Podcast #468 - AMD Raven Ridge rumors, Intel and Global Foundries new fabrication technology!

Subject: General Tech | September 21, 2017 - 12:43 PM |
Tagged: z270, windows 10, WD, video, toshiba, ShadowPlay, ryzen, podcast, nvidia, nuc, msi, max-q, Intel, gs63vr, GLOBALFOUNDRIES, gigabyte, EPYC, ansel, 2500U, 12TB

PC Perspective Podcast #468 - 09/21/17

Join us for discussion on AMD Raven Ridge rumors,  Intel and Global Foundries new fabrication technology!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Josh Walrath, Sebastion Peak, Allyn Malventano

Peanut Gallery: Ken Addison, Alex Lustenberg

Program length: 1:39:59

Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
  4. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

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Toshiba Negotiating With Bain Capital For Sale of Its NAND Manufacturing Arm

Subject: General Tech, Storage | September 14, 2017 - 10:32 AM |
Tagged: western digital, toshiba, nand, flash memory, bain capital

Toshiba remains in a financial crisis in the aftermath of massive losses in its Westinghouse US Nuclear power division and has been attempting to sell off its still very much profitable NAND flash manufacturing business to compensate and right the company to avoid being delisted from the Tokyo Stock Exchange. Unfortunately for Toshiba it has now missed three target dates for selling off the business. Not for lack of suitors, but primarily because of legal issues resulting from anti-trust concerns as well as legal battles brought by Western Digital  – who Toshiba is in a joint venture with for flash manufacturing in Japan – to attempt to prevent the sale.

XG5_front_angled_2_small.png

Jumping to the present, Toshiba has decided to proceed with the negotiations with an investment group led by Bain Capital despite disappointment (and more legal objections) from Western Digital who tried to block similar negotiations back in June. On Wednesday, it was revealed that Toshiba had signed a “memorandum of understanding” and is engaging in private talks to negotiate the sale with an investment group led by Bain Capital and including SK Hynix (who is allegedly only providing financing at this point and not going after a stake in the business to try to avoid further delaying the sale from increased anti-trust red tape), Apple, Dell, Seagate, and two Japanese government controlled entities known as Innovation Network Corp and Development Bank of Japan (again, Bain Capital is offering them the chance to invest post any WD concessions and legal battles in the business to improve chances of the sale going through). As the preferred (by Toshiba) buyer, the Bain Capital-lead group deal is reportedly worth nearly 2.4 trillion Yen ($22 billion USD) including $1.8 billion earmarked for infrastructure. The company expects come to an agreement in late September and is hoping that it will be able to finalize the sale by March so that it can avoid reporting negative net worth and risking being de-listed from the Tokyo Stock Exchange and being cut off from a huge swath of public investors and capital.

Due to the negotiations being private, details are not readily available yet. It is not clear whether Toshiba will be able to pull it off or what the implications will be for the market if it does. (With Toshiba being the world’s second largest flash memory supplier, whoever ends up acquiring the company is going to have a lot of influence on the market and flash technology R&D.) It certainly seems Toshiba’s battle to right itself is going to continue into next year and Western Digital is not going to make it easy. The US-based WD stated:

“We are disappointed that Toshiba would take this action. Our goal has been — and remains — to reach a mutually beneficial outcome that satisfies the needs of Toshiba and its stakeholders.”

A California court has reportedly ordered Toshiba to give Western Digital two weeks’ notice of any deal with the consortium and its two previous arbitration requests through ICC are still pending resolution. Barrons reports that Toshiba may convince WDC to allow the sale if it gives its joint venture partner enough concessions such as an assured long term NAND supply contract and agreed participation in joint Fab projects that would protect SanDisk's contractual rights. Other interested parties for the sale include Foxconn and Western Digital itself. Perhaps SoftBank or the $100 Billion Vision Fund will come in and scoop it up as well.

[Opinions follow heh] I am interested to see how it all will eventually shake out. It remains less than ideal to see Toshiba must sell it off and have the market possibly lose a big flash memory player as the market share power gets more consolidated if it does get picked up by an existing memory manufacturer (see: hard drives, flash memory seems to be going through the same consolidation of companies from lots of little players into fewer bigger ones). I am not certain on the deal specifics as far as ownership and control of TMC and any cash only vs equity splits but with Japanese investors as part of all three bidding / competing consortiums it seems at least part of the business (if only money from it if not voting power) will remain rooted in Japan even if not under the Toshiba brand.

Also read:

 

Source: Tech Report

Podcast #460 - ASUS Max-Q, Surface vs. iPad, AMD Q2 Results, and more!

