All | Editorial | General Tech | Graphics Cards | Networking | Motherboards | Cases and Cooling | Processors | Chipsets | Memory | Displays | Systems | Storage | Mobile | Shows and Expos
Subject: Memory | June 7, 2017 - 08:49 PM | Tim Verry
Tagged: G.Skill, overclocking, ddr4, x299, liquid nitrogen, computex
Amidst the flood of new product announcements at Computex, G.Skill was busy hosting an overclocking competition where its memory was used to in a record breaking overclock that saw DDR4 memory clocked at an impressive 5,500 MHz. Professional overclocker Toppc broke his 5,000 MHz record from last year with the new overclock that was accomplished on Intel’s X299 platform.
Toppc used a MSI X299 Gaming Pro Carbon AC motherboard, Intel Core X-series processor, G.Skill DDR4 memory built using Samsung 8Gb ICs, and, of course, copious amounts of liquid nitrogen! Looking at the HWBot page, it appears Toppc specifically used an Intel Core i7-7740K (Kaby Lake X) processor and 8GB G.Skill Trident Z RGB RAM (CL 14-14-14-14 stock). Both the CPU and memory modules were cooled with liquid nitrogen for the overclock. The CPU-Z screenshot shows the processor running 1 cores / 2 threads with a 133.06 bus speed. It also shows an 8x multiplier and core speed of 1064.46 but I am questioning whether or not it is accurately reading the Kaby Lake X part correctly as running at those speeds wouldn’t need such exotic cooling – perhaps it is needed to run at the 133.06 bus speed and to keep the memory controller from overheating (or melting hehe).
G.Skill is currently pushing the envelope on standard air cooled DIMMs with a prototype kit hitting 4,800 MHz. The company's CVP Tequila Huang stated in a press release:
“We are seeing amazing overclocking potential for these newly released hardware and we believe that more overclocking benchmark records will be achieved very soon by professional overclockers worldwide."
I am interested to see if it will have any additional headroom in the memory overclocking department and if so how long the 5.5 GHz world record will stand.
JEDEC made the GDDR5X memory standard official almost a year and a half ago where it launched at 10 Gbps and quickly hit 12 Gbps. Set to bridge the gap between GDDR5 and the upcoming GDDR6, the “G5X” standard is quickly catching up to and matching the speeds that GDDR6 will run at.
Specifically, Micron’s Graphics Design Team in Munich was able to achieve an impressive 16 Gbps in their high speed test environment. The team was able to hit 16 Gbps on a “meaningful sampling” of its mass production GDDR5X silicon which makes the feat much more impressive as it means these higher speeds are moving closer to reality than theory. Micron measured a PRBS11 (psuedorandom binary sequence) pattern read at 16 Gbps using an oscilloscope and also showed off a chart that compared the stable data rate timing margin versus data rate from 10 Gbps to 16 Gbps.
In addition to teasing the 16 Gbps memory speed (it will be awhile yet before we see products like graphics cards running memory at those speeds), Micron announced that it expects to being mass productions of GDDR6 chips in early 2018. GDDR6 will see a new (larger) FBGA1180 package, faster base sort speeds (GDDR6 will start at 12Gbps vs G5X's 10Gbps), and moving to a dual channel approach with channels that will have half as many I/O links (GDDR5X is x16/x32 while GDDR6 will be x8/16 per channel). It will be interesting to see how this move will stack up to G5X, but in theory Micron will be able to push clocks even higher (maybe even higher than 16 Gbps) by having more but simpler channels (and it may be easier for graphics card manufacturers to wire up their cards to the memory chips.
SK Hynix, who showed off its first GDDR6 chip at GTC, appears to be following the same I/O design as Micron with two channel memory at x8 or x16 per channel.
Are you ready for faster GDDR5X? Hopefully these new faster G5X chips come out soon to give AMD and NVIDIA a more appealing alternative to HBM and HBM2 for mid-range and high end consumer graphics cards since High Bandwidth Memory seems to still be suffering from limited supply and is holding the GPU guys back on being able to crank up the production lines!
Subject: Memory | June 1, 2017 - 08:30 PM | Tim Verry
Tagged: x299, Trident Z RGB, Threadripper, ryzen, LGA 2066, G.Skill, ddr4, computex 2017, computex
G.Skill was in full force at Computex in Taipei, Taiwan this week with not just one but three systems based on Intel’s new X299 platform each featuring flashy G.Skill Trident Z RGB memory clocked above 4GHz!
Hexus.net got hands-on at Computex 2017.
