You've got to go deep before you can be extreme, TSMC is moving to 7nm
Subject: General Tech | July 19, 2017 - 12:41 PM | Jeremy Hellstrom
Tagged: TSMC, 7nm, duv, N7, euv
TSMC is preparing for the move to a 7nm process by expanding suppliers and tooling up for Deep UV equipment. Unlike Samsung, who will be using Extreme UV tools for their initial launch of 7nm product in 2018 TSMC have chosen to delay the move to EUV until the technology matures. They will instead use DUV for its launch of their 7nm products, dubbed 7N, in 2018. The difference between the two types of UV is the wavelength, DUV can be produced at 248 and 193 nm while EUV is an impressive 13.5nm, which is why the industry (and ourselves) depend on this process maturing and being adopted by manufacturers. The EUV equipment that is being tested is still relatively new but should produce a better chip in theory, though perhaps not as many usable ones per wafer when first rolled out. You can pop by DigiTimes for a list of the suppliers TSMC is adopting as well as a bit more detail.
"Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according to industry sources."
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