Qualcomm Announces Snapdragon 653, 626, and 427 SoCs

Subject: Processors, Mobile | October 18, 2016 - 11:32 AM |
Tagged: SoC, Snapdragon 653, Snapdragon 626, Snapdragon 427, snapdragon, smartphone, qualcomm, mobile

Qualcomm has announced new 400 and 600-series Snapdragon parts, and these new SoCs (Snapdragon 653, 626, and 427) inherit technology found previously on the 800-series parts, including fast LTE connectivity and dual-camera support.


The integrated LTE modem has been significantly for each of these SoCs, and Qualcomm lists these features for each of the new products:

  • X9 LTE with CAT 7 modem (300Mbps DL; 150Mbps UL) designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
  • LTE Advanced Carrier Aggregation with up to 2x20 MHz in the downlink and uplink
  • Support for 64-QAM in the uplink
  • Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.

In addition to the new X9 modem, all three SoCs offer faster CPU and GPU performance, with the Snapdragon 653 (which replaces the 652) now supporting up to 8GB of memory - up from a max of 4GB previously. Each of the new SoCs also feature Qualcomm's Quick Charge 3.0 for fast charging.


Full specifications for these new products can be found on the updated Snapdragon product page.

Availability of the new 600-series Snapdragon processors is set for the end of this year, so we could start seeing handsets with the faster parts soon; while the Snapdragon 427 is expected to ship in devices early in 2017.

Source: Qualcomm
Subject: Mobile
Manufacturer: Apple

Introduction and Specifications

The iPhone 7 and 7 Plus are here, and while outwardly they look very similar to last year’s 6s models, there have been some significant upgrades (and a highly controversial change) to the new phones. Is there enough in this iterative update to justify an upgrade? After spending a couple of weeks using one as my primary device, I will attempt to answer this question.


While there had been rumors swirling of an all-new design featuring an OLED display, Apple appears to be holding back until next year - which just happens to be the 10th anniversary of the iPhone. Considering this fact, it may just be that the iPhone 7 is something of a stop-gap for 2017. Some of the rumored elements are here, however; with the elimination of the physical home button (it's a solid-state version now) and 3.5 mm headphone jack (the latter causing much consternation). The camera on both phones is completely new as well, with a special dual-lens version exclusive to the 7 Plus.


First we'll go over the specs of these phones. As you can see, there are still some areas that are not fully known, such as the exact speed of the low-power cores in the new quad-core SoC, and the specifics about this year's GPU.

  Apple iPhone 7 Apple iPhone 7 Plus
Processor Apple A10 Fusion SoC
2.34 GHz dual-core + 2x low-power cores (? MHz)
Graphics 6-core (unknown GPU)
Memory 2GB 3GB
Screen 4.7-inch IPS, DCI-P3 capable 5.5-inch IPS, DCI-P3 capable
Storage 32GB/128GB/256GB
Cameras Back: 12MP, ƒ/1.8, OIS
Front: 7MP, ƒ/2.2
Back: 12MP, f /1.8, OIS
Dual-camera with 2x telephoto lens
Front: 7MP, ƒ/2.2
Video Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps
Audio Stereo Speakers
Wireless 802.11a/b/g/n/ac Wi‑Fi with MIMO 
Bluetooth 4.2, NFC
(Model A1778/1784)
FDD-LTE (Bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26, 27, 28, 29, 30) 
TD-LTE (Bands 38, 39, 40, 41) 
UMTS/HSPA+/DC-HSDPA (850, 900, 1700/2100, 1900, 2100 MHz) 
GSM/EDGE (850, 900, 1800, 1900 MHz)
Connection Lightning
Battery 1960 mAh 2900 mAh
Dimensions 138.3 x 67.1 x 7.1 mm
(5.44 x 2.64 x 0.28 inches)
138 g (4.87 oz)
158.2 x 77.9 x 7.3 mm
(6.23 x 3.07 x 0.29 inches)
188 g (6.63 oz)
OS iOS 10
Price $649 - $849 $769 - $969