During the event, G.Skill had three systems set up showing off its newest Trident Z RGB kits running on X299 motherboards. The kits included a 16GB (2 x 8GB) kit running at 4,400 MHz with 19-19-19-39 timings on a Gigabyte X299-SOC Champion motherboard. Moving up to 32GB (2 x 16GB DIMMs), G.Skill showed off a kit running on an ASRock X299 OC Formula board at 4,000 MHz with 17-18-18-38 timings. Finally, G.Skill showed an eight module 64GB kit (8 x 8GB) running at 4,200 MHz with 19-21-21-41 timings on an Asus PRIME X299-Deluxe.
At the event a G.Skill representative made the point to Hexus.net (they have a video of the G.Skill booth) that adding LEDs to memory modules does not have to mean sacrificing performance.
Interestingly, Hexus also saw a demonstration of a prototype Trident Z memory kit (the red/silver non RGB type) running at an extremely impressive 4,800 MHz on an ASRock X299 OC Formula!
It has been a long time since I’ve been excited this about memory, but with all the major players pushing speeds as far as they can and the impending launch of new high-end desktop platforms from AMD and Intel things are about to get interesting!
- Intel Core i9 Announced: 18-core Skylake-X, Kaby Lake-X and X299
- Computex 2017: AMD Threadripper will include 64 lanes of PCI Express 3.0, Demos with Quad Vega FE
- AMD AGESA Update 18.104.22.168 Will Support Configurable Memory Sub Timings And Clockspeeds Up To 4,000 MHz
- Need memory for that dream X299 build? Perhaps Crucial Ballistix Elite DDR4-3466 would do you
- HyperX Introduces Higher Speed DDR4 Memory Kits Up to 4,000 MHz
- Computex 2017: ASUS Announces Prime and TUF Intel X299 Motherboards
Subject: Memory | May 30, 2017 - 04:09 PM | Jeremy Hellstrom
Tagged: crucial, crucial ballistix elite, ddr4-3466
In amongst all the new kit announced at Computex that we can't test yet, it is nice to see a review or three. With the move to DDR4 support, we need to look at what effect frequency has on the new chips; we have certainly learned that Ryzen prefers high frequency RAM but how about an i7-6700k? Benchmark Reviews tested Crucial's Ballistix Elite kit, with timings of 16-18-18 @ 3466MHz with that chip and you can see the full results here. The difference on the Intel system is nowhere near as pronounced as on an AMD system but there is another reason to consider this kit for an Intel build; no RGBs to speak of whatsoever!
"In this article Benchmark Reviews examines Crucial’s Ballistix Elite DDR4 enthusiast memory, which runs at an eye-watering 3466Mhz. We’ll test it against “standard” DDR4 to see what difference this extra performance makes."
Here are some more Memory articles from around the web:
- Corsair's Dominator Platinum Special Edition Torque @ The Tech Report
- Team Group T-Force DARK ROG 3000 MHz DDR4 @ techPowerUp
- GeIL Evo X 16GB DDR4 3000MHz @ Kitguru
- Corsair Vengeance RGB 3000 MHz DDR4 @ eTeknix
Subject: General Tech, Memory, Storage | May 26, 2017 - 10:14 PM | Tim Verry
Tagged: XPoint, Intel, HPC, DIMM, 3D XPoint
Intel recently teased a bit of new information on its 3D XPoint DIMMs and launched its first public demonstration of the technology at the SAP Sapphire conference where SAP’s HANA in-memory data analytics software was shown working with the new “Intel persistent memory.” Slated to arrive in 2018, the new Intel DIMMs based on the 3D XPoint technology developed by Intel and Micron will work in systems alongside traditional DRAM to provide a pool of fast, low latency, and high density nonvolatile storage that is a middle ground between expensive DDR4 and cheaper NVMe SSDs and hard drives. When looking at the storage stack, the storage density increases along with latency as it gets further away from the CPU. The opposite is also true, as storage and memory gets closer to the processor, bandwidth increases, latency decreases, and costs increase per unit of storage. Intel is hoping to bridge the gap between system DRAM and PCI-E and SATA storage.
According to Intel, system RAM offers up 10 GB/s per channel and approximately 100 nanoseconds of latency. 3D XPoint DIMMs will offer 6 GB/s per channel and about 250 nanoseconds of latency. Below that is the 3D XPoint-based NVMe SSDs (e.g. Optane) on a PCI-E x4 bus where they max out the bandwidth of the bus at ~3.2 GB/s and 10 microseconds of latency. Intel claims that non XPoint NVMe NAND solid state drives have around 100 microsecomds of latency, and of course, it gets worse from there when you go to NAND-based SSDs or even hard drives hanging of the SATA bus.
Intel’s new XPoint DIMMs have persistent storage and will offer more capacity that will be possible and/or cost effective with DDR4 DRAM. In giving up some bandwidth and latency, enterprise users will be able to have a large pool of very fast storage for storing their databases and other latency and bandwidth sensitive workloads. Intel does note that there are security concerns with the XPoint DIMMs being nonvolatile in that an attacker with physical access could easily pull the DIMM and walk away with the data (it is at least theoretically possible to grab some data from RAM as well, but it will be much easier to grab the data from the XPoint sticks. Encryption and other security measures will need to be implemented to secure the data, both in use and at rest.
