Subject: Processors | November 6, 2015 - 10:09 AM | Sebastian Peak
Tagged: tape out, processors, GLOBALFOUNDRIES, global foundries, APU, amd, 14 nm FinFET
GlobalFoundries has today officially announced their success with sample 14 nm FinFET production for upcoming AMD products.
(Image credit: KitGuru)
GlobalFoundries licensed 14 nm LPE and LPP technology from Samsung in 2014, and were producing wafers as early as April of this year. At the time a GF company spokesperson was quoted in this report at KitGuru, stating "the early version (14LPE) is qualified in our fab and our lead product is yielding in double digits. Since 2014, we have taped multiple products and testchips and are seeing rapid progress, in yield and maturity, for volume shipments in 2015." Now they have moved past LPE (Low Power Early) to LPP (Low Power Plus), with new products based on the technology slated for 2016:
"AMD has taped out multiple products using GLOBALFOUNDRIES’ 14nm Low Power Plus (14LPP) process technology and is currently conducting validation work on 14LPP production samples. Today’s announcement represents another significant milestone towards reaching full production readiness of GLOBALFOUNDRIES’ 14LPP process technology, which will reach high-volume production in 2016."
GlobalFoundries was originally the manufacturing arm of AMD, and has continued to produce the companies processors since the spin-off in 2012. AMD's current desktop FX-8350 CPU was manufactured on 32 nm SOI, and more recently APUs such as the A10-7850K have been produced at 28 nm - both at GlobalFoundries. Intel's latest offerings such as the flagship 6700K desktop CPU are produced with Intel's 14nm process, and the success of the 14LPP production at GlobalFoundries has the potential to bring AMD's new processors closer parity with Intel (at least from a lithography standpoint).
Full PR after the break.
Subject: Graphics Cards | October 23, 2015 - 01:49 AM | Sebastian Peak
Tagged: tape out, rumor, report, Radeon 400 Series, radeon, graphics card, gpu, Ellesmere, Baffin, amd
Details are almost nonexistent, but a new report claims that AMD has reached tape out for an upcoming Radeon 400 series of graphics cards, which could be the true successor to the R9 200-series after the rebranded 3xx cards.
Image credit: WCCFtech
According to the report:
"AMD has reportedly taped out two of its next-gen GPUs, with "Ellesmere" and "Baffin" both taping out - and both part of the upcoming Radeon 400 series of video cards."
I wish there was more here to report, but if this is accurate we should start to hear some details about these new cards fairly soon. The important thing is that AMD is working on the new performance mainstream cards so soon after releasing what was largely a simple rebrand accross much of the 300-series GPUs this year.
Subject: General Tech | August 30, 2011 - 12:34 PM | Jeremy Hellstrom
Tagged: tape out, GLOBALFOUNDRIES, amd, 20nm
When then discussion turns to a chip taping out, we are referring to an obsolete practice where a chip would be designed on a large scale and then reduced through photolithography. Originally, once a chip design was finalized on paper it went to the artwork stage where an engineer would literally tape out and glue the design to create a photomask which would allow light through in a variety of ways or utterly block it. That light was focused to create a smaller version, which then was used to make an even smaller version ... until it was of a size to etch the physical components of the chip onto the wafer and with a bit of luck and a lot of skill you would end up with a chip that worked to the specs you expected.
You can't exactly do that anymore, as the current generation of chips coming out of GLOBALFOUNDRIES uses a 20nm process, smaller than even extreme UV wavelengths and the magnitude of size reduction would be insurmountable. Thankfully there is CAD and many other more mature ways of creating chips than the old cut and paste method. This puts AMD in a good position to transfer to a 20nm process in the future, smaller than Intel's 22nm process but lacking the Tri-Gate three dimensional transistors that Intel will be implementing. Drop by The Inquirer for more.
"CHIPSHOP Globalfoundaries has announced that it taped out a test chip using its 20nm process node.
Globalfoundaries, best known for being the main chip fab partner of AMD, has been working to get its 28nm and 20nm process nodes up and running. For Globalfoundaries and its customers - in particular, AMD - having a mature 20nm process is desirable to show it has possibilities for die-shrinkage in the near future."
Here is some more Tech News from around the web:
- New USB 3.0 Flash Drive Has 2 TB of Storage @ Slashdot
- Windows 8 Explorer will support native mounting of ISO and VHD @ ExtremeTech
- Microsoft shows off Windows 8 ribbon interface @ The Inquirer
- Ultrabooks may push down mainstream notebook prices @ DigiTimes
- Fraudulent Google credential found in the wild @ The Register
- Wacom Intuos4 Medium Professional Pen Tablet Review @ Real World Labs
- Sony Cyber-shot DSC-HX100V Review @ TechReviewSource
- Celebrating 30 Years of the PC @ TechSpot