Nearly a Decade of iPhone


The iPhone was introduced in 2007 (Image credit: Apple, via archive.org)

It’s hard to believe it’s been nine years since the original iPhone launched. Announced in January of 2007 by Steve Jobs during his keynote speech at CES, it set a standard that the rest of the industry would take some time to meet (remember, the first Android phone was over a year away at this point.) But nine years is an age in technology years, and that first version seems like an antique now. (The original iPhone specs: 3.5-inch display with 320x480 resolution, single-core ARM processor running at 412 MHz, 128 MB of system memory, 4GB/8GB storage.)

Continue reading our review of the Apple iPhone 7 and iPhone 7 Plus!!

Apple Announces iPhone 7 and 7 Plus with A10 SoC

Subject: Mobile | September 7, 2016 - 09:16 PM |
Tagged: smartphone, mobile, iPhone 7 Plus, iPhone 7, iphone, DCI P3, apple, a10

Another Apple announcement is in the books, and with it comes the expected refresh to the iPhone lineup. The new iPhone 7 and 7 Plus offer some notable upgrades from the previous models, though it's the lack of a 3.5 mm headphone jack that has been getting much of the attention.


Looking past the omission of the headphone jack for a moment, what exactly is new and noteworthy here? For starters, the iPhone 7 brings a new SoC to the table with the A10, a new design that is Apple's first foray into a "big.LITTLE" type of configuration. Unlike the A9 SoC's processor, a dual-core 1.85 GHz design, the A10 now offers a pair of high-performance cores, and a pair of high-efficiency cores that Apple says require only 1/5 of the larger pair's power. This sort of processor configuration is obviously similar to a number of existing ARM designs, which similarly combine faster and slower cores in an effort to reduce power consumption - though the 1/5 number is significant. It will be enlightening to see what the actual core speeds are - as well as particulars on the GPU, which is "50% faster" than the A9's PowerVR GT7600.


Other major updates include the cameras, which now features optical image stabilization (OIS) in the regular 7 as well as the 7 Plus (it was a 6/6s Plus-exclusive feature previously). The camera - or rather cameras - on the iPhone 7 Plus provide separate wide-angle and telephoto lenses, and allow for some powerful depth-of-field effects as demoed during the presentation. The displays contain another significant update - but not in resolution. The previous (low) 750x1344 resolution from the 6s remains in the iPhone 7, with the 7 Plus sticking to 1080x1920. The upgrade comes from the backlighting, which now provides 25% greater brightness and much wider color from the DCI P3 color space.


The lack of a 3.5 mm headphone jack was rumored for months leading up to today's announcement, and of course it will be a controversial topic. The Lightning connector is the only port on the iPhone 7/7 Plus, and Lightning-connected earbuds are included along with a 3.5 mm adapter (which also includes the DAC and headphone amp). The new haptic motor for the new non-mechanical home button is partly to blame for the omission of the headphone jack, but might also have been removed as part of the process to make the iPhone water resistant - a first for Apple.


Wireless earbuds ("AirPods") were also announced, which look pretty much like the existing "EarPods" with the cord cut off. One final note on sound: the new iPhones have stereo speakers for the first time, with sound claimed to be 50% louder than previous, and now emanating from both ends of the phone.


The family of iPhones now includes the new iPhone 7 and 7 Plus, along with existing 6s, 6s Plus, and the iPhone SE. In a surprising move, Apple announced that they would upgrade last year's 6s models to shipping with double the base storage - 32GB vs. 16GB - for the same price.

Pre-orders for the new iPhones begin on September 9th, with pricing beginning at $649 for the 32GB iPhone 7, and $769 for the 32GB iPhone 7 Plus.