Interestingly, Intel is not positioning the XPoint DIMMs as a replacement for RAM, but instead as a supplement. RAM and XPoint DIMMs will be installed in different slots of the same system and the DDR4 RAM will be used for the OS and system critical applications while the XPoint pool of storage will be used for storing data that applications will work on much like a traditional RAM disk but without needing to load and save the data to a different medium for persistent storage and offering a lot more GBs for the money.
While XPoint is set to arrive next year along with Cascade Lake Xeons, it will likely be a couple of years before the technology takes off. Supporting it is going to require hardware and software support for the workstations and servers as well as developers willing to take advantage of it when writing their specialized applications. Fortunately, Intel started shipping the memory modules to its partners for testing earlier this year. It is an interesting technology and the DIMM solution and direct CPU interface will really let the 3D XPoint memory shine and reach its full potential. It will primarily be useful for the enterprise, scientific, and financial industries where there is a huge need for faster and lower latency storage that can accommodate massive (multiple terabyte+) data sets that continue to get larger and more complex. It is a technology that likely will not trickle down to consumers for a long time, but I will be ready when it does. In the meantime, I am eager to see what kinds of things it will enable the big data companies and researchers to do! Intel claims it will not only be useful at supporting massive in-memory databases and accelerating HPC workloads but for things like virtualization, private clouds, and software defined storage.
What are your thoughts on this new memory tier and the future of XPoint?
- Intel Has Started Shipping Optane Memory Modules
- Intel Optane Memory 32GB Review - Faster Than Lightning
- A Closer Look at Intel's Optane SSD DC P4800X Enterprise SSD Performance
Subject: Memory | May 11, 2017 - 02:43 PM | Jeremy Hellstrom
Tagged: corsair, Corsair Dominator Platinum, ddr4, special edition torque, bulldog, DDR4-3600
Corsair have launched a new limited edition line of DDR4-3600 DIMMs, the DOMINATOR PLATINUM Special Edition Torque. The DIMMs feature brushed black aluminum heatsinks with orange accents and a heat-treated effect top bar. They do indeed feature lighting for the LED addicted and will fit in with your other bright components. They are XMP 2.0 certified for easy setup, or you can overclock to your own preferences as these DIMMs went through comprehensive testing.
As part of the release Corsair contracted case modder Lee Harrington to transform a Bulldog case into a classic hot rod. It has a flaming paint job, pneumatic hood struts, working headlights and a whole lot of Torque; you can see the full gallery here.
You can read the PR below the prices.
FREMONT, CA – May 11th, 2017 - CORSAIR, a world leader in enthusiast memory, high-performance gaming hardware and PC components today announced the immediate availability of its new DOMINATOR PLATINUM Special Edition Torque DDR4 memory. Inspired by those for whom speed is an obsession, each module features a uniquely heat-treated effect top bar, combining the iconic DOMINATOR PLATINUM design with the aesthetic of high-performance engines. Completed by a brushed black aluminum heatsink, stunning built-in lighting and orange accents, each kit is individually numbered using high precision laser engraving, guaranteeing exclusivity. Available in limited quantities, DOMINATOR PLATINUM Special Edition Torque DDR4 memory is built for speed – inside and out.
Fully compatible with the latest Intel® X99 and 200-series motherboards, each module is individually hand screened for added quality assurance and overclocking headroom. For the speed-obsessed looking to push their system to the limit and reach peak performance, DOMINATOR PLATINUM Special Edition’s custom 10-layer PCB provides superior signalling for greater overclocking potential, allowing every DOMINATOR PLATINUM Special Edition Torque module to be safely overclocked to at least 3,600MHz. What’s more, with CORSAIR’s patented DHX cooling technology, the aluminum heat-spreader is built right into the PCB, ensuring rapid heat dissipation and lower temperatures.
To celebrate the launch of DOMINATOR PLATINUM Special Edition Torque, CORSAIR commissioned renowned case modder Lee Harrington to create a chassis worthy of housing these limited edition DDR4 modules. Starting with a CORSAIR BULLDOG SFF kit, Lee created a stunning homage to 60’s hot-rods, complete with flaming paint job, pneumatic hood struts and working headlights. To see more of this amazing system build, check out the full builder’s gallery at the link below.
