Rounding up CES

Subject: General Tech | January 10, 2019 - 12:37 PM |
Tagged: nvidia, Intel, ces 2019, amd

The Tech Report just posted a nice assortment of updates covering their travels at CES, including their take AMD's new GPU and processors.  They also took a look at Intel's offerings, and not just the fresh splash of seemingly bottomless Coffee, this time without the picture drawn on the top.  What was far more interesting were the lineup of 10nm chips announced, Lakefield for low power applications, Ice Lake mainstream chips and Snow Ridge, an SoC designed for network applications.  Of course, it wouldn't be an Intel briefing without Optane, to which the H10 series was announced, which sports both QLC 3D NAND and 3D XPoint on a M.2 2280 gumstick.  It has a controller for both types of memory which means the bulk of the heavy lifting will be done onboard and not pushed onto your CPU. 

 

View Full Size

"That title probably rests on the shoulders of four upcoming Intel products based on the company's beleaguered 10-nm fabrication process: the Lakefield low-power client processors, the Snow Ridge network SoC, and Ice Lake chips for every market segment."

Here is some more Tech News from around the web:

Tech Talk


January 10, 2019 | 05:28 PM - Posted by AnonymousProcessor (not verified)

Thanks for the round up.

FYI the second link regarding AMD processors is buggy.

January 10, 2019 | 06:18 PM - Posted by Jeremy Hellstrom

It was undergoing an unexpected colonoscopy; test is done now, all clear.

Post new comment

The content of this field is kept private and will not be shown publicly.
  • Lines and paragraphs break automatically.
  • Allowed HTML tags: <a> <em> <strong> <cite> <code> <ul> <ol> <li> <dl> <dt> <dd> <blockquote><p><br>
  • Web page addresses and e-mail addresses turn into links automatically.

More information about formatting options

CAPTCHA
This question is for testing whether you are a human visitor and to prevent automated spam submissions.