PC Perspective Podcast #525 - Intel Sunny Cove, Radeon Pro Graphics, High-end Snapdragon, and More!

Subject: General Tech | December 13, 2018 - 05:31 AM |
Tagged: Zen 2, Sunny Cove, snapdragon, ryzen 3, ray tracing, radeon pro, podcast, Optane, Intel, edge, chromium, amd, 3dmark

PC Perspective Podcast #525 - 12/12/2018

Our podcast this week features discusion of the new Intel Sunny Cove architecture, Ryzen 3 rumors, the high-end Snapdragon 8cx, an affordable Radeon Pro GPU, and more!

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Check out previous podcast episodes: http://pcper.com/podcast

Today's Podcast Hosts
Jim Tanous
Allyn Malventano
Sebastian Peak
Ken Addison
Josh Walrath
Jeremy Hellstrom
Alex Lustenberg

Show Topics
00:03:21 - AMD Radeon Pro WX8200 Review
00:14:50 - Intel Architecture Day: Sunny Cove, Gen11 iGPU, Foveros
00:27:16 - Ryzen 3 Rumors
00:38:57 - Using a 4K TV as a Monitor
00:43:21 - Snapdragon 8cx
00:57:29 - Microsoft Edge Switching to Chromium
01:03:38 - MSI GTX 1060 with GDDR5X
01:05:40 - 3DMark Port Royal Ray Tracing Benchmark
01:09:03 - Hunting Speculative Execution Vulnerabilities
01:11:38 - 7nm Vega Logo
01:13:49 - Intel Optane DIMM Latency
01:30:45 - The Outer Worlds

Picks of the Week
Jim - Razer Core X
Jeremy - WD Black 1TB NVMe SSD
Josh - LG 29-inch 2560x1080 Monitor
Allyn - Replacement Mice Switches
Sebastian - TekWar

Video News

December 14, 2018 | 11:31 AM - Posted by Sebastian Peak

I wanted to clarify that my recommendation of the TekWar TV series DVD set is based only on my confidence in the legendary William Shatner (of Rescue 911 fame), and not based on any actual experience with this show, or the related film (which isn't even on DVD...for some reason). Thank you.

December 17, 2018 | 12:23 PM - Posted by MoreFlapjacksPerStackAndMoreTicksPerPin (not verified)

Updated JEDEC HBM Standard! They have gone larger with the footprint and 12 high and higher bandwidth, 2.4 Gbps, per pin.

"JEDEC standard JESD235B for HBM leverages Wide I/O and TSV technologies to support densities up to 24 GB per device at speeds up to 307 GB/s. This bandwidth is delivered across a 1024-bit wide device interface that is divided into 8 independent channels on each DRAM stack. The standard can support 2-high, 4-high, 8-high, and 12-high TSV stacks of DRAM at full bandwidth to allow systems flexibility on capacity requirements from 1 GB – 24 GB per stack.

This update extends the per pin bandwidth to 2.4 Gbps, adds a new footprint option to accommodate the 16 Gb-layer and 12-high configurations for higher density components, and updates the MISR polynomial options for these new configurations. Additional clarifications are provided throughout the document to address test features and compatibility across generations of HBM components. " (1)


"JEDEC Updates Groundbreaking High Bandwidth Memory (HBM) Standard

December 17, 2018 11:00 AM Eastern Standard Time"


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