Subject: General Tech | July 27, 2017 - 01:34 PM |
Tagged: ZM-K900M, Zephyrus, zalman, XG5, x370, video, usb 3.2, toshiba, Threadripper, Surface Pro, ryzen, ROG, RGB, podcast, max-q, ipad pro, GX501, EKWB, Crosshair VI, crimson relive, asus, AMD4, amd

PC Perspective Podcast #460 - 07/27/17

Join us for ASUS Max-Q, Surface vs. iPad, AMD Q2 Results, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Allyn Malventano

Peanut Gallery: Ken Addison, Alex Lustenberg, Jim Tanous

Program length: 1:37:41

 
Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
    1. 1:27:00 Allyn: Damn cheap 8TB drives (8TB Helium filled Reds!) ($160)
    2. 1:32:46 Alex: Bullet Bouquets - now with engraving!
  4. Closing/outro
 

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A new challenger appears; Toshiba's XG5 is hot on Samsung's heels

Subject: Storage | July 24, 2017 - 05:01 PM |
Tagged: toshiba, ssd, ocz, NVMe, nand, M.2, XG5, BiCS, 64-Layer

We first saw Toshiba's XG5 M.2 SSD at Computex this year but as of yet we have not had a chance to review it.  The Tech Report on the other hand did get their mitts on the 512GB model of this drive and they put it through its paces in this review right here.  Their results show a drive that beats OCZs' RD400 across the board and is impinging on Samsung's 960 Pro and EVO, though they are not quite there yet.  The next generation will improve on performance which should spur Samsung to new heights with their next NVMe product.  At the start of the article is some history on the current state of Toshiba which is worth checking out if you are not familiar with what is going on there.

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"Toshiba's XG5 NVMe SSD is shipping to the company's OEM partners now. We run it through our test suite to see if the company's newfangled 64-layer BiCS NAND helps it compete with the best in the business."

Here are some more Storage reviews from around the web:

Storage

Sadly not a NAND gate; even if some of these RAM rumours are false we are in for shortages

Subject: General Tech | July 6, 2017 - 12:33 PM |
Tagged: ram, micron, rumour, SK Hynix, toshiba

As is tradition, after we received hopeful news yesterday about Samsung's investing in the expansion of their flash production we now have bad news out of Micron.  DRAMeXchange reported a nitrogen leak in Micron's Taoyuan fab which prompted an evacuation and the possible stillbirth of ~60,000 wafer starts, or about 5.5% cut in the amount of RAM available by the end of the month.  Trendforce also reported the same incident and numbers

Micron has released a statement contradicting these stories, stating that while there was an incident, there was no real impact to the business or to employees.  One hopes that is the more accurate report as that particular Fab produces LPDDR4, which is already in high demand and short supply.  Indeed, another story mentions that SK Hynix and Toshiba's 3D NAND production was well below expectations and that the supply of NAND for iPhones may fall short by as much as 30%.

This would imply that any impact on Micron's RAM production, even if nowhere near the amount mentioned by the press, would have a large effect on the market in the coming quarters.  Samsung will certainly try to capture some of this demand, but the upgrades to their Fabs are still a while off and they are already operating at close to maximum capacity.   Fingers crossed we don't hear bad news from GLOFO tomorrow morning!

high_res_16nm_nand_wafer.jpg

"Micron Technology has issued a statement regarding recent reports about its fabrication facility in Taoyuan, Taiwan. Micron clarified that there was no nitrogen leaking incident nor evacuation of personnel. A minor event did occurred at the facility, but operations are recovering speedily without material impact to the business."

Here is some more Tech News from around the web:

Tech Talk

 

Source: DigiTimes

Toshiba and Western Digital announce QLC and 96-Layer BiCS Flash

Subject: Storage | June 28, 2017 - 09:49 PM |
Tagged: wdc, WD, toshiba, QLC, nand, BiCS, 96-layer, 3d

A couple of announcements out of Toshiba and Western Digital today. First up is Toshiba announcing QLC (4 bit per cell) flash on their existing BiCS 3 (64-layer) technology. QLC may not be the best for endurance as the voltage tolerances become extremely tight with 16 individual voltage states per cell, but Toshiba has been working on this tech for a while now.

FMS-QLC.jpg

In the above slide from the Toshiba keynote at last year's Flash Memory Summit, we see the use case here is for 'archival grade flash', which would still offer fast reads but is not meant to be written as frequently as MLC or TLC flash. Employing QLC in Toshiba's current BiCS 3 (64-layer) flash would enable 1.5TB of storage in a 16-die stack (within one flash memory chip package).

roadmap.png

Next up is BiCS 4, which was announced by Western Digital. We knew BiCS 4 was coming but did not know how many layers it would be. We now know that figure, and it is 96. The initial offerings will be the common 256Gbit (32GB) capacity per die, but stacking 96 cells high means the die will come in considerably smaller, meaning more per wafer, ultimately translating to lower cost per GB in your next SSD.

While these announcements are welcome, their timing and coordinated launch from both companies seems odd. Perhaps it has something to do with this?

