GIGABYTE Extends USB 3.0 Leadership at CES 2010
Subject: Shows and Expos | January 5, 2010 - 05:17 PM | Jeremy Hellstrom
City of Industry, California, January 4, 2010 - GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce that they will focus on new USB 3.0 SuperSpeed products at CES this year with compatible 3rd party device demos and the introduction of the GA-H57M-USB3 and GA-H55M-USB3 motherboards. These new motherboards are based on yet to be announced chipsets from Intel® and increase GIGABYTE’s range of SuperSpeed USB 3.0 motherboards to an unequalled 13 models. Cementing the company’s leadership in the onboard USB 3.0 motherboard market, GIGABYTE plans to introduce a further 11 motherboard models before the end of January 2010. An extensive list of available and ‘coming soon’ GIGABYTE USB 3.0 products is available here.
Demonstrating its commitment to developing the USB 3.0 ecosystem, GIGABYTE is working with other USB 3.0 device vendors to ensure cross-compatibility between products. With this in mind, GIGABYTE recently launched the USB 3.0 motherboard microsite that lists compatible 3rd party USB 3.0 devices that include an ultra slim USB 3.0 SSD from OCZ, external hard disk drive (HDD) enclosures from Inxtron and DoTop, an HDD docking station from Sharkoon and other USB 3.0 accessories from DoTop. More 3rd party USB devices are currently undergoing testing so watch this space for more exciting new SuperSpeed action.
GIGABYTE is also working with USB 3.0 integrated circuitry (IC) vendors on product compatibility such as Genesyslogic (USB 3.0 to SATA 3Gb/s Bridge Controller). Information about their CES presence and demos using GIGABYTE USB 3.0 motherboards is available from their website.
“We expect USB 3.0 to be a very hot topic at CES this year and it’s really exciting to see all the new applications and devices that have already been preannounced by the media and CES organizers,” commented Tony Liao, Associate VP for North American Sales and Marketing at GIGABYTE Technology Co. Ltd. “With our aggressive USB 3.0 motherboard roadmap and top-to-bottom range of solutions, we are ready to partner-up with every USB 3.0 device vendor in ensuring complete compatibility with GIGABYTE motherboards.”
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