Subject: General Tech | May 11, 2017 - 05:07 PM | Jeremy Hellstrom
Tagged: amd, Starship, Naples, Zeppelin, Great Horned Owl, Banded Kestrel, Grey Hawk, River Hawk, Snowy Owl, rumour
We have another leak today from wccftech, via VideoCardz, of AMD's upcoming enterprise level processors. Starship will use the successor to the current Zen architecture; Zen 2 is in some ways measurable as being fabricated with a 7nm FinFet process. The chips are a testament to AMD's dedication to multi-core designs, Starship will feature up to 48 cores with 96 threads. That does create a bit of heat, but not more than the chip it is replacing, the TDPs range from 35W up to 180W. These chips will be sold under the Opteron name and will likely not have a model with the number 1701.
Starship will replace Naples, which we already know quite a lot about, they will use the upcoming Zeppelin architecture. The thermals match Starship but the core count is lower and tops out at 32 cores, 64 threads. That count tells us there will be four interconnected Zeppelin dies, each having 8 cores in two CCX units.
Next up is the Snowy Owl family of BGA chips which also uses Zeppelin cores. They will have models with core counts of 8, 12 and 16. Snowy Owl will support DDR4 in quad channel, 64 PCIe 3.0 lanes, and up to 16 SATA or NVMe storage devices and should take flight before the end of the year,.
Lastly we have their new embedded R-Series APUs, Great Horned Owl, Banded Kestrel, Grey Hawk and River Hawk. These low power chips will be based off of the current Zen architecture with support for single and dual DIMM DDR4 channels. The CPU portion will have 2 or 4 cores and TDPs between 15-65W, Owl models will be paired with an graphics core possessing 11 CUs, Kestral with 3 CUs. According to the slides posted at wccftech the APUs will support 4K60 and up to four 4K monitors which is impressive for such a small chip. There will also rumoured to be models without an APU, for usage in device which do not need graphical capabilities.
The slides also hint at a mysterious a new MCM package product which will arrive this year. It is reputed to have 4 GB VRAM, 10 CUs and five dual-mode Display Port support arriving in 2017. There are a lot more slides you can see by clicking here.