Toshiba's new 64 layer NVMe drive takes the cake

Subject: Storage | June 28, 2017 - 02:12 PM |
Tagged: Toshiba XG5, toshiba, ssd, NVMe, nand, M.2, BiCS, 64-Layer

We first heard about the Toshiba XG5 1TB NVMe SSD at Computex, with its 64 layer BiCS flash and stated read speeds of 3GB/s, writes just over 2 GB/s.  Today Kitguru published a review of the new drive, including ATTO results which match and even exceed the advertised read and write speeds.  Their real world test involved copying 30GB of movies off of a 512GB Samsung 950 Pro to the XG5, only Samsung's new 960 lineup and the OCZ RD400 were able to beat Toshiba's new SSD.  Read more in their full review, right here.

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"The Toshiba XG5 1TB NVMe SSD contains Toshiba's newest 3D 64-Layer BiCS memory and our report will examine Toshiba's newest memory, as well as their newest NVMe controller to go along with it."

Here are some more Storage reviews from around the web:

Storage

Podcast #452 - Computex Special

Subject: General Tech | June 1, 2017 - 12:33 PM |
Tagged: x299, WD, VROC, video, Vega, toshiba, Threadripper, snapdragon 835, ryzen mobile, qnap, podcast, nvidia, msi, max-q, Killer xTend, Intel, evga, Core i9, asus, asrock, arm, amd, agesa, a75, A55

PC Perspective Podcast #452 - 01/01/17

Join us for talk about Computex 2017 and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Allyn Malventano

Peanut Gallery: Alex Lustenberg, Ken Addison

Program length: 2:07:12
 
Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
    1. Intel news
    2. AMD news
      1. 0:55:00 RX Vega pushed to end of July (SIGGRAPH), FE on June 27th
    3. NVIDIA news
    4. ARM news
    5. Storage news
    6. New notebooks
  3. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

Computex 2017: Toshiba Launches XG5 NVMe Client SSD With 64-Layer BiCS Flash

Subject: Storage | May 30, 2017 - 09:00 AM |
Tagged: toshiba, ssd, ocz, NVMe, nand, M.2, computex 2017, BiCS, 64-Layer

Last night we saw WD launch the first client SSDs with 64-layer NAND Flash, but recall that WD/SanDisk is in partnership with Toshiba to produce this new gen 3 BiCS memory, which means Toshiba is also launching their own product wrapped around this new high-density flash:

XG5_front_angled_2_small.png

Enter the Toshiba XG5. It is certainly coming on strong here, as evidenced by the specs:

specs.png

Unlike the WD/SanDisk launch, the BiCS flash on this Toshiba variant sits behind an NVMe SSD controller, with stated read speeds at 3GB/s and writes just over 2 GB/s. We don't yet have random performance figures, but we expect it to certainly be no slouch given the expected performance of this newest generation of flash memory. Let's take a quick look at some of the high points there:

BiCS.png

Alright, so we have the typical things you'd expect, like better power efficiency and higher endurance, but there is a significant entry there under the performance category - 1-shot, full sequence programming. This is a big deal, since writing to flash memory is typically done in stages, with successive program cycles nudging cell voltages closer to their targets with each pass. This takes time and is one of the main things holding back the write speeds of NAND flash. This new BiCS is claimed to be able to successfully write in a single program cycle, which should translate to noticeable improvements in write latency.

BiCS-FMS.png

Another thing helping with writes is that the XG5 will have its BiCS flash operating in a hybrid mode, meaning these are TLC SSDs with an SLC cache. We do not have confirmed cache sizes to report, but it's a safe bet that they will be similar to competing products.

We don't yet have pricing info, but we do know that the initial capacity offerings will start with 256GB, 512GB, and 1TB offerings. The XG5 is launching in the OEM channel in the second half of 2017. While this one is an OEM product, remember that OCZ is Toshiba's brand for client SSDs, so there's a possibility we may see a retail variant appear under that name in the future.

Press blast after the break.

Source: Toshiba

Podcast #435 - Qualcomm aptX, FSP Twin 500w PSU, Micro 5100 Enteprise SSDs, AMD Fiscal Results, ASUS Tinker Board, ZeniMax

Subject: Editorial | February 2, 2017 - 10:34 AM |
Tagged: podcast, zenimax, UHD Blu-Ray, toshiba, tinker board, Reundant PSU, qualcomm, micron, Laser Networking, fsp, enterprise ssd, DirectX, delidding, asus, aptX, amd

PC Perspective Podcast #435 - 02/02/17

Join us this week as we discuss Qualcomm aptX, FSP Reundant PSUs, Micron Enterprise SSDs, 5G LTE, AMD Fiscal Year, ZeniMax lawsuit, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Allyn Malventano, Ken Addison, Josh Walrath, Jermey Hellstrom, Sebastian Peak

Program length: 1:46:22

Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
  4. Closing/outro
 

Source: