Motherboard manufacturer Biostar is expanding its solid state drive lineup with the launch of the M500 M.2 2280 SSD which appears to be the company’s first PCI-E NVMe SSD (it is not the first M.2 but those drives used SATA). The new Biostar M500 SSD uses 3D TLC NAND flash and supports NVMe 1.2 protocol and the PCI-E x2 interface. The exact controller and flash chips used have not yet been revealed, however.
Biostar continues its gamer / racing aesthetics with the new drive featuring a black heatsink with two LEDs that serve a utilitarian purpose. One LED shows the temperature of thebdrive at a glance (red/yellow/green) while the other LED shows data transmit activity and also shows which PCi-E mode (2.0 / 3.0) the drive is in.
The M500 SSD uses up to 1.7W while reading. it comes in four SKUs including 128 GB, 256 GB, 512 GB, and 1TB capacities with either 256 MB. 512 MB, or 1 GB of DDR3L cache respectively.
As far as performance is concerned, Biostar claims up to 1,700 MB/s sequential reads and 1,100 MB/s sequential writes. Further, the drives offer up to 200K random read IOPS and 180K random write IOPS. Of course, these numbers are for the top end 512 GB and 1 TB drives and the lower capacity models will have less performance as they have less cache and flash channels to spread reads and writes from/to.
|SSD Capacity||Max Sequential Read||Max Sequential Write||Read IOPS||Write IOPS||Price|
|128 GB||1,500 MB/s||550 MB/s||200K||180K||$59|
|256 GB||1,600 MB/s||900 MB/s||200K||180K||$99|
|512 GB||1,700 MB/s||1,100 MB/s||200K||180K||$149|
|1 TB||1,700 MB/s||1,100 MB/s||200K||180K||$269|
According to Guru3D, Biostar’s M500 M.2 drives will be available soon with MSRP prices of $59 for the 128 GB model, $99 for the 256 GB model, $149 for the 512 GB drive, and $269 for the 1 TB SKU. The pricing does not seem terrible though the x2 interface does limit its potential / usefulness. They are squarely budget SSDs aimed at computing with SATA SSDs and enticing upgrades from mechanical drives. They may be useful for upgrading older laptops where a x4 M.2 slot would not be wasted like on a desktop machine.
What do you think about Biostar’s foray into NVMe solid state drives?
Subject: Storage | April 6, 2018 - 03:33 PM | Jeremy Hellstrom
Tagged: SSD EX920, NVMe, hp, tlc, SM2622, M.2
HP have released a new NVMe M.2 SSD, the EX920 which uses Silcon Motion's SM2622 controller and a DDR3-1600 cache which scales directly with the size of the drive, the 256GB drive has a 256MB cache while the 2TB has 2GB. The drive uses four PCIe Gen 3 lanes, which offers some very impressive performance, Benchmark Reviews measured 3183/1776 MBps read/write in CrystalDiskMark. The only real drawback to this drive is the warranty; while most companies offer at least five years, this HP drive is only covered for three.
"HP suggests sustained sequential read speeds up to 3200 MB/s, and sustained sequential writes up to 1800 MB/s from their 1TB EX920 SSD, which utilizes 64-layer 3D NAND to deliver impressive storage density and reliability. Relative to solid state storage, one terabyte is an enormous amount of near-instant drive capacity. We’ll see if HP’s EX920 M.2 SSD is worth the money."
Here are some more Storage reviews from around the web:
- HP EX920 1 TB M.2. SSD @ Guru of 3D
- HP EX920 M.2 NVMe SSD @ The SSD Review
- SK hynix SC311 512GB SSD @ Kitguru
- WD Black & SanDisk Extreme Pro M.2 NVMe SSD @ The SSD Review
- Kingston KC1000 240 GB @ TechPowerUp
- Plextor M9Pe(Y) @ Kitguru
- SanDisk Extreme Portable @ The SSD Review
Subject: Storage | April 5, 2018 - 03:38 AM | Tim Verry
Tagged: toshiba, tlc, phison, NVMe, kingston, BiCS3, 3d nand
Kingston is continuing its push into NVMe SSDs with its new A1000 series. The budget parts are positioned as mechanical drive alternatives. These drives use a lower cost PCI-E x2 interface and are single sided with the M.2 2280 (80mm) form factor. Kingston is using the four channel Phison E8 PS5008-E8 controller with DRAM cache along with Kingston branded TLC 3D NAND flash (SSD Review's sample reportedly used Toshiba's BICS3 256Gb flash).