Subject: Memory | May 4, 2017 - 02:01 PM | Jeremy Hellstrom
Tagged: G.Skill, G.Skill Trident Z, 32GB, ddr4-3200, RGB
What is the point of light emanating from all of your components from keyboard to PSU if your RAM doesn't match? G.Skill realized this is a pressing issue on the minds of enthusiasts everywhere and infected their Trident Z RAM with RGB-itis. The four modules in this 32GB kit have a total of 16 LEDs which can glow together or separately using the G.Skill control utility, which is still in Beta and caused some minor headaches for Kitguru. You can see the lights here, as well as some benchmarks if you are more into that kind of thing.
"Take a really close look and you will see the G.Skill logo is carried on a plastic diffuser that covers the LEDs, instead of the aluminium heat spreader, however that is the only clue that this DDR4 memory packs four RGB LEDs on each module."
Here are some more Memory articles from around the web:
- G.Skill Trident Z 3200 MHz C14 32 GB @ techPowerUp
- 32GB Corsair Vengeance RGB DDR4-3000MHz @ Kitguru
- Crucial Ballistix Elite 3200 MHz DDR4 16 GB @ techPowerUp
Subject: Memory | April 22, 2017 - 04:40 PM | Tim Verry
Tagged: z270, G.Skill Trident Z, G.Skill, dual channel, ddr4
For enthusiasts with a need for speed, G.Skill unleashed a new DDR4 memory kit recently that ratchets up two 8GB modules to 4333 MHz out of the box. The new 16GB kit will soon take the top spot in the company’s Trident Z series and will come with the traditional brushed metal heat spreader with red accent.
The new 16 GB (2 x 8GB sticks) Trident Z memory kit was validated on Intel’s Z270 platform using an Asus ROG Maximus IX Apex motherboard and an overclocked Intel Core i5-7600K. (The processor was clocked at 4200.20 MHz on a x40.0 multiplier and 104.98 MHz bus speed.) The DDR4 kit is running with CAS latencies of 19-19-19-39 and is needs 1.40 volts.
Not content to sit on its laurels, G.Skill is reportedly also working on cranking speeds up even further with a prototype DDR4 kit running at 4400 MHz and a “proof of concept” test of a 16 GB kit running at 4500 MHz. The DDR4-4500 kit is being stress tested while specifications are still under development and it will be “some time” before it is ready for market. G.Skill did manage to at least run Windows and some benchmarks at those RAM clock speeds though using the same Z270 platform listed above (with the Core i5 7600K clocked at 4360.36 MHz on a 108.98 MHz bus and x40.0 multiplier). The benchmark runs reported up to 65 GB/s write speeds, 55 GB/s read speeds, and 52 GB/s copy speeds specifically. DDR4 has come a long way in the speed department to where it is today and apparently still has room to grow.
Unfortunately, as is the case with most announcements of this nature, no official pricing and availability was mentioned. Looking around online, I would expect the 16GB DDR4-4333 kit to come in somewhere around $280 and be available within the next month or so.
I would love to see what a kit this fast would do for Ryzen as far as alleviating the CCX-to-CCX bottleneck over the Infinity Fabric assuming the Ryzen memory controller can handle those speeds! Also, faster memory has helped AMD’s APUs in the past, so these extremely fast kits that are coming out should pair well with AMD's upcoming Raven Ridge though they will need to come down in price a lot to actually meet the budget of a good budget gaming build (right now with the kits in the $250+ range it would be better to just put the premium into a graphics card – though that kind of defeats the purpose of using the APU heh).
Subject: Memory | April 7, 2017 - 03:50 PM | Jeremy Hellstrom
Tagged: Trident Z RGB, intel z270, Intel X99, G.Skill, DDR4-3333MHz, AM4, 128Gb
You did read that correctly, the new Trident Z RGB kit consists of eight 16GB DIMMs which should give you more than enough memory to play with in a variety of ways, including a decent sized RAM drive. There are also some smaller kits available as well as different frequencies, something that Ryzen users should take a peek at as AMD's new chip loves fast RAM. They do not specify AMD support but one would expect to be able to utilize these chips. This particular kit sports timings of CL16-18-18-38 and below you can see the sizes, frequencies and timings of the other Trident Z RGB kits.
As the name implies, these DIMMs do indeed have LEDs on them, supporting a wide variety of colours and with a variety of modes so you can have dynamic lighting effects, if that is your desire. You can see a video of them in action below.
PR below the fold
Subject: Memory | March 8, 2017 - 12:46 AM | Tim Verry
Tagged: ryzen, overclocking, gskill, ddr4, AM4
G.Skill recently announced two new series of DDR4 memory geared towards AMD’s new AM4 platform and Ryzen CPUs. The FORTIS series comes in kits up to 64 GB at 2400 MHz while the Flare X series features kits up to 32 GB at 3466 MHz.
The FORTIS series come in black with graphics on the sides. At launch, there will be kits in 16 GB, 32 GB, and 64 GB capacities clocked at 2,133 and 2,400 MHz. These kits run at 1.2V.
