ARM Unveils "Neoverse" Infrastructure

Subject: General Tech | October 16, 2018 - 01:44 PM |
Tagged: UMC, TSMC, Samsung, Neoverse, cosmos, cortex, arm, Ares, A76, 7nm, 7+nm, 5nm

This morning ARM is announcing their new design and technology push called "ARM Neoverse". Neoverse is aimed at providing scalable solutions utilizing ARM technology from the edge to the core datacenter. ARM obviously is well known for the end user solutions that we see in phones, tablets, and now laptops. What most do not realize is that ARM has a significant reach in much of the infrastructure that powers the entire user experience. ARM currently holds around a 30% marketshare for powering high end routers and switches used at the enterprise level. The type of equipment we are talking about here are not the home routers or generic switches, but rather the heavy lifting units that literally power the internet after the requests get out of users houses or from their mobile devices.
 
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The Neoverse roadmap consists of four platforms stretching from now til 2021. Each platform is expected to receive around a 30% increase in overall performance due to a combination of architectural changes as well as process technology improvements. The current architecture is codenamed "Cosmos" and it is based on current 16nm parts. This is followed by the "Ares" platform which will utilize the latest Cortex A76 designs and 7nm process. In 2020 this will transition to the "Zeus" platform which will leverage the latest improvements in 7nm+ process technologies. Finally they expect to release the "Poseidon" platform in 2021 which will be based on a cutting edge 5nm process.
 
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ARM has been slowly building up their technology base through the past several decades to include more and more functionality and features across their entire portfolio. Of great interest is how seriously ARM considers security. The latest designs include some of the most robust security measures integrated on chips. From TrustZone to CryptoIsland, ARM has a very well thought out and implemented security suite that is absolutely necessary for the next generation of connected devices. This again extends from handheld devices to the depths of the data center. We are surrounded by stories of compromised devices and software, so having the extensive security measures designed from the ground up available to partners helps to cement ARM's place in trusted computing.
 
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The amount of IP available to partners is impressive. ARM not only offers the core technologies of CPUs and GPUs, but also the latest machine learning units and encryption accelerators. The fabric that holds it all together is also flexible and scalable from mobile solutions to 100G+ ethernet. This also includes memory controllers that can scale up to 8 units delivering TBs/sec of bandwidth.
 
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It really is impressive to see how far ARM has come in the past decade since the launch of the first iPhone. What was once considered a small, but still important CPU design firm is now the power behind billions of shipping products that power the mobile experience and beyond. ARM has taken the momentum from its first big successes and is now a major force for change that stretches far beyond those initial mobile and low power products. The Neoverse only adds to this. ARM has already found success in powering much of the infrastructure of our modern day networks, but this is looking to take things to another level. Partners will have access to cutting edge IP and solutions to quickly bring specialized and high performing products to market in very short periods of time.
 
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Going forward we will start hearing more about these Neoverse implementations starting with current Cosmos products and spreading quickly throughout the next year with Ares. ARM has so far continued to execute on their roadmaps and provide new and compelling products to their partners on a yearly basis. This does not look to change anytime soon.
Source: ARM

Podcast #386 - Logitech G810, Phanteks Enthoo EVOLV ITX, GTX 980 Ti VR Edition and more!

Subject: General Tech | February 11, 2016 - 12:27 PM |
Tagged: vr edition, video, UMC, ue4, podcast, phanteks, nvidia, logitech, GTX 980 Ti, g810, evga, enthoo evolv itx, asrtock, arm, amd, 28HPCU

PC Perspective Podcast #386 - 02/10/2016

Join us this week as we discuss the Logitech G810, Phanteks Enthoo EVOLV ITX, GTX 980 Ti VR Edition and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano

Program length: 1:30:34

  1. Week in Review:
  2. 0:36:45 This week’s podcast is brought to you by Casper. Use code PCPER at checkout for $50 towards your order!
  3. News items of interest:
  4. Hardware/Software Picks of the Week
  5. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

Author:
Subject: Editorial
Manufacturer: ARM

28HPCU: Cost Effective and Power Efficient

Have you ever been approached about something and upon first hearing about it, the opportunity just did not seem very exciting?  Then upon digging into things, it became much more interesting?  This happened to me with this announcement.  At first blush, who really cares that ARM is partnering with UMC at 28 nm?  Well, once I was able to chat with the people at ARM, it is much more interesting than initially expected.

