Rounding up CES
Subject: General Tech | January 10, 2019 - 12:37 PM | Jeremy Hellstrom
Tagged: nvidia, Intel, ces 2019, amd
The Tech Report just posted a nice assortment of updates covering their travels at CES, including their take AMD's new GPU and processors. They also took a look at Intel's offerings, and not just the fresh splash of seemingly bottomless Coffee, this time without the picture drawn on the top. What was far more interesting were the lineup of 10nm chips announced, Lakefield for low power applications, Ice Lake mainstream chips and Snow Ridge, an SoC designed for network applications. Of course, it wouldn't be an Intel briefing without Optane, to which the H10 series was announced, which sports both QLC 3D NAND and 3D XPoint on a M.2 2280 gumstick. It has a controller for both types of memory which means the bulk of the heavy lifting will be done onboard and not pushed onto your CPU.
"That title probably rests on the shoulders of four upcoming Intel products based on the company's beleaguered 10-nm fabrication process: the Lakefield low-power client processors, the Snow Ridge network SoC, and Ice Lake chips for every market segment."
Here is some more Tech News from around the web:
- Just updated Windows 7? Can't access network shares? It isn't just you @ The Register
- AMD Keynote for CES 2019 – Radeon VII “Vega on 7nm”, Mobile Graphics and an Interesting Zen 2 Benchmark @ Bjorn3d
- Steamer closets, flying cars, robot boxers, smart-mock-cock ban hypocrisy – yes, it's the worst of CES this year @ The Register
- A sampling of networking gear from CES: TP-Link goes Wi-Fi 6, D-Link goes 5G @ Ars Technica
- Lexar reveals the first 1TB SD card you can actually buy @ The Register
- Steam bug sees acclaimed indie games flagged as 'fake' @ The Inquirer
- Don't Expect A New Nvidia Shield Tablet Anytime Soon @ Slashdot