Flare X reportedly uses “carefully selected” IC chips that have been tested and validated for the AM4 platform and Ryzen processors. These kits run at 1.35V out of the box and come in 16 GB, 32 GB, and 64 GB at 3200 MHz with 14-14-14-34 timings or in a 16 GB (2x8GB) kit clocked at 3466 MHz with 16-16-16-36 timings.
It is worth noting that Ryzen officially supports memory up to 3200 MHz without needing to overclock the bus speed using one of eight memory straps/dividers (this is apparently a limitation of the UEFI and not Ryzen's memory controllers). In order to take advantage of DDR4 with higher clocks, you will need to overclock the base clock (which is made easier/possible on motherboards with external clock generators). G.Skill showed two examples using a Ryzen 7 1700 and an Asus Crosshair VI Hero motherboard where they got a 4x16GB kit clocked at 3467MHz (16-16-16-36 CR1) by setting a 25.4 x multiplier and 118.16 MHz bus speed. The other example was DDR4 at 3200 MHz with a multiplier of 28.4 and 119.99 MHz bus speed. It is interesting that they were able to push the bus speed that high while maintaining stability. G.Skill posted two CPU-Z validation screen shots on its news announcement.
G.Skill did not announce pricing, but it did state the new memory kits would be available later this month. Looking around on Newegg, it seems some of the lower speed kits with 4GB DIMMs are available right now but the new kits with higher clocks and 8GB and 16GB DIMMs are not available yet. The less exciting Fortis series does appear to be available though with a 2x8GB 16GB DDR4-2400 priced at $124.99. Even the Fortis series isn’t fully launched yet though since the 2x16GB and 4x16GB kits aren’t listed.
Subject: Storage | February 15, 2017 - 08:58 PM | Allyn Malventano
Tagged: XPoint, ssd, Optane, memory, Intel, cache
We now have an actual Optane landing page on the Intel site that discusses the first iteration of 'Intel Optane Memory', which appears to be the 8000p Series that we covered last October and saw as an option on some upcoming Lenovo laptops. The site does not cover the upcoming enterprise parts like the 375GB P4800X, but instead, focuses on the far smaller 16GB and 32GB 'System Accelerator' M.2 modules.
Despite using only two lanes of PCIe 3.0, these modules turn in some impressive performance, but the capacities when using only one or two (16GB each) XPoint dies preclude an OS install. Instead, these will be used, presumably in combination with a newer form of Intel's Rapid Storage Technology driver, as a caching layer meant as an HDD accelerator:
While the random write performance and endurance of these parts blow any NAND-based SSD out of the water, the 2-lane bottleneck holds them back compared to high-end NVMe NAND SSDs, so we will likely see this first consumer iteration of Intel Optane Memory in OEM systems equipped with hard disks as their primary storage. A very quick 32GB caching layer should help speed things up considerably for the majority of typical buyers of these types of mobile and desktop systems, while still keeping the total cost below that for a decent capacity NAND SSD as primary storage. Hey, if you can't get every vendor to switch to pure SSD, at least you can speed up that spinning rust a bit, right?
Subject: Memory | February 3, 2017 - 08:42 PM | Tim Verry
Tagged: XPoint, server, Optane, Intel Optane, Intel, big data
Last week Hexus reported that Intel has begun shipping Optane memory modules to its partners for testing. This year should see the launch of both these enterprise products designed for servers as well as tiny application accelerator M.2 solid state drives based on the Intel and Micron joint 3D memory venture. The modules that Intel is shipping are the former type of Optane memory and will be able to replace DDR4 DIMMs (RAM) with a memory solution that is not as fast but is cheaper and has much larger storage capacities. The Optane modules are designed to slot into DDR4 type memory slots on server boards. The benefit for such a product lies in big data and scientific workloads where massive datasets will be able to be held in primary memory and the processor(s) will be able to access the data sets at much lower latencies than if it had to reach out to mass storage on spinning rust or even SAS or PCI-E solid state drives. Being able to hold all the data being worked on in one pool of memory will be cheaper with Optane as well as it is allegedly priced closer to NAND than RAM and the cost of RAM adds up extremely quickly when you need many terabytes of it (or more!). Various technologies attempting to bring higher capacity non volatile and/or flash-based storage in memory module form have been theorized or in the works in various forms for years now, but it appears that Intel will be the first ones to roll out actual products.