Source: Apple
Subject: Mobile
Manufacturer: HUAWEI

Introduction and Specifications

Immediately reminiscent of other phablet devices, the Mate 8 from HUAWEI is a characteristically large, thin slab of a smartphone. But under the hood there's quite a departure from the norm, as the SoC powering the device is new to the high-end phone market - no Qualcomm, Samsung, or even MediaTek here.


"The Mate 8 takes the look and feel of the Mate series to a whole new level. Boasting a vivid 6" FHD display, an ultra slim design, a re-designed fingerprint sensor that's faster and more reliable, and a sleek aluminum unibody design, the Mate 8 is sure to impress."

The HiSilicon Kirin 950 powers the Mate 8; an 8-core design comprised of 4x ARM Cortex-A72 cores clocked at up to 2.3 GHz, and 4x ARM Cortex-A53 cores clocked at up to 1.80 GHz. Memory is 3GB for our sample, with 32GB storage; with 4GB RAM and 64GB storage is also available.


The Mate 8 looks every bit a premium device, and the metal and glass construction of the handset feels solid. It also feels rather light (185g) given its size. But how does it perform? This is an especially interesting question given the unusual silicon in the Mate 8, but the Kirin 950's Cortex-A72 is the most powerful ARM design (at least until the Cortex-A73, announced this summer, finds its way into devices).

In this review we'll explore the overall quality of the HUAWEI Mate 8, and go over usage impressions. And, of course, we'll look at some performance benchmarks to see how this Kirin 950 SoC stacks up against recent Snapdragon and Apple SoCs.


Continue reading our review of the HUAWEI Mate 8 smartphone!!

Lenovo's PHAB2 Family Features Project Tango-Powered PHAB2 Pro

Subject: Mobile | June 9, 2016 - 02:30 PM |
Tagged: Snapdragon 652, smartphone, project tango, phablet, PHAB2, Lenovo, augmented reality, AR

Lenovo has unveiled the PHAB2 family at their Lenovo Tech World event today, featuring the PHAB2 Pro, a phablet-sized mobile device powered by Google's Project Tango (now simply Google Tango) augmented-reality technology.

PHAB2 Pro Cameras.jpg

Lenovo PHAB2 Pro (Image credit: Lenovo)

“Unlike any other phone, the PHAB2 Pro, powered by Tango technology – a set of sensors and software from Google that senses and maps its surroundings – makes a host of cutting-edge smartphone augmented reality (AR) experiences possible. For example, using AR apps, students can place true-to-scale virtual dinosaurs in their classrooms and enhance their learning through AR data overlays that appear while they walk around the creatures. AR gaming experiences let you play virtual dominos on your kitchen table, raise a digital pet in your bedroom and fight back swarms of aliens invading your house.

With Tango technology PHAB2 Pro can even begin to change the way people think about mapping indoor spaces to create new experiences like future augmented reality museum tours via the GuidiGO app. With Tango, PHAB2 Pro offers unprecedented experiences on a smartphone that will continually learn and improve.”

The large phablet devices are full smartphones, not just small tablets, and the three models offer widely varying specs with significant improvements in each successive model. We'll begin by looking at the base configuration.

Lenovo PHAB2


The PHAB2 (Image credit: Lenovo)

  • Display: 6.4-inch HD (1280x720) IPS
  • Processor: MediaTek MTK 8735 Quad-Core Processor
  • Memory: 3 GB
  • Storage: 32 GB (expandable up to 128 GB via microSD)
  • Sound: Triple Array Microphone with
  • Active Noise-Cancellation; Dolby Atmos + Dolby Audio Capture 5.1
  • Camera:
    • Rear: 13 MP PDAF Fast-Focus
    • Front: 5 MP 85° Wide Angle
  • Battery: 4050 mAh

Next up is the PHAB2 Plus, which improves on the base model's display, SoC, and particularly the cameras:

“The PHAB2 Plus comes with two 13MP rear cameras that have instant focus, fast f1.8 lenses and the same professional-grade Futjitsu Milbeaut image signal processor that powers the Leica camera.”

