VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006

Subject: Cases and Cooling | April 4, 2006 - 04:01 PM |
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Fremont, California, 4th April 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CX700 digital media IGP chipset for the VIA C7® and Eden® processor platforms, the most advanced x86 embedded chipset that integrates all the cutting-edge features of a modern chipset's North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package.

Designed specifically for the embedded market and already adopted by leading industry players, the VIA CX700 will be on display at the VIA booth #1145 and partners' booths at the Embedded Systems Conference show in San Jose, California this week.

Read more about this new chipset at VIA.