The A1000 series (PDF) comes in 240 GB, 480 GB, and 960 GB capacities. They offer up to 1500 MB/s sequential reads across all capacities and the other performance characteristics varying according to the capacity and number of flash dies used. The 960 GB drive is the fastest with up to 1,000 MB/s sequential writes, 120,000 random read IOPS, and 100,000 random write IOPS. The 480GB drive is a bit slower at 900 MB/s sequential writes, 100,000 random read IOPS, and 90,000 random write IOPS. Finally, the lowest capacity 240 GB SSD hits up to 800 MB/s sequential writes, 100,000 random read IOPS, and 80,000 random write IOPS. As far as endurance, Kingston rates all three capacities at the same 1 million hours MTBF and 150 TBW for the 240 GB, 300 TBW for the 480 GB, and 600 TBW for the 960 GB solid state drive. Kingston warranties the drives for five years which is nice to see on a budget drive.
|240 GB||480 GB||960 GB|
|Sequential Read||1,500 MB/s||1,500 MB/s||1,500 MB/s|
|Sequential Write||800 MB/s||900 MB/s||1,000 MB/s|
|Endurance Rating||150 TBW||300 TBW||600 TBW|
Kingston's A1000 SSDs use the NVMe 1.3 protocol but they are limited by the x2 PCI-E interface, especially where reads are concerned. Kingston is pricing the drives at MSRPs of $119.99 for the 240 GB, $219.99 for the 480 GB, and $402.99 for the 960 GB drive which does seem a bit on the pricier side of things but we'll have to wait a bit to see how retail pricing shakes out to say for sure. For example, looking on Amazon, the MSRPs of the A1000 drives are close to the retail pricing of Kingston's faster KC1000 SSDs which makes me think the street prices may come in lower than shown above (hopefully). In any case, the A1000 drives should be available soon as reviews have already begun popping up online.
Subject: Storage | February 7, 2018 - 10:03 PM | Tim Verry
Tagged: tlc, SK Hynix, enterprise ssd, 72-layer tlc, 3d-v4, 3d nand
SK Hynix has revealed its new enterprise solid state drives based on 72-layer 512 Gb 3D TLC NAND flash dies paired with the company's own in-house controller and firmware. The SK Hynix eSSDs are available in a traditional SAS/SATA interfacing product with capacities up to 4TB and a PCI-E variant that comes in 'above 1TB." Both drive types are reportedly being sampled to datacenter customers in the US.
SK Hynix has managed to double the capacity and improve the read latency of its new 512 Gb 72-layer NAND flash over its previous 256 Gb 72-layer flash which debuted last year. The eSSD product reportedly hits sequential read and write speeds of 560 MB/s and 515 MB/s respectively. Interestingly, while random read IOPS hit 98,000, random write performance is significantly lower at 32,000 IOPS. SK Hynix did not go into details, but I suspect this has to do with the tuning they did to improve read latency and the nature of the 72-layer stacked TLC flash.
Moving up to the PCI-E interfacing eSSD, customers can expect greater than 1TB capacities (SK Hynix did not specify the maximum capacity they will offer) with sequential reads hitting up to 2,700 MB/s and sequential writes hitting 1,100 MB/s. The random performance is similar to the above eSSD with write performance being much lower than read performance at 230K read IOPS and 35K write IOPS maximum. The greatly limited write performance may be the result of the drive not having enough flash channels or the flash itself not being fast enough at writes which was a tradeoff SK Hynix had to make to hit the capacity targets with larger capacity 512 Gb (64 GB) dies.
Unfortunately, SK Hynix has not yet provided further details on its new eSSDs or the 3D-V4 TLC NAND it is using in the new drives. SK Hynix continuing to push into the enterprise storage market with its own SSDs is an interesting play that should encourage them push for advancements and production efficiencies to advance NAND flash technology.
- SK Hynix Launches Its 8Gb GDDR6 Memory Running at 14 Gbps
- SK Hynix has huge stacks of NAND
- Samsung and SK Hynix Discuss The Future of High Bandwidth Memory (HBM) At Hot Chips 28
Introduction, Specifications and Packaging
Samsung launched their 850 line of SSDs in mid-2014 (over three years ago now). The line evolved significantly over time, with the additions of PRO and EVO models, capacity expansions reaching up to 4TB, and a later silent migration to 64-layer V-NAND. Samsung certainly got their money's worth out of the 850 name, but it is now time to move onto something newer:
Of note above is a significantly higher endurance rating as compared to the 850 Series products, along with an update to a new 'MJX' controller, which accounts for a slight performance bump across the board. Not mentioned here is the addition of queued TRIM, which is more of a carryover from the enterprise / Linux systems (Windows 10 does not queue its TRIM commands).
