OCZ Technology Introduces the ReaperX Series, the Ultimate Combination

Subject: Memory | November 7, 2007 - 11:41 AM |

Sunnyvale, CA - November 6, 2007 - OCZ
Technology Group, a worldwide leader in innovative, ultra-high performance and
high reliability memory, today announced the ReaperX memory series, aninnovative memory solution that utilizes highly effective heat transfer
. Re-engineering the Reaper HPC (Heat Pipe Conduit) design, the DDR2
PC2-6400 ReaperX uses a dual metal heatpipe formation to effectively offload
heat and increase stability of memory modules. The unique ReaperX heatspreader
is designed to deliver superior heat dissipation that is more effective than
traditional heatspreaders.

As part of
the award-winning OCZ HPC family, the ReaperX memory series is built with the
same aim of optimal heat dissipation for the best possible overclocking
environment for enthusiasts. Through leading-edge cooling technology and
engineering, ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme
efficiency due to a new dual copper heat pipe design. Each memory chip is in
direct contact with a thermo-conductive pipe that guides the performance robbing
heat away from key memory components and quickly dissipates it through the
aluminum fin array

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