel looking to bundle motherboard and memory to promote Kaby Lake @ DigiTimes
- IoT needs security, says Microsoft without even a small trace of irony @ The Register
- Humans Accidentally Made a Space Cocoon For Ourselves Out of Radio Waves @ Slashdot
Subject: Editorial | May 18, 2017 - 11:46 AM | Alex Lustenberg
Tagged: youtube tv, western digital, video, Vega, Threadripper, spir-v, ryzen, podcast, opencl, Google VR, EPYC, Core i9, battletech, amd
PC Perspective Podcast #450 - 05/18/17
Join us for AMD Announcments, Core i9 leaks, OpenCL updates, and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the iTunes Store (audio only)
- Google Play - Subscribe to our audio podcast directly through Google Play!
- RSS - Subscribe through your regular RSS reader (audio only)
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Allyn Malventano
Peanut Gallery: Alex Lustenberg
Podcast topics of discussion:
Week in Review:
News items of interest:
Hardware/Software Picks of the Week
Ryan: Gigabit LTE please hurry
Allyn: TriboTEX (nanotech engine oil additive)
Subject: Processors | May 18, 2017 - 01:01 AM | Tim Verry
Tagged: Zen, Vega, ryzen mobile, ryzen, raven ridge, APU, amd
AMD teased its upcoming Zen-based APUs aimed at mobile devices during its Financial Analyst Day where the company revealed the "Raven Ridge" parts will be aptly known as Ryzen Mobile. The Tech Report managed to acquire a couple slides which confirm some of the broader specifications and reveal how they stack up to AMD's latest Bristol Ridge A-Series APUs – at least as far as AMD's internal testing is concerned (which is to say not independently verified yet so take with a grain of salt).
Ryzen Mobile appears to be the new consumer-facing brand name for what has so far been code named "Raven Ridge". These parts will use a Zen-based CPU, Vega GPU, and integrated chipset. Thanks to the slides, it is now confirmed that the Vega-based graphics processor will be on-die. What has not been confirmed is whether the chipset will be on die or on package and exact specifications on CPU cores counts, GPU Compute Units, cache, memory support, and I/O like PCI-E lanes (you know, all the good stuff! heh). Note that rumors so far point towards Raven Ridge / Ryzen Mobile utilizing a single 4-core (8-thread) CCX, per core L2, 8MB shared L3 cache, and a Vega-based GPU with 1024 cores. HBM2 has also been rumored for awhile but we will have to wait for more leaks and/or an official announcement to know for sure if these Ryzen Mobile parts aimed for the second half of 2017 will have that (hopefully!).
With that said, according to AMD, Ryzen Mobile will offer up to 50% better CPU performance, 40% better GPU performance, and will use up to 50% less power than the previous 7th generation (Excavator-based) A-Series APUs (e.g. FX 9830P and A12-9730P). Those are some pretty bold claims, but still within the realm of possibility. Zen and Vega are both much more efficient architectures and AMD is also benefiting from a smaller process node (TSMC 28nm vs Samsung / GlobalFoundries 14nm FinFET). I do wonder how high the APUs will be able to clock on the CPU side of things with 4 GHz seeming to be the wall for most Zen-based Summit Ridge chips, so most of the CPU performance improvement claims will have to come from architecture changes rather than increases in clockspeeds (the highest clocked A-Series Bristol Ridge ran at up to 3.7 GHz and I would expect Raven Ridge to be around that, maybe the flagship part turbo-ing a bit more). Raven Ridge will benefit from the shared L3 cache and, more importantly, twice as many threads (4 vs 8) and this may be where AMD is primarily getting that 50% more CPU performance number from. On the graphics side of things, it looks like Bristol Ridge with its R7 graphics (GCN 3 (Tonga/Fiji on the Desktop)) had up to 512 cores. Again, taking the rumors into account which say that Raven Ridge will have a 1024 core Vega GPU, this may be where AMD is getting the large performance increase from (the core increase as well as newer architecture). On the other hand, the 40% number could suggest Ryzen Mobile will not have twice the GPU cores. I would guess that 1024 might be possible, but running at lower clocks and that is where the discrepancy is. I will admit I am a bit skeptical about the 1024 (16 CU) number though because that is a huge jump... I guess we will see though!