Lenovo PHAB2 Plus

PHAB2 Plus.jpg

The PHAB2 Plus (Image credit: Lenovo)

  • Display: 6.4-inch FHD (1920x1080) IPS
  • Processor: MediaTek MTK 8783 Octa-Core Processor
  • Memory: 3 GB
  • Storage: 32 GB (expandable up to 128 GB via microSD)
  • Sound: Triple Array Microphone with Active Noise-Cancellation; Dolby Atmos + Dolby Audio Capture 5.1
  • Cameras:
    • Rear: 13 MP Dual Camera Milbeaut ISP, F2.0 Aperture, 1.34 Big Pixel, Laser Focus with PDAF Light Supplement
    • Front: 8 MP Fixed-Focus, F2.2 Aperture, 1.4 μm Big Pixel, Light Supplement
  • Battery: 4050 mAh

Next up we have the PHAB2 Pro, the flagship of the lineup, which moves to a Qualcomm Snapdragon SoC from the MediaTek chips in the first two phones, and offers a higher screen resolution and (most importantly for this launch) Google Tango support - the first product equipped with this AR technology.

Lenovo PHAB2 Pro

PHAB2 Pro.jpg

The PHAB2 Pro (Image credit: Lenovo)

  • Display: 6.4-inch QHD (2560x1440) IPS Assertive Display
  • Processor: Qualcomm Snapdragon 652 Processor Built for Tango
  • Memory: 4 GB
  • Storage: 64 GB (expandable up to 128 GB via microSD)
  • Sound: Triple Array Microphone with Active Noise-Cancellation; Dolby Atmos + Dolby Audio Capture 5.1
  • Cameras:
    • Rear: 16 MP PDAF Fast-Focus, Depth Sensor for Tango, Motion Tracking Sensor for Tango
    • Front: 8 MP Fixed-Focus, F2.2 Aperture, 1.4 μm Big Pixel
  • Battery: 4050 mAh

There will be a retail presence in the U.S. for the PHAB2 Pro, with Best Buy confirmed as an outlet for the Google Tango device. Additionally, in a move that is perplexing at first, the PHAB2 Pro will be featured for sale in Lowe's home improvement stores. (Wait, what?) A move which actually makes sense once you’ve read Lenovo’s press release:

“Homeowners can also now use their PHAB2 Pro to remodel their homes by visualizing real home furnishings in their living rooms and kitchens. Home improvement company Lowe’s is one of the first partners to develop a Tango-enabled application, Lowe’s Vision. The app empowers customers by leveraging Tango technology to measure spaces and visualize how products like appliances and décor, or materials like countertops or backsplash tile, will all look and fit together in a room. With Lowe’s Vision, customers will be able to control a new generation of augmented reality tools with a mere tap of the finger.”

As to pricing, the base PHAB2 has an MSRP of $199, the PHAB2 Plus moves up to $299, and the PHAB2 Pro will be $499. Availability set for September of this year.

Source: Lenovo

ASUS Announces Zenfone 3 Smartphone Family

Subject: Mobile | May 30, 2016 - 02:14 PM |
Tagged: zenfone 3, snapdragon 820, Snapdragon 625, smartphone, ips, computex 2016, computex, asus, Android, AMOLED

The Zenfone 3 family has been officially announced, and ASUS has provided all of the details of these new Android smartphones from Computex 2016.


The Zenfone 3 family is comprised of three phones; the Zenfone 3, Zenfone 3 Deluxe, and the massive Zenfone 3 Ultra. The first of these is the standard Zenfone 3, which replaces the Zenfone 2 not only in number, but architecture. While the previous version was powered by an Intel SoC, this new Zenfone contains a conventional ARM-based SoC; the Snapdragon 625.