It will likely be years before the technology trickles down to consumer desktops and notebooks, so slapping what would effectively be a cheap RAM disk into your PC is still a ways out. Consumers will get a small taste of the Optane memory in the form of tiny storage drives that were rumored for a first quarter 2017 release following its Kaby Lake Z270 motherboards. Previous leaks suggest that the Intel Optane Memory 8000P would come in 16 GB and 32 GB capacities in a M.2 form factor. With a single 128-bit (16 GB) die Intel is able to hit speeds that current NAND flash based SSDs can only hit with multiple dies. Specifically the 16GB Optane application accelerator drive is allegedly capable of 285,000 random 4K IOPS, 70,000 random write 4K IOPS, Sequential 128K reads of 1400 MB/s, and sequential 128K writes of 300 MB/s. The 32GB Optane drive is a bit faster at 300,000 4K IOPS, 120,000 4K IOPS, 1600 MB/s, and 500 MB/s respectively.
Unfortunately, I do not have any numbers on how fast the Optane memory that will slot into the DDR4 slots will be, but seeing as two dies already max out the x2 PCI-E link they use in the M.2 Optane SSD, a dual sided memory module packed with rows of Optane dies on the significantly wider memory bus is very promising. It should lie somewhere closer to (but slower than) DDR4 but much faster than NAND flash while still being non volatile (it doesn't need constant power to retain the data).
I am interested to see what the final numbers are for Intel's Optane RAM and Optane storage drives. The company has certainly dialed down the hype for the technology as it approached fruition though that may be more to do with what they are able to do right now versus what the 3D XPoint memory technology itself is potentially capable of enabling. I look forward to what it will enable in the HPC market and eventually what will be possible for the desktop and gaming markets.
What are your thoughts on Intel and Micron's 3D XPoint memory and Intel's Optane implementation (Micron's implementation is QuantX)?
- IDF 2016: Intel To Demo Optane XPoint, Announces Optane Testbed for Enterprise Customers
- Intel Optane (XPoint) First Gen Product Specifications Leaked
- Intel Z270 Express and H270 Express Chipsets Support Kaby Lake, More PCI-E 3.0 Lanes
Subject: Memory, Shows and Expos | January 4, 2017 - 02:13 PM | Jeremy Hellstrom
Tagged: G.Skill, ddr4, ddr4-4266, ddr4-4133, G.Skill Trident Z
Kaby Lake CPUs and the associated Z270 motherboards can handle DDR4 frequencies higher than we have seen previously, good news for overclocking enthusiasts. G.SKILL may be first past the post with new DIMMs, you can pick up their Trident Z DDR4-4266 DIMMs on NewEgg right now, $230 for a 16GB dual channel kit.
This extra speed does come with an associated cost, they rate the voltage of these modules higher than you would expect from DDR4 at 1.4V as opposed to the 1.35 we are accustomed to and you should keep this in mind when shopping for a motherboard. It will be interesting to see if these extremely high frequencies have any noticeable effect in gaming performance however they are already breaking records, 8 world records and 21 global first place records.
You can see the various frequencies and timings currently available, expect to see more companies announcing new DIMMs very soon.
Follow all of our coverage of the show at http://pcper.com/ces!
Subject: Memory | December 23, 2016 - 01:26 PM | Jeremy Hellstrom
Tagged: Vengeance LPX, kaby lake, Intel, DDR4-3600, corsair, core i7 7700k
[H]ard|OCP had a chance to try out Corsair's upcoming Vengeance LPX 3600MHz DDR4 on a Kaby Lake based system. The XMP settings for this DDR4 were 3600MHz with timings @ 18-19-19-39-2T and the system booted with no problems at these defaults, an improvement from some scenarios with Skylake based systems. Running Prime95 for over a day posed no problem for the system, however Memtest86 did until the RAM voltage was bumped up to 1.41v from the default 1.36v at which point it could pass the tests with no problems. This shows some promise for overclocking addicts planning on upgrading to the refreshed Intel chip.
"We were lucky enough to get our hands on a new set of Corsair Vengeance LPX 3600MHz RAM this week and we immediately put it work with the new Intel Kaby Lake Core i7-7700K processor that is to be launched next month."
Here are some more Memory articles from around the web:
- Team Group T-Force Night Hawk 3000 MHz DDR4 @ techPowerUp
- Kingston HyperX Predator DDR4-3000 64 GiB @ Hardware Secrets
- Crucial Ballistix Tactical 3000 MHz DDR4 (4x 8 GB) @ techPowerUp
Subject: Memory | November 5, 2016 - 01:42 AM | Tim Verry
Tagged: G.Skill Trident Z, G.Skill, ddr4
Yesterday G.Skill announced the launch of the soon-to-be fastest DDR4 64 GB kit using 16 GB modules running at 3600 MHz. The new Trident Z kit uses Samsung 8Gb chips and pairs four 16 GB DIMMs supporting XMP 2.0 and CAS latencies of 17-19-19-39.
The DDR4 memory kit features stylized brushed aluminum heatspreaders with red accents similar to those used on existing Trident Z kits. Out of the box the kit runs at 1.35 voilts though overclockers should be able to push them further to eke out a bit more speed beyond the stock 3600 MHz!