Further, I am curious if Ryzen Mobile will use HBC (high bandwidth cache) and if HBM2 does turn out to be utilized how that will play into the HBC and whether or not we will finally see the fruits of AMD's HSA labors! I think we will see most systems use DDR4, but certainly some SKUs could use HBM2 and that would definitely open up a lot of performance possibilities on mobile!
There is still a lot that we do not know, but Ryzen Mobile is coming and AMD is making big promises that I hope it delivers on. The company is aiming the new chips at a wide swath of the mobile market from budget laptops and tablets to convertibles and even has their sights set on premium thin and lights. The mobile space is one where AMD has struggled with in getting design wins even when they had good parts for that type of system. They will really need to push and hit Ryzen Mobile out of the park to make inroads into the laptop, tablet, and ultrabook markets!
AMD plans to launch the consumer version of Ryzen Mobile in the second half of this year (presumably with systems featuring the new APUs out in time for the holidays if not for the back to school end of summer rush). The commercial SKUs (which I think refers to the Ryzen equivalent of AMD Pro series APUs.Update: Mobile Ryzen Pro) will follow in the first half of 2018.
What are your thoughts on Ryzen Mobile and the alleged performance and power characteristics? Do you think the rumors are looking more or less correct?
- Zen and the Art of CPU Design
- AMD Launching Ryzen 5 Six Core Processors Soon (Q2 2017)
- AMD Vega GPU Architecture Preview: Redesigned Memory Architecture
- The AMD Ryzen 7 1800X Review: Now and Zen
- More Ryzen coverage!
Subject: Storage | May 17, 2017 - 09:57 PM | Allyn Malventano
Tagged: western digital, wdc, WD, Red Pro, red, NAS, helium, HelioSeal, hdd, Hard Drive, 10TB
Western Digital increased the capacity of their Red and Red Pro NAS hard disk lines to 10TB. Acquiring the Helioseal technology via their HGST acquisition, which enables Helium filled hermetically sealed drives of even higher capacities, WD expanded the Red lines to 8TB (our review of those here) using that tech. Helioseal has certainly proven itself, as over 15 million such units have shipped so far.
We knew it was just a matter of time before we saw a 10TB Red and Red Pro, as it has been some time since the HGST He10 launched, and Western Digital's own 10TB Gold (datacenter) drive has been shipping for a while now.
- Red 10TB: $494
- Red Pro 10TB: $533
MSRP pricing looks a bit high based on the lower cost/GB of the 8TB model, but given some time on the market and volume shipping, these should come down to match parity with the lesser capacities.
Press blast appears after the break.
Subject: General Tech | May 17, 2017 - 02:56 PM | Jeremy Hellstrom
Tagged: battletech, paradox, gaming, Kickstarter
The Kickstarter for the new turn based Battletech gaming was wildly successful with 41,733 backers pledging $2,785,537 and now we have even more good news. Paradox Interactive, they of the continual updates and addins to published games have agreed to publish the new Battletech game. Not only does this ensure solid support for players after release but could mean we see a long lineup of expansions after release, Paradox just added another major expansion to EU4 four years after its release. For backers there is even more news, the closed beta will kick off in June and there is a new video of multiplayer gameplay you can watch.
"The long life of these internally developed games is a core part of Paradox’s business model, but the company is also expanding as a publisher. That includes not only third-party originals like Battletech, but ports of existing titles such as Prison Architect on tablet."
Here is some more Tech News from around the web:
- Best Europa Universalis 4 mods @ Rock, Paper, SHOTGUN
- Prey PC Game Review and IQ & Performance Analysis @ BabelTechReviews
- Sega confirms Vanquish is coming to PC, releases 25th May @ HEXUS
- South Park: The Fractured but Whole coming in October @ Rock, Paper, SHOTGUN
- Total Warhammer 2 trailer shows Avatar action @ Rock, Paper, SHOTGUN
Subject: Graphics Cards, Mobile | May 17, 2017 - 02:30 PM | Ryan Shrout
Tagged: snapdragon 835, snapdragon, qualcomm, google io 2017, google, daydream
During the Google I/O keynote, Google and Qualcomm announced a partnership to create a reference design for a standalone Daydream VR headset using Snapdragon 835 to enable the ecosystem of partners to have deliverable hardware in consumers’ hands by the end of 2017. The time line is aggressive, impressively so, thanks in large part to the previous work Qualcomm had done with the Snapdragon-based VR reference design we first saw in September 2016. At the time the Qualcomm platform was powered by the Snapdragon 820. Since then, Qualcomm has updated the design to integrate the Snapdragon 835 processor and platform, improving performance and efficiency along the way.