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The new hotness in fabrication is the latest 14 nm and 16 nm processes from Samsung/GF and TSMC respectively.  It has been a good 4+ years since we last had a new process node that actually performed as expected.  The planar 22/20 nm products just were not entirely suitable for mass production.  Apple was one of the few to actually develop a part for TSMC’s 20 nm process that actually sold in the millions.  The main problem was a lack of power and speed scaling as compared to 28 nm processes.  Planar was a bad choice, but the development of FinFET technologies hadn’t been implemented in time for it to show up at this time by 3rd party manufacturers.

There is a problem with the latest process generations, though.  They are new, expensive, and are production constrained.  Also, they may not be entirely appropriate for the applications that are being developed.  There are several strengths with 28 nm as compared.  These are mature processes with an excess of line space.  The major fabs are offering very competitive pricing structures for 28 nm as they see space being cleared up on the lines with higher end SOCs, GPUs, and assorted ASICs migrating to the new process nodes.

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TSMC has typically been on the forefront of R&D with advanced nodes.  UMC is not as aggressive with their development, but they tend to let others do some of the heavy lifting and then integrate the new nodes when it fits their pricing and business models.  TSMC is on their third generation of 28 nm.  UMC is on their second, but that generation encompasses many of the advanced features of TSMC’s 3rd generation so it is actually quite competitive.

Click here to continue reading about ARM, UMC, and the 28HPCU process!

Intel has some good news for GLOFO

Subject: General Tech | January 10, 2014 - 12:18 PM |
Tagged: UMC, SoFIA, Intel, GLOBALFOUNDRIES, atom, 28nm

GLOBALFOUNDRIES will be the primary supplier of Intel's 28nm baseband chips according to this unconfirmed report at DigiTimes.  It seems that Intel really is moving towards a new business model and will be outsourcing some of their upcoming chips to both GLOFO and UMC.  Their 28nm PolySiON process will be used to make the next generation of baseband transmitter chips and the new Atom SoC for cellphones and phablets will use TSMC's 28nm HKMG process.  The higher end Broxton SoCs will remain at Intel and use their FinFET process.  This is a big win for GLOFO and could mean the beginning of a lasting partnership with what was once an AMD asset.

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"Intel has contracted Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its forthcoming Atom mobile processor series codenamed SoFIA, and also placed orders for entry-level baseband chips with Globalfoundries and United Microelectronics (UMC), according to industry sources."

Here is some more Tech News from around the web:

Tech Talk

Source: DigiTimes
Author:
Subject: Editorial
Manufacturer:

The Really Good Times are Over

We really do not realize how good we had it.  Sure, we could apply that to budget surpluses and the time before the rise of global terrorism, but in this case I am talking about the predictable advancement of graphics due to both design expertise and improvements in process technology.  Moore’s law has been exceptionally kind to graphics.  We can look back and when we plot the course of these graphics companies, they have actually outstripped Moore in terms of transistor density from generation to generation.  Most of this is due to better tools and the expertise gained in what is still a fairly new endeavor as compared to CPUs (the first true 3D accelerators were released in the 1993/94 timeframe).

The complexity of a modern 3D chip is truly mind-boggling.  To get a good idea of where we came from, we must look back at the first generations of products that we could actually purchase.  The original 3Dfx Voodoo Graphics was comprised of a raster chip and a texture chip, each contained approximately 1 million transistors (give or take) and were made on a then available .5 micron process (we shall call it 500 nm from here on out to give a sense of perspective with modern process technology).  The chips were clocked between 47 and 50 MHz (though often could be clocked up to 57 MHz by going into the init file and putting in “SET SST_GRXCLK=57”… btw, SST stood for Sellers/Smith/Tarolli, the founders of 3Dfx).  This revolutionary graphics card at the time could push out 47 to 50 megapixels and had 4 MB of VRAM and was released in the beginning of 1996.

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My first 3D graphics card was the Orchid Righteous 3D.  Voodoo Graphics was really the first successful consumer 3D graphics card.  Yes, there were others before it, but Voodoo Graphics had the largest impact of them all.

In 1998 3Dfx released the Voodoo 2, and it was a significant jump in complexity from the original.  These chips were fabricated on a 350 nm process.  There were three chips to each card, one of which was the raster chip and the other two were texture chips.  At the top end of the product stack was the 12 MB cards.  The raster chip had 4 MB of VRAM available to it while each texture chip had 4 MB of VRAM for texture storage.  Not only did this product double performance from the Voodoo Graphics, it was able to run in single card configurations at 800x600 (as compared to the max 640x480 of the Voodoo Graphics).  This is the same time as when NVIDIA started to become a very aggressive competitor with the Riva TnT and ATI was about to ship the Rage 128.

Read the entire editorial here!