Beyond that there is not much to the announcement other than G.Skill claiming the speed crown. Looking online, it seems the previous highest speed offered was 3466 MHz so the new modules are a decent bit faster.
According to G.Skill, the new Trident Z 64GB kit will be available in December. They have not yet released pricing, but I would expect it to MSRP for at least $570 considering G.Skill and Corsair currently have DDR4 3466 MHz 64GB kits priced at $540 and $530 respectively. If you are into overclocking, you can probably save a few bucks and overclock some lower specc'ed memory, but these might be good if you are building a workstation that doesn't need ECC (e.g. a video editing and streaming monster heh).
Subject: Memory | October 17, 2016 - 02:37 PM | Jeremy Hellstrom
Tagged: corsair, Corsair Vengeance LPX, ddr4-3200
This particular Corsair Vengeance LPX kit comes with the Airflow kit, active cooling for your DIMMs which does require a fair amount of clearance around your CPU socket if you intend to install it. If you do not use the active cooling the low profile DIMMs stand a mere 31mm tall, which should fit alongside even the largest heatsinks. This 32GB DDR4-3200MHz kit has default timings of 15-15-15-36, Overclockers Club managed to squeeze out an overclock of 14-16-16-36 @ 3261MHz on this particular kit. Drop by to see the effect that had on performance in the full review.
"Right out of the box, this set of modules delivered excellent performance across each of the tests I ran. From synthetic to real world and finally in the gaming test, these modules delivered better performance overall than even the Dominator platinum modules I just looked at. The tighter primary timings and SPD tuning really brings out the performance potential of this Vengeance LPX 3200MHz 32GB set of modules."
Here are some more Memory articles from around the web:
- G.SKILL Trident Z 3200MHz DDR4 32GB Review @ OCC
- ADATA XPG Dazzle 2800MHz CL17 2x8GB DDR4 Review: Razzle-Dazzle Without The Hassle @ Modders-Inc
- Patriot Viper 4 8GB DDR4 3400MHz Memory Kit Review @ Neoseeker
Subject: General Tech | October 13, 2016 - 03:19 PM | Jeremy Hellstrom
Tagged: terahertz, research, memory
You have probably recently heard of terahertz radiation used to scan physical objects, be it the T-Rays at airports or the the researchers at MIT who are reading books through the covers. There is more recent of news on researchers utilizing the spectrum between frequencies of 0.3THz and 3THz, this time pertaining to RAM cycles and the possibility of increasing the speed at which RAM can flip between a 0 and 1. In theory a terahertz electric field could flip bits 1000 times faster than the electromagnetic process currently used in flash memory. This could also be used in the new prototype RAM technology we have seen, such as MRAM, PRAM or STT-RAM. This is still a long way off but a rather interesting read, especially if you can follow the links from The Inquirer to the Nature submission.
"Using the prototypical antiferromagnet thulium orthoferrite (TmFeO3), we demonstrate that resonant terahertz pumping of electronic orbital transitions modifies the magnetic anisotropy for ordered Fe3+ spins and triggers large-amplitude coherent spin oscillations," the researchers helpfully explained."
Here is some more Tech News from around the web:
- Smart Linux Home Hubs Mix IoT with AI @ Linux.com
- Apple tipped to launch new MacBooks on 27 October @ The Inquirer
- Shadow Warrior 2 Dev Says DRM Makes A Game Worse @ [H]ard|OCP
- Adobe on patch parade to march out 83 bugs @ The Register
- First look at Windows Server 2016: 'Cloud for the masses'? We'll be the judge of that @ The Register
- Shadow Warrior 2 Dev Says DRM Makes A Game Worse @ [H]ard|OCP
- Become Very Unpopular Very Fast With This DIY EMP Generator @ Hack a Day
Subject: Memory | September 28, 2016 - 01:07 PM | Jeremy Hellstrom
Tagged: DOMINATOR PLATINUM Special Edition, corsair, ddr4, ddr4-3200, DHX
Corsair's DOMINATOR PLATINUM Special Edition series comes in 32GB kits, either four 8GB DIMMs or a pair of 16GB DIMMs, in your choice of Chrome or Blackout finishes. All kits are DDR4-3200MHz but with the 10-layer PCB and DHX heatsinks Corsair feels that reaching 3600MHz will be trivial and higher frequencies possible for talented tweakers. They will be available directly from Corsair, $330 for the quad-channel kit and $300 for the dual channel.
You can read the full PR by clicking below.
Subject: Memory | September 2, 2016 - 05:24 PM | Scott Michaud
Tagged: gskill, ddr4
Judging by a quick scan of Newegg USA, G.SKILL is pretty much alone in bringing 8GB DIMMs to speeds above DDR4-3733. They already have a 2x8GB kit in the DDR4-4000 and DDR4-4133 ranges, but they're now introducing a 4x8GB kit into the DDR4-3866 classification. The chip is rated at CL18-19-19-39 when supplied with 1.35V. This is much higher voltage than slower sticks, but, as far as I can tell, pretty good at that speed. It also supports XMP 2.0 to automatically configure your BIOS, which is a bonus.