Google has now taken the reference platform and made some modifications to integrate Daydream support and will offer it to partners to show case what a standalone, untethered VR solution can do. Even though Google Daydream has been shipping in the form of slot-in phones with a “dummy” headset, integrating the whole package into a dedicate device offers several advantages.
First, I expected the free standalone units to have better performance than the phones used as a slot-in solution. With the ability to tune the device to higher thermal limits, Qualcomm and Google will be able to ramp up the clocks on the GPU and SoC to get optimal performance. And, because there is more room for a larger battery on the headset design, there should be an advantage in battery life along with the increase in performance.
The Qualcomm Snapdragon 835 VR Reference Device
It is also likely that the device will have better thermal properties than those using high smartphones today. In other words, with more space, there should be more area for cooling and thus the unit shouldn’t be as warm on the consumers face.
I would assume as well that the standalone units will have improved hardware over the smartphone iterations. That means better gyros, cameras, sensors, etc. that could lead to improved capability for the hardware in this form. Better hardware, tighter and more focused integration and better software support should mean lower latency and better VR gaming across the board. Assuming everything is implemented as it should.
The only major change that Google has made to this reference platform is the move away from Qualcomm’s 6DOF technology (6 degrees of freedom, allowing you to move in real space and have all necessary tracking done on the headset itself) and to Google calls WorldSense. Based on the Google Project Tango technology, this is the one area I have questions about going forward. I have used three different Tango enabled devices thus far with long-term personal testing and can say that while the possibilities for it were astounding, the implementations had been…slow. For VR that 100% cannot be the case. I don’t yet know how different its integration is from what Qualcomm had done previously, but hopefully Google will leverage the work Qualcomm has already done with its platform.
Google is claiming that consumers will have hardware based on this reference design in 2017 but no pricing has been shared with me yet. I wouldn’t expect it to be inexpensive though – we are talking about all the hardware that goes into a flagship smartphone plus a little extra for the VR goodness. We’ll see how aggressive Google wants its partners to be and if it is willing to absorb any of the upfront costs with subsidy.
Let me know if this is the direction you hope to see VR move – away from tethered PC-based solutions and into the world of standalone units.
Subject: Graphics Cards | May 17, 2017 - 01:55 PM | Jeremy Hellstrom
Tagged: nvidia, msi, gt 1030, gigabyte, evga. zotac
The GT 1030 quietly launched from a variety of vendors late yesterday amidst the tsunami of AMD announcements. The low profile card is advertised as offering twice the performance of the iGPU found on Intel Core i5 processors and in many cases is passively cooled. From the pricing of the cards available now, expect to pay around $75 to $85 for this new card.
EVGA announced a giveaway of several GTX 1030s at the same time as they released the model names. The card which is currently available retails for $75 and is clocked at 1290MHz base, 1544 MHz boost and has 384 CUDA Cores. The 2GB of GDDR5 is clocked a hair over 6GHz and runs on a 64 bit bus providing a memory bandwidth of 48.06 GB/s. Two of their three models offer HDMI + DVI-D out, the third has a pair of DVI-D connectors.
Zotac's offering provides slightly lower clocks, a base of 1227MHz and boost of 1468MHz however the VRAM remains unchanged at 6GHz. It pairs HDMI 2.0b with a DVI slot and comes with a low profile bracket if needed for an SFF build.
MSI went all out and released a half dozen models, two of which you can see above. The GT 1030 AERO ITX 2G OC is actively cooled which allows you to reach a 1265MHz base and 1518MHz boost clock. The passively cooled GT 1030 2GH LP OCV1 runs at the same frequency and fits in a single slot externally, however you will need to leave space inside the system as the heatsink takes up an additional slot internally. Both are fully compatible with the Afterburner Overclocking Utility and its features such as the Predator gameplay recording tool.