A 5.5-inch device with a FHD (1920x1080) IPS display protected by Gorilla Glass 4, the 7.69 mm thick Zenfone 3 also boasts a 16MP “PixelMaster” camera with OIS and “ultra-fast 0.03s instant focus” for clear photos. Other features include a sizable 4GB of RAM, a “5-magnet” speaker design and 24-bit/192kHz high-resolution audio support, and a 3000 mAh battery. The phone uses USB Type-C connectivity, and arrives with Android 6.0 with ZenUI 3.0.


Moving to the Zenfone 3 Deluxe, this higher-end model offers a slightly larger 5.7” FHD AMOLED display (rather than IPS), and adds Quick Charge 3.0 for the 3000 mAh, and USB 3.0 speed to the Type-C connector. The SoC powering the Deluxe is the biggest upgrade over the standard Zenfone 3, with the powerful Snapdragon 820 replacing the base model’s Snapdragon 625.

If you enjoy a more tablet-like experience, the 6.8-inch (!) Zenfone 3 Ultra might be for you!


While still FHD at this tablet-like size, the rear camera on the Ultra is a big upgrade, with a 23MP PixelMaster Camera (via the Sony IMX318 sensor). The battery is also a big upgrade over the smaller phones, as the larger chassis allows a 4600 mAh capacity. The big question (pun intended) becomes, will people want to use a 6.8-inch smartphone? To which the answer must be, no, we will hold out for the 7+ inch phones! (Or not.)

As to pricing, the Zenfone 3 is nearly as aggressive as the previous version, with an MSRP of $249. The Deluxe version is priced much more like premium handset at $499, and the Ultra is just behind it at $479. Availablity has not been announced.

Source: ASUS

MWC 2016: LG Announces the G5 Smartphone

Subject: Mobile | February 21, 2016 - 02:52 PM |
Tagged: snapdragon 820, smartphone, qualcomm, MWC 2016, MWC, modular phone, LG G5, LG, ips, G5, Android

LG has officially unveiled their newest flagship Android handset, and in addition to high-end specs the G5 features a unique modular construction.


The LG G5

The G5 is powered by the new Snapdragon 820 SoC, and offers a 5.3-inch, 2560x1440 IPS display (making slightly smaller than the earlier G4, which was a 5.5-inch device with the same resolution). And while the G5 looks every bit a sleek Android flagship, there’s more going on here than the typical sealed handset. LG has implemented a modular design, where optional components can be added from a port on the bottom of the phone.


The LG Cam Plus (left) and Hi-Fi Plus (right)

The first of two announced modules is the LG Cam Plus, which is a camera grip that also adds 1200 mAh to the battery capacity (for a total of 4000 mAh). The second is the LG Hi-Fi Plus, which adds a high-resolution DAC and headphone amp to the phone. The headphone amp is “tuned by B&O”, and the DAC supports up to 32-bit / 384 kHz. The Hi-Fi Plus can also be used as a standalone USB device.


(Image via Android Police)

One of the features that had leaked ahead of the announcement was an always-on display, leading to speculation about the use of an OLED panel. But this is LG we are talking about, and they have implemented a high-DPI (554) IPS display instead. So how does this always-on display feature avoid aggressively draining your battery? The post from ComputerBase offers this analysis:

“Instead, the company opted for an optimization of display drivers and power management in order to realize the permanent display of notifications, time, date and other information on the large main screen. The adjustments for example it is possible to limit the backlight to a part of the screen. According to LG, the activated always-on function consumes thanks to the optimizations per hour 0.8 percent of the battery charge.”