Granted, I cannot think of too many situations where four channels of high-bandwidth memory will give you any real benefits, apart from obviously a narrow list of overclocking record categories. Current DDR4-capable processors can do up to 16GB DIMMs. Personally, I'd tend to err on the side of slower, denser sticks of RAM. I'm more concerned about leaving everything I want in memory, versus any potential bottlenecks I might introduce in giving my CPU work. That's just me, though. If you have the need for high-bandwidth, quad-channel, DDR4 memory, then here you go.
Pricing has not yet been announced. That said, a 2x8GB DDR4-4000 (the next category up) of the same brand can be found for around $190 USD. 2x8GB DDR4-4133 (the next category above that) is about $220 USD. While those kits contain half the sticks, 2 vs 4, the new kit might be slightly cheaper per stick than these. That's just speculation, though, until retailers show their stock.
Subject: Memory | August 25, 2016 - 02:39 AM | Tim Verry
Tagged: TSV, SK Hynix, Samsung, hot chips, hbm3, hbm
Samsung and SK Hynix were in attendance at the Hot Chips Symposium in Cupertino, California to (among other things) talk about the future of High Bandwidth Memory (HBM). In fact, the companies are working on two new HBM products: HBM3 and an as-yet-unbranded "low cost HBM." HBM3 will replace HBM2 at the high end and is aimed at the HPC and "prosumer" markets while the low cost HBM technology lowers the barrier to entry and is intended to be used in mainstream consumer products.
As currently planned, HBM3 (Samsung refers to its implementation as Extreme HBM) features double the density per layer and at least double the bandwidth of the current HBM2 (which so far is only used in NVIDIA's planned Tesla P100). Specifically, the new memory technology offers up 16Gb (~2GB) per layer and as many as eight (or more) layers can be stacked together using TSVs into a single chip. So far we have seen GPUs use four HBM chips on a single package, and if that holds true with HBM3 and interposer size limits, we may well see future graphics cards with 64GB of memory! Considering the HBM2-based Tesla will have 16 and AMD's HBM-based Fury X cards had 4GB, HBM3 is a sizable jump!
Capacity is not the only benefit though. HBM3 doubles the bandwidth versus HBM2 with 512GB/s (or more) of peak bandwidth per stack! In the theoretical example of a graphics card with 64GB of HBM3 (four stacks), that would be in the range of 2 TB/s of theoretical maximum peak bandwidth! Real world may be less, but still that is many terabytes per second of bandwidth which is exciting because it opens a lot of possibilities for gaming especially as developers push graphics further towards photo realism and resolutions keep increasing. HBM3 should be plenty for awhile as far as keeping the GPU fed with data on the consumer and gaming side of things though I'm sure the HPC market will still crave more bandwidth.
Samsung further claims that HBM3 will operate at similar (~500MHz) clocks to HBM2, but will use "much less" core voltage (HBM2 is 1.2V).
Stacked HBM memory on an interposer surrounding a processor. Upcoming HBM technologies will allow memory stacks with double the number of layers.
HBM3 is perhaps the most interesting technologically; however, the "low cost HBM" is exciting in that it will enable HBM to be used in the systems and graphics cards most people purchase. There were less details available on this new lower cost variant, but Samsung did share a few specifics. The low cost HBM will offer up to 200GB/s per stack of peak bandwidth while being much cheaper to produce than current HBM2. In order to reduce the cost of production, their is no buffer die or ECC support and the number of Through Silicon Vias (TSV) connections have been reduced. In order to compensate for the lower number of TSVs, the pin speed has been increased to 3Gbps (versus 2Gbps on HBM2). Interestingly, Samsung would like for low cost HBM to support traditional silicon as well as potentially cheaper organic interposers. According to NVIDIA, TSV formation is the most expensive part of interposer fabrication, so making reductions there (and somewhat making up for it in increased per-connection speeds) makes sense when it comes to a cost-conscious product. It is unclear whether organic interposers will win out here, but it is nice to seem them get a mention and is an alternative worth looking into.
Both high bandwidth and low latency memory technologies are still years away and the designs are subject to change, but so far they are both plans are looking rather promising. I am intrigued by the possibilities and hope to see new products take advantage of the increased performance (and in the latter case lower cost). On the graphics front, HBM3 is way too far out to see a Vega release, but it may come just in time for AMD to incorporate it into its high end Navi GPUs, and by 2020 the battle between GDDR and HBM in the mainstream should be heating up.
What are your thoughts on the proposed HBM technologies?