Aside from some updated specs and the new name, packaging remains very much the same.
Read on for our review of the Samsung 860 PRO and EVO SSDs (in multiple capacities!)
(Those of you interested in Samsung's press release for this launch will find it after the break)
Subject: Storage, Shows and Expos | January 10, 2018 - 07:38 PM | Allyn Malventano
Tagged: tlc, ssd, slc, sata, nand, MX500, DWA, crucial, CES 2018, CES, 3d nand
Crucial showed off the upcoming M.2 variant of its MX500 product, available in capacities up to 1TB. They also announced (press release after the break) that the MX500 will be available from 250GB up to 2TB capacities.
Here is Crucial's product tour video for the MX500:
We previously tested the 1TB MX500, and Crucial passed along a 500GB model that I was able to spot check to ensure there was no performance fall-off at the smaller capacities of this line:
Looks good so far, and nearly identical to the 1TB capacity across our entire test suite. We did also speak with Crucial reps (Jon and Jon) about the TRIM speed issues noted in our previous review. They are looking into replicating our testing and may be pushing out a firmware to help improve this metric moving forward.
We also saw some sweet looking new RGB Ballistix memory, due out shortly. More to follow there! Crucial's MX500 CES announcement appears after the break.
Subject: Storage | January 10, 2018 - 07:24 PM | Tim Verry
Tagged: Mushkin, silicon motion, SM2262, SM2263XT, 3d nand, tlc, M.2, NVMe, CES, CES 2018
Mushkin is on site at CES where it is launching a slew of new products. On the storage front, Mushkin is showing off three new M.2 2280 form factor NVMe solid state drives aimed at various price points. The Pilot, Pilot-E, and Helix-L M.2 drives all use Silicon Motion controllers and 3D TLC NAND flash memory. Mushkin further advertises them with a three-year warranty and the company's MEDS Reliability Suite which includes technology to enable end-to-end data path protection, LDPC ECC, and global wear leveling algorithms to ensure data integrity and longevity.
At the top end of performance is the Pilot-E M.2 SSD based on SM2262EN controller which offers up eight channels for connecting all the 3D NAND. This 250 GB to 2 TB drive is able to achieve extremely speedy 3.5 GB/s sequential reads and 3.0 GB/s sequential writes along with 370K read IOPS and 300K write IOPS. Essentially, the Pilot-E M.2 should be able to easily max out the PCI-E x4 connection with the right workloads.
Stepping down a bit, the Pilot drive uses an eight channel SM2262 controller. This drive gets close to the Pilot-E in reads, but has much lower sequential write performance. Capacities for this SSD range from 120 GB to 2 TB. Specifically, the Pilot SSD is rated at 3.2 GB/s sequential reads, 1.9 GB/s sequential writes, 370K random read IOPS, and 300K random write IOPS. This drive should be cheaper than the Pilot-E and will be aimed at the consumer space where reads are more important than writes.
Finally, Mushkin's Helix-L is a lower cost SSD that uses a DRAM-less design to reduce cost as well as a cheaper four channel SM2263XT controller. Capacities range from 120 GB to 1TB. This SSD supports Host Memory Buffer architecture which allows it to use system memory as a cache to improve performance. The Helix-L is rated at 2.4 GB/s sequential reads, 1.7 GB/s sequential writes, 280K random read IOPS (140K without HMB) and 250K random write IOPS.
Mushkin has not yet revealed pricing or availability on its new NVMe 1.3 drives. You can read more about the Silicon Motion controllers used here.
Subject: Storage | August 2, 2017 - 06:21 PM | Allyn Malventano
Tagged: BiCS3, western digital, wdc, WD, tlc, slc, QLC, nand, mlc, flash, 96GB, 768Gb, 3d
A month ago, WD and Toshiba each put out releases related to their BiCS 3D Flash memory. WD announced 96 layers (BiCS4) as their next capacity node, while Toshiba announced them reliably storing four bits per cell (QLC).