Last but not least are a pair from Gigabyte, the GT 1030 Low Profile 2G and Silent Low Profile 2G cards. The the cards both offer you two modes, in OC Mode the base clock is 1252MHz and boost clock 1506MHz while in Gaming Mode you will run at 1227MHz base and 1468MHz boost.
Subject: General Tech | May 17, 2017 - 12:30 PM | Jeremy Hellstrom
Tagged: Intel, amd, rumour, release dates, ryzen, skylake-x, kaby lake x, Threadripper, X399, coffee lake
DigiTimes has posted an article covering the probable launch dates of AMD's new CPUs and GPUs as well as Intel's reaction to the release. Not all of these dates are confirmed but it is worth noting as these rumours are often close to those eventually announced. Naples will be the first, with the server chips launching at the end of June but that is just the start. July is the big month for AMD, with the lower end Ryzen 3 chips hitting the market as well as the newly announced 16 core Threadrippers and the X399 chipset. That will also be the month we see Vega's
Founders Frontier Edition graphics cards arrive.
Intel's Basin Falls platform; Skylake-X and Kaby Lake-X along with the associated X299 chipset are still scheduled for Computex reveal and a late June or early August release. Coffee Lake is getting pushed ahead however, it's launch has been moved up to late August instead of the beginning of next year.
Even with Intel's counters, AMD's balance sheet is likely to be looking better and better as the year goes on which is great news for everyone ... except perhaps Intel and NVIDIA.
"Demand for AMD's Ryzen 7- and Ryzen 5-series CPU products has continued rising, which may allow the chipmaker to narrow its losses to below US$50 million for the second quarter of 2017. With Intel also rumored to pay licensing fees to AMD for its GPUs, some market watchers believe AMD may turn profitable in the second quarter or in the third."
Here is some more Tech News from around the web:
- Spitballing the performance of AMD's Vega Frontier Edition graphics card @ The Tech Report
- AMD Financial Analyst Day Lisa Su Presentation @ [H]ard|OCP
- AMD Financial Analyst Day Raja Koduri Presentation @ [H]ard|OCP
- Microsoft goes all Sean Spicer when we ask about WannaCry XP patching @ The Inquirer
- Qualcomm Sues Apple Contract Manufacturers @ Slashdot
- HPE shows off ARM-powered 'The Machine' prototype with 160TB memory @ The Inquirer
- Monoprice Releases Their Mini Delta Printer (On Indiegogo) @ Hack a Day
- Chrome on Windows has credential theft bug @ The Register
- Bell Canada hacked: 2m account details swiped by mystery miscreants @ The Register
- Why Microsoft's Windows game plan makes us WannaCry @ The Register
Subject: Processors | May 17, 2017 - 04:05 AM | Scott Michaud
Tagged: amd, EPYC, 32 core, 64 thread, Intel, Broadwell-E, xeon
AMD has formally announced their EPYC CPUs. While Sebastian covered the product specifications, AMD has also released performance claims against a pair of Intel’s Broadwell-E Xeons. While Intel’s E5-2650 v4 processors have an MSRP of around $1170 USD, each, we don’t know how that price will compare to AMD’s offering. At first glance, pitting thirty two cores against two twelve-core chips seems a bit unfair, although it could end up being a very fair comparison if the prices align.
Image Credit: Patrick Moorhead
Patrick Moorhead, who was at the event, tweeted out photos of a benchmark where Ubuntu was compiled over GCC. It looks like EPYC completed in just 33.7s while the Broadwell-E chip took 37.2s (making AMD’s part ~9.5% faster). While this, again, stems from having a third more cores, this depends on how much AMD is going to charge you for them, versus Intel’s current pricing structure.
Image Credit: Patrick Moorhead
This one chip also has 128 PCIe lanes, rather than Intel’s 80 total lanes spread across two chips.
Subject: Graphics Cards | May 16, 2017 - 07:39 PM | Sebastian Peak
Tagged: Vega, reference, radeon, graphics card, gpu, Frontier Edition, amd
AMD has revealed their concept of a premium reference GPU for the upcoming Radeon Vega launch, with the "Frontier Edition" of the new graphics cards.
