Podcast #317 - ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!

Subject: General Tech | September 11, 2014 - 02:30 PM |
Tagged: podcast, video, asus, X99, X99 Deluxe, Intel, core m, xeon e5-2600 v3, idf, idf 2014, fortville, 40GigE, dell, 5k, nvidia, GM204, maxwell

PC Perspective Podcast #317 - 09/11/2014

Join us this week as we discuss our ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Josh Walrath, Allyn Malventano, and Morry Tietelman

Program length: 1:33:48

  1. Week in Review:
  2. IDF News:
  3. News items of interest:
  4. Hardware/Software Picks of the Week:
    1. Allyn: Read our IDF news!
  5. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!


Video News

September 11, 2014 | 02:57 PM - Posted by Anonymous (not verified)

The video is unavailable.

September 11, 2014 | 03:04 PM - Posted by funandjam

“PATIENCE YOU MUST HAVE my young padawan” - the video has not finished processing yet

September 11, 2014 | 04:48 PM - Posted by fl_keith (not verified)

the podcast I just got from itunes is the same as last weeks. not bitching, just letting you guys know.

September 11, 2014 | 05:54 PM - Posted by collie

Shoulda left the messed up opening, that was fun

September 11, 2014 | 06:48 PM - Posted by John Z (not verified)


Podcast 317 RSS points to the 316 MP3. Please fix. Am I the only RSS user?

September 11, 2014 | 10:52 PM - Posted by Anonymous (not verified)

The Samsung SSD is a refurb :(

Sorry, but I won't trust my data on any refurb drive, even a Samsung.

September 12, 2014 | 02:28 AM - Posted by Snoman

The audio podcast feed is using last week's mp3 link, causing podcast clients to get last week's episode. Just change the "316" to "317" in that link to get this week's show.

September 14, 2014 | 07:59 PM - Posted by Anonymous (not verified)

About TSVs: I don't think you will see this tech in flash memory since it will probably be too expensive and also mostly unneeded, as Allyn stated. If we switch to PCM or something else with higher performance and higher durability than flash, then this may change. Samsung's vertical flash is only similar in that it requires deep holes to be etched, drilled, laser bored, or whatever. I believe Samsung's process actually manages to etch the holes through a large number of differing layers, which I assume is quite complicated to actually pull off.

As far as I know, most current DRAM is not stacked, so it just uses flip chip (FC) technology without any wire bonding. FC allows for a lot more off chip interconnect than wire bonding since the entire bottom of the chip can be used for interconnect rather than just the edges. Limitations are spacing and size of solder bumps along with any alignment limitations. The TSV connections still require solder micro-bumps or whatever you want to call them. TSV is kind of an evolution of FC tech. With FC, the solder micro-bumps are actually built on the top level of the wafer, then the die is flipped over for bonding to the substrate once the wafer is sliced.

The more die that you stack, the more likely you are to have a defect somewhere, possibly in the final soldering process or under-fill (although I do not know if TSV tech requires under-fill). I don't know where the pricing will be, but I suspect anything beyond a small stack will be prohibitively expensive, at least for a while.

This tech will be great for large (and probably very expensive) memory modules. This will also probably be able to supply sufficient memory for a GPU in a very small number of packages. Nvidia has already shown such a mock-up while talking about their nvlink tech. The image I have seen shows only 4 memory packages on the same substrate as the gpu, and the rest of the card looks like power delivery circuitry. I believe both Nvidia and AMD are working with SK Hynix for HBM. I thought I saw something about Intel working with Micron(?). Anyway, if Intel starts integrating such memory packages on their CPU substrates, then this will essentially solve the bandwidth problem for "integrated graphics" and will immediately take a large chunk of both AMD's and Nvidia's market share. Many people will no longer need a discrete graphics card at this point. This is why it has the possibility to be a highly disruptive technology.

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