WD recently did their own press release related to QLC, partially mirroring Toshiba's announcement, but this one had some additional details on capacity per die, as well as stating their associated technology name used for these shifts. TLC was referred to as "X3", and "X4" is the name for their QLC tech as applied to BiCS. The WD release stated that X4 tech, applied to BiCS3, yields 768Gbit (96GB) per die vs. 512Gbit (64GB) per die for X3 (TLC). Bear in mind that while the release (and the math) states this is a 50% increase, moving from TLC to QLC with the same number of cells does only yields a 33% increase, meaning X4 BiCS3 dies need to have additional cells (and footprint) to add that extra 17%.
The release ends by hinting at X4 being applied to BiCS4 in the future, which is definitely exciting. Merging the two recently announced technologies would yield a theoretical 96-layer BiCS4 die, using X4 QLC technology, yielding 1152 Gbit (144GB) per die. A 16 die stack of which would come to 2,304 GB (1.5x the previously stated 1.5TB figure). The 2304 figure might appear incorrect but consider that we are multiplying two 'odd' capacities together (768 Gbit (1.5x512Gbit for TLC) and 96 layers (1.5x64 for X3).
Press blast appears after the break.
Introduction, Specifications and Packaging
Today Intel is launching a new line of client SSDs - the SSD 545S Series. These are simple, 2.5" SATA parts that aim to offer good performance at an economical price point. Low-cost SSDs is not typically Intel's strong suit, mainly because they are extremely rigorous on their design and testing, but the ramping up of IMFT 3D NAND, now entering its second generation stacked to 64-layers, should finally help them get the cost/GB down to levels previously enjoyed by other manufacturers.
Intel and Micron jointly announced 3D NAND just over two years ago, and a year ago we talked about the next IMFT capacity bump coming as a 'double' move. Well, that's only partially happening today. The 545S line will carry the new IMFT 64-layer flash, but the capacity per die remains the same 256Gbit (32GB) as the previous generation parts. The dies will be smaller, meaning more can fit on a wafer, which drives down production costs, but the larger 512Gbit dies won't be coming until later on (and in a different product line - Intel told us they do not intend to mix die types within the same lines as we've seen Samsung do in the past).
There are no surprises here, though I am happy to see a 'sustained sequential performance' specification stated by an SSD maker, and I'm happier to see Intel claiming such a high figure for sustained writes (implying this is the TLC writing speed as the SLC cache would be exhausted in sustained writes).
I'm also happy to see sensical endurance specs for once. We've previously seen oddly non-scaling figures in prior SSD releases from multiple companies. Clearly stating a specific TBW 'per 128GB' makes a lot of sense here, and the number itself isn't that bad, either.
Simplified packaging from Intel here, apparently to help further reduce shipping costs.
Subject: General Tech | April 11, 2017 - 01:29 PM | Jeremy Hellstrom
Tagged: SK Hynix, 72 layer, tlc
SK Hynix have created an impressive die which has 72 layers of TLC 3D NAND. The storage density of their chips are somewhat lower than the competition, this particular chip sports 256Gb of capacity. This is due to the larger size of SK Hynix's cells, which has the benefit of allowing more layers than other manufacturers have been able to successfully create. The Register was told that compared to the previous generation of 48 layer NAND you could expect to see up to a 20% increase in read and write speeds, another benefit to their new process. To think, it was just a year ago that Al first introduced us to what 3D NAND would mean to the PC industry.
"Korean flash fabber SK Hynix has built a 72-layer 3D NAND die with 256Gb capacity. That number of layers, in effect a higher-rise flash chip than anybody else has built, is impressive but the 256Gb capacity is not; Toshiba's 64-layer flash die has a 512Gb capacity. Like the SK Hynix chip, it is a TLC (3bits/cell) device. It started sample shipping in February."
Here is some more Tech News from around the web:
- Researchers see inside integrated circuits at high resolution @ Nanotechweb
- Qualcomm: Apple underclocked iPhone 7 chips so Intel wasn't outperformed @ The Inquirer
- Windows 10 Creators Update is quite a small major update @ Ars Technica
- Fitbit's New Smartwatch Has Been Plagued By Production Mishaps @ Slashdot
- Intel's buggy Puma 6 chipset earns Arris a gigabit-modem lawsuit @ The Register
- Another Windows version hits End of Life. Vista, we hardly knew you @ The Inquirer
- PC In A Mouse @ Hack a Day