"Today, AMD announced its brand-new Radeon Vega Frontier Edition, the world’s most powerful solution for machine learning and advanced visualization aimed to empower the next generation of data scientists and visualization professionals -- the digital pioneers forging new paths in their fields. Designed to handle the most demanding design, rendering, and machine intelligence workloads, this powerful new graphics card excels in:
- Machine learning. Together with AMD’s ROCm open software platform, Radeon Vega Frontier Edition enables developers to tap into the power of Vega for machine learning algorithm development. Frontier Edition delivers more than 50 percent more performance than today’s most powerful machine learning GPUs.
- Advanced visualization. Radon Vega Frontier Edition provides the performance required to drive increasingly large and complex models for real-time visualization, physically-based rendering and virtual reality through the design phase as well as rendering phase of product development.
- VR workloads. Radeon Vega Frontier Edition is ideal for VR content creation supporting AMD’s LiquidVR technology to deliver the gripping content, advanced visual comfort and compatibility needed for next-generation VR experiences.
- Revolutionized game design workflows. Radeon Vega Frontier Edition simplifies and accelerates game creation by providing a single GPU optimized for every stage of a game developer’s workflow, from asset production to playtesting and performance optimization."
From the image provided on the official product page it appears that there will be both liquid-cooled (the gold card in the background) and air-cooled variants of these "Frontier Edition" cards, which AMD states will arrive with 16GB of HBM2 and offer 1.5x the FP32 performance and 3x the FP16 performance of the Fury X.
Radeon Vega Frontier Edition
- Compute units: 64
- Single precision compute performance (FP32): ~13 TFLOPS
- Half precision compute performance (FP16): ~25 TFLOPS
- Pixel Fillrate: ~90 Gpixels/sec
- Memory capacity: 16 GBs of High Bandwidth Cache
- Memory bandwidth: ~480 GBs/sec
The availability of the Radeon Vega Frontier Edition was announced as "late June", so we should not have too long to wait for further details, including pricing.
Subject: Processors | May 16, 2017 - 07:22 PM | Sebastian Peak
Tagged: Zen, Threadripper, ryzen, processor, HEDT, cpu, amd
AMD revealed their entry into high-end desktop (HEDT) with the upcoming Ryzen "Threadripper" CPUs, which will feature up to 16 cores and 32 threads.
Little information was revealed along with the announcement, other than to announce availablility as "summer 2017", though rumors and leaks surrounding Threadripper have been seen on the internet (naturally) leading up to today's announcement, including this one from Wccftech. Not only will Threadripper (allegedly) offer quad-channel memory support and 44 PCI Express lanes, but they are also rumored to be released in a massive 4094-pin package (same as "Naples" aka EPYC) that most assuredly will not fit into the AM4 socket.
Image credit: Wccftech
These Threadripper CPUs follow the lead of Intel's HEDT parts on X99, which are essentially re-appropriated Xeons with higher clock speeds and some feature differences such as a lack of ECC memory support. It remains to be seen what exactly will separate the enthusiast AMD platform from the EPYC datacenter platform, though the rumored base clock speeds are much higher with Threadripper.
Subject: Processors | May 16, 2017 - 06:49 PM | Sebastian Peak
Tagged: Zen, server, ryzen, processor, EPYC, datacenter, cpu, amd, 64 thread, 32 core
AMD has announced their new datacenter CPU built on the Zen architecture, which the company is calling EPYC. And epic they are, as these server processors will be offered with up to 32 cores and 64 threads, 8 memory channels, and 128 PCI Express lanes per CPU.
Some of the details about the upcoming "Naples" server processors (now EPYC) were revealed by AMD back in March, when the upcoming server chips were previewed:
- A highly scalable, 32-core System on Chip (SoC) design, with support for two high-performance threads per core
- Industry-leading memory bandwidth, with 8-channels of memory per "Naples" device. In a 2-socket server, support for up to 32 DIMMS of DDR4 on 16 memory channels, delivering up to 4 terabytes of total memory capacity.
