Introduction and Background
Back in 2010, Intel threw a bit of a press thing for a short list of analysts and reviewers out at their IMFT flash memory plant at Lehi, Utah. The theme and message of that event was to announce 25nm flash entering mass production. A few years have passed, and 25nm flash is fairly ubiquitous, with 20nm rapidly gaining as IMFT scales production even higher with the smaller process. Last week, Intel threw a similar event, but instead of showing off a die shrink or even announcing a new enthusiast SSD, they chose to take a step back and brief us on the various design, engineering, and validation testing of their flash storage product lines.
At the Lehi event, I did my best to make off with a 25nm wafer.
Many topics were covered at this new event at the Intel campus at Folsom, CA, and over the coming weeks we will be filling you in on many of them as we take the necessary time to digest the fire hose of intel (pun intended) that we received. Today I'm going to lay out one of the more impressive things I saw at the briefings, and that is the process Intel goes through to ensure their products are among the most solid and reliable in the industry.