OCZ Unveils the PC2-8500 Reaper HPC Series with New Passive Cooling Solution

Subject: Memory | February 22, 2007 - 12:18 PM |
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Sunnyvale, CA—February 21, 2007—OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the OCZ PC2-8500 Reaper HPC Series. This 2GB dual channel kit features the proprietary OCZ Reaper HPC (Heat Pipe Conduit) heatspreader, engineered to deliver superior silent heat dissipation over traditional heatspreaders.

The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.