- The processor is a complete SoC with fully integrated, high-speed I/O supporting 128 lanes of PCIe, negating the need for a separate chip-set
- A highly-optimized cache structure for high-performance, energy efficient compute
- AMD Infinity Fabric coherent interconnect for two "Naples" CPUs in a 2-socket system
- Dedicated security hardware
Compared to Ryzen (or should it be RYZEN?), EPYC offers a huge jump in core count and available performance - though AMD's other CPU announcement (Threadripper) bridges the gap between the desktop and datacenter offerings with an HEDT product. This also serves to bring AMD's CPU offerings to parity with the Intel product stack with desktop/high performance desktop/server CPUs.
EPYC is a large processor. (Image credit: The Tech Report)
While specifications were not offered, there have been leaks (of course) to help fill in the blanks. Wccftech offers these specs for EPYC (on the left):
(Image credit: Wccftech)
We await further information from AMD about the EPYC launch.
Subject: Cases and Cooling | May 16, 2017 - 06:05 PM | Jeremy Hellstrom
Tagged: Test Bench, T70-1, PC-T70, open air case, Lian Li, acrylic
Lian Li has designed an open air case with an optional acrylic enclosure to help simulate normal case environs or to protect your components if you build a system you want to showcase. The PC-T70 is primarily designed as a test bench so you can set up a E-ATX, ATX, or Micro-ATX/iTX motherboard and easily swap out components while benchmarking hardware or software. The problem with test benches is one of temperature; most of us set up our systems in enclosed cases and the temperatures experienced will be different than in a case fully exposed to any wafting breeze. Lian Li has overcome this with their optional T70-1, a set of acrylic side pieces and top with mounts for fans or radiators which allow you to simulate a closed case environment when you are reporting on running temperatures.
There is another use for this case which might tempt a different set of users. The case fully exposes your components which makes this a great base to build an impressive mod on, or simply to show off all of those RGB LEDs you paid good money for. The acrylic case ensures that your system cannot be permanently killed by a passing feline as well as providing mounting points for an impressive watercooling setup. You can check out the full PR below the specs and video.
New PC-T70 Test Bench Simulates Any Case Environment Lian Li’s New Modular Bench Transforms for Both Closed-Air and Open-Air Testing
May 16, 2017, Keelung, Taiwan - Lian-Li Industrial Co. Ltd is eager to announce the PC-T70 test bench. After productive collaboration, taking feedback from high-end PC hardware reviewers, Lian Li sought to create a test bench that could both provide unhindered access for enthusiasts who want to rapidly swap hardware, and those who like to use their test benches as a workstation. Lian Li’s latest test bench is its most flexible yet – a sleek, minimal platform for easy hardware swapping, with an optional kit that encloses the bench with radiator mounts and an acrylic cover.
Unobstructed Design for Hardware Swapping
After taking feedback from PC hardware reviewers, Lian Li realized that simplicity was key. The PC-T70 has completely free access, with zero barriers hindering the installation of motherboards and other hardware. Users can even remove the back frame for expansion slots and IO cover if they so choose. Six open pass-throughs are positioned around the motherboard tray to route cables down to the PSU and drive mounts on the floor panel.
Simulate Closed-Air Case Environments for Advanced Testing
With the T70-1 upgrade kit, users can add side panels to the open bench, each mounting two 120mm or 140mm fans or a 240mm or 280mm radiator with removable mesh dust filters. It also includes a back panel, mounting an additional 120mm or 140mm exhaust fan and an acrylic canopy secured by magnetic strips to fully enclose the motherboard compartment, simulating a closed-air environment more representative of regular users – a valuable advantage for hardware reviewers. Every panel is modular and easily taken down, so users can rapidly cycle between closed and open-air setups.
A Bench Built for All Form Factors
The PC-T70 mounts E-ATX, ATX, Micro ATX, and mini ITX motherboards, with eight expansion slots to mount VGA cards as long as 330mm. While enclosed, its CPU cooler clearance is limited to 180mm. The floor panel mounts ATX PSUs as long as 330mm and as many as five 2.5” and one 3.5” drives or one 2.5” and two 3.5” storage drives. Users can also use the floor panel to mount a 360mm radiator, reservoirs, and pumps for custom water cooling loops.
