Podcast #503 - Intel i7-8086K, Corsair Void Pro headset, and more!

Subject: General Tech | June 14, 2018 - 03:24 PM |
Tagged: video, zotac, VOID PRO, toshiba, Optane, noctua, logitech, Intel, i7-8086k, G512, corsair, coolermaster, amd, podcast

PC Perspective Podcast #503 - 06/14/18

Join us this week for discussion on Intel i7-8086K, Corsair Void Pro headset, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Ken Addison

Peanut Gallery: Alex Lustenberg

Program length: 1:18:14

Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Picks of the Week:
    1. 1:10:55 Ryan: Transcend USB 3.0 Card Reader for $8!
      1. Can get it in pink for $.01 less!
    2. 1:12:10 Jeremy: Go for the Gold with Corsair’s Crystal Series 460X
    3. 1:13:15 Josh: Whoa...
  4. Closing/outro

Video News

June 14, 2018 | 07:32 PM - Posted by Paul A. Mitchell (not verified)

repeating my comment posted today at YouTube:

Re: NVMe RAID: I honestly don't know what it's going to take for motherboard and CPU manufacturers to realize that NVMe is capable of replacing SATA storage. And, it's now well known that DMI 3.0 forces a low ceiling on NVMe RAID performance. If "4x4" bifurcation support is considered a "premium" feature, for marketing purposes, then at a minimum let's see full support for 4x4 (aka x4/x4/x4/x4) without silly and unnecessary restrictions, like requiring only certain brands of NVMe SSDs. And, forgive me for being blunt, but when Allyn "dangled his dongle" he made a much better statement than reams of text could possibly have done. Hey, folks, NVMe is here to stay. Let's get serious and eliminate all of the hurdles that stand in the way of general-purpose 4x4 support, from the factory. To repeat, there is an obvious engineering elegance that obtains with 4 x NVMe SSDs @ x4 PCIe 3.0 lanes = x16. This elegance will quickly DOUBLE when PCIe 4.0 becomes widespread. As any casual look at recent history will confirm, the PC industry has enjoyed multiple video cards with x16 edge connectors for at least a decade. Solid-state storage deserves the same raw bandwidth, which is painfully NOT available from Intel's DMI 3.0 link. [End of rant]

June 18, 2018 | 09:09 AM - Posted by tjthrowaway (not verified)

For the mailbag: I am curious what model the IBM ThinkPads are that you use on the podcast.

June 18, 2018 | 12:16 PM - Posted by Paul A. Mitchell (not verified)

At YouTube, one comment complained that I wanted to "wipe out SATA". Here's my reply to that comment:

Toms Tech, yes, my comment should not be interpreted to mean that I wish to "wipe out SATA". Forgive me if what I wrote implied that in any way. You are correct: as things stand today, there are too many restrictions preventing a fresh install of Windows (or other OS) to a "4x4" add-in card hosting 4 x M.2 NVMe SSDs. At the Storage Developer Conference back in 2012, we proposed that storage subsystems should "sync" with chipsets. What I would like to see happen with future SATA standards is a similar policy, perhaps one that supports variable transmission speeds e.g. 6G, 8G, 12G and 16G. SATA-IV should also support the 128b/130b "jumbo frame" that is already a feature of PCIe 3.0. For example, a single 8G channel + jumbo frame increases max bandwidth to 985 MB/second, and most quality SATA SSDs are already hitting the current ceiling of 600 MB/second (allowing for controller overhead). As long as SATA remains a single digital channel, it certainly can co-exist with M.2 NVMe devices that use x2 or x4 (or more) PCIe lanes. Indeed, we can now foresee a variety of NVMe add-in cards with x8 and x16 edge connectors. Just yesterday, I emailed to the guys at PCPER.com some links to the ADATA SR2000CP, which uses a PCie 3.0 x8 interface and supports ~6Gb/second READs. Hope this helps.

June 18, 2018 | 12:25 PM - Posted by MoreProcessTweaksOfMaterialsAndElements (not verified)

Looks interesting with GF going with LASER induced Copper Grain Growth and Intel's using Cobolt for some metal layers.

The Fuse/Wikichip article states:

"GlobalFoundries Cu interconnect extension

GlobalFoundries has been working on copper interconnect scalability extension for a while now. This year they are back to talk about their results on laser-induced grain growth within Cu interconnects. They claim a 30% line resistance reduction in Copper interconnects, delivering 15% improvement in RC and IDsat improvement of 2-5%." (1)


"VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers"


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