Price and Availability
The PC-T70, including the T70-1 option kit is now available at Newegg for $189.99.
Also available in white.
Subject: General Tech | May 16, 2017 - 01:58 PM | Jeremy Hellstrom
Tagged: gaming chair, corsair, T1 RACE
Corsair have jumped into the gaming chair market, a product we did not see much of which has recently taken off in a big way. The T1 RACE is made of PU leather, also known as bicast leather, so the shiny finish should last quite a while though the feel will not quite the same as a true leather chair, nor will the price be as astronomical. Depending on the type of polyurethane leather they used, this product might be vegan. You can choose between yellow, white, blue or red trim to highlight your chair, or if you prefer you can choose to forego the colours for a purely black chair. It can recline 90° to 180° if you need a moment to lie back, the arm rests can be adjusted for height, width, position and angle and neck and lumbar PU leather pillows are included.
Check out Corsair's page here or the PR just below.
FREMONT, CA – May 16th, 2017 - CORSAIR®, a world leader in enthusiast memory, PC components and high-performance gaming hardware today announced the launch of its first gaming chair, the T1 RACE. Inspired by racing, crafted for comfort and built to last, the T1 Race joins CORSAIR’s award-winning range of mice, keyboards, headsets and mousepads to complete the ultimate gaming experience. Built using a solid steel skeleton and dense foam cushions, the T1 RACE has the strength to ensure a lifetime of sturdiness, while it’s 4D-movement armrests raise, lower, shift and swivel to put gamers in the most comfortable position every time. Styled to turn heads and finished with immaculate attention to detail, the T1 RACE is the gaming chair your desk deserves.
Upholstered in luxurious PU leather on seating surfaces and available in five different colors, T1 RACE lets you choose your seat to match your style, in either Yellow, White, Blue, Red or Black trim, finished with automotive color-matched stitching and base accents. Nylon caster wheels, often an optional upgrade on office and gaming chairs, are included with T1 RACE as standard, ensuring stability and smooth movement on any surface.
T1 RACE’s sculpted race-seat design and included neck and lumbar PU leather pillows provide adjustable support for day-long gaming sessions, while its 4D-moment armrests effortlessly adjust in height, width, position and angle to put your arms precisely where they need to be. A steel construction Class 4 gas lift provides reliable height adjustment, while the seat itself tilts up to 10° and can recline anywhere between 90° to 180°, lying completely flat for when you need to take a break from the action. Finishing the T1 RACE’s attention to detail, the CORSAIR logo is tastefully embroidered into the rear of the chair, and lightly embossed into the headrest for maximum comfort.
Subject: General Tech | May 16, 2017 - 01:27 PM | Jeremy Hellstrom
Tagged: security, microsoft
Microsoft and the NSA have each been blaming the other for the ability of WannaCrypt to utilize a vulnerability in SMBv1 to spread. Microsoft considers the NSA's decision not to share the vulnerabilities which their Eternalblue tool utilizes with Microsoft and various other security companies to be the cause of this particular outbreak. Conversely, the fact is that while Microsoft developed patches to address this vulnerability for versions of Windows including WinXP, Server 2003, and Windows 8 RT back in March, they did not release the patches for legacy OSes until the outbreak was well underway.
Perhaps the most compelling proof of blame is the number of systems which should not have been vulnerable but were hit due to the fact that the available patches were never installed.
These three problems, the NSA wanting to hoard vulnerabilities so they can exploit them for espionage, Microsoft ending support of older products because they are a business and do not find it profitable to support products a decade or more after release and users not taking advantage of available updates have left us in the pickle we find ourselves in this week. On the plus side this outbreak does have people patching, so we have that going for us.
"Speaking of hoarding, though, it's emerged Microsoft was itself stockpiling software – critical security patches for months."
Here is some more Tech News from around the web:
- Ransomware scum have already unleashed kill-switch-free WannaCrypt variant @ The Register
- Intel, Samsung join Apple, FTC firing squad against rival Qualcomm @ The Register
- TSMC capacity utilization ramping up @ DigiTimes
Subject: General Tech | May 16, 2017 - 09:00 AM | Scott Michaud
Tagged: spir-v, opencl, Khronos
Aligning with the start of the International Workshop on OpenCL (IWOCL) 2017 in Toronto, Ontario, Canada, The Khronos Group has published the finalized specification for OpenCL 2.2 and SPIR-V 1.2. The headlining feature for this release is the OpenCL C++ kernel language, which SPIR-V 1.2 fully supports. Kernels are the portion of code that execute on the compute devices, such as GPUs, FPGAs, super computers, multi-core CPUs, and so forth.
The OpenCL C++ kernel language is a subset of the C++14 standard, bringing many of its benefits to these less-general devices. Classes help data and code to be more tightly integrated. Templates help define logic in a general way for whatever data type implements whatever it requires, which is useful for things like custom containers. Lambda expressions make it easy to write one-off methods, rather than forcing the developer to name something that will only be used once, like comparing two data types for a special sort in one specific spot of code.
Exposing these features to the OpenCL device also enables The Khronos Group to further the SYCL standard, which aims for “single-source” OpenCL development. Having the code that executes on OpenCL-compatible devices contain roughly the same features as the host code is kind-of necessary to let them be written together, rather than exist as two pools.
Subject: General Tech | May 15, 2017 - 01:55 PM | Jeremy Hellstrom
Tagged: input, AiZO, MK Retro
Who needs a mechanical keyboard that is inspired by something a mere three decades ago when you can purchase one that looks like a manual typewriter you would see in a museum exhibit? The AZiO MK Retro sports those raised circular keys use AZiO's own OARMY Olive switches, which NikKTech postulates were source from Kailh. If you are desperate for a unique looking keyboard without any sign of RGB-itis, then feast your eyes below and follow that link to the review.
"With the MK Retro typewriter mechanical keyboard AZiO takes us for a trip down memory lane and although it leaves us asking for me we do feel they're on the right track."
Here is some more Tech News from around the web:
- HyperX Alloy FPS Mechanical Keyboard @ techPowerUp
- Corsair Glaive RGB Mouse @ Kitguru
- Roccat Kone Pure Owl-Eye @ techPowerUp
- SteelSeries Rival 700 Elite Performance Gaming Mouse Review @ NikKTech
- EpicGear Morpha X Modular Mouse @ Kitguru
Subject: General Tech | May 15, 2017 - 12:36 PM | Jeremy Hellstrom
Tagged: rumour, Intel, Core i9
A two part rumour circulating the internet this morning, involving new processors and a new naming convention. The leak that The Inquirer posted about this morning reveals six new Intel processors, two Kaby Lake-X processors with four cores running at a base clock of 4GHz or 4.3GHz depending on the model and TDPs of 112W. More interesting are the new Kaby Lake-X processors which are referred to as Core i9 models, running from an i9-7800X @ 3.6GHz base to the i9-7920X which runs at an unspecified speed. All will have four times the L2 cache of the current i7-7700K and Turbo 2.0 Boost Max to increase the frequency of several cores at once as well as Turbo Boost 3.0 for single-threaded workloads.
It will be interesting to see if the Core i7 family continues as an upper middle class of processors with the i9 family replacing it's current standing or if the new processors will be priced like high end Xeons.
"The slide, which an Anandtech forum member claims is an internal Intel document, provides details of four new Skylake-X processors and two Kaby Lake-X CPUs. The Skylake-X processors are described as Core i9, and if the leak is genuinely - and that's a fairly big if - the new Core i9s will replace Core i7s as Intel's top-of the-pile PC chipset range."
Here is some more Tech News from around the web:
- More UPNP woes: Crashable library bites routers and software @ The Register
- Car Security Experts Dump All Their Research and Vulnerabilities Online @ Hack a Day
- Google Tracker 2017—All the stuff Google has in the works ahead of Google I/O @ Ars Technica
- Microsoft, it's not just the NSA. If you want to kill WannaCry, fix broken Windows @ The Inquirer
- Asustek likely to discontinue ZenWatch product line @ DigiTimes
- Toshiba and WD execs sheathe blades, start talking over memory biz @ The Register
- Create Your Own Router and Firewall Solution With pfSense @ eTeknix
- Win a pair of Sony MDR-Z1R headphones worth £2000! @ Kitguru