Specs via Android Central:

  • Display: 5.3-inch IPS quad-HD quantum display (2560x1440, 554 dpi)
  • Processor: Snapdragon 820
  • Storage: 32GB UFS ROM, microSD up to 2TB
  • Rear camera: 16MP main, 8MP wide-angle (135 degrees)
  • Front camera: 8MP
  • Battery: 2800 mAh removable
  • Modules: LG Cam Plus (camera grip with 1100 mAh), LG Hi-Fi Plus with B&O Play
  • Dimensions: 149.4 x 73.9 x 7.7mm
  • Weight: 159 grams
  • Networks: LTE/3G/2G
  • Connectivity: Wifi 802.11a/b/g/n/ac, USB Type C, NFC, Bluetooth 4.2
  • Colors: Silver/Titan/Gold/Pink
  • Operating system: Android 6.0.1

There were three additional accessories announced with the phone: The 360 VR (a VR headset) 360 CAM (for creating 360-degree movies and photos) and something called the Rolling Bot (a Wi-Fi connected sphere equipped with a camera, mic, and speaker).

Ryan had hands-on time with the G5 from LG's booth at MWC 2016:

No specific pricing or release date have been announced yet, but we should know more next month when LG is expected to provide more release details.

MWC 2016: Lenovo Announces VIBE K5 and K5 Plus Smartphones

Subject: Mobile | February 21, 2016 - 01:00 PM |
Tagged: VIBE K5 Plus, VIBE K5, Snapdragon 616, Snapdragon 415, smartphone, qualcomm, MWC 2016, MWC, Lenovo, Android

Lenovo has announced a new pair of smartphones in their VIBE series, and these offer very impressive specs considering the asking price.

K5 Family.jpg

The VIBE K5 will retail for $129, with the K5 Plus slightly higher at $149. What does this get you? Both are 5-inch devices, with a modest 1280x720 resolution on the standard K5, or FHD 1920x1080 on the K5 Plus. The phones are both powered by Qualcomm SoCs, with a Snapdragon 415 in the K5 (quad-core 1.4 GHz), and the faster Snapdragon 616 (8-core 1.7 GHz) in the K5 Plus.

Here’s a look at the specifications for these phones:

  • Screen: 5.0” HD (1280x720) display (K5) or IPS Full HD (1920x1080) (K5 Plus)
  • Processor: Qualcomm snapdragon 415 octa-core (K5) or 616 octa-core processor (K5 Plus)
  • Storage: 2GB LP DDR3 RAM | 16GB eMCP built-in storage | up to 32GB microSD expandable storage support
  • Graphics: Adreno 405: up to 550MHz 3D graphics accelerator 

  • Camera: Rear: 13MP with 5-piece lens and FHD video recording, Front: 5MP fixed-focus with 4-piece lens
Connectivity: Dual SIM slots with 4G LTE connectivity + BT 4.1; WLAN: Wi-Fi 802.11 b/g/n, Wi-Fi hotspot 

  • Battery: 2750mAh interchangeable battery 

  • Audio: 2 x speakers, 2 x mics, 3.5 mm audio jack, Dolby Atmos
  • Thickness: 8.2 mm (.32 in)
  • Weight: 142 g (5 oz)
  • OS: Android 5.1, Lollipop


On paper these smartphones present a compelling value reminiscent of the ASUS Zenfone 2, with the K5 Plus easily the better bargain with a 1920x1080 IPS display and octa-core processor for $149. We’ll have to wait to pass judgment until the UI performance and camera have been tested, but these new VIBE K5 phones certainly looks like a promising option.

The VIBE K5 and K5 Plus will be available in March.

Source: Lenovo
Subject: Mobile
Manufacturer: Qualcomm

Introduction and CPU Performance

We had a chance this week to go hands-on with the Snapdragon 820, the latest flagship SoC from Qualcomm, in a hardware session featuring prototype handsets powered by this new silicon. How did it perform? Read on to find out!


As you would expect from an all-new flagship part, the Snapdragon 820 offers improvements in virtually every category compared to their previous products. And with the 820 Qualcomm is emphasizing not only performance, but lower power consumption with claims of anywhere from 20% to 10x better efficiency across the components that make up this new SoC. And part of these power savings will undoubtedly come as the result of Qualcomm’s decision to move to a quad-core design with the 820, rather than the 8-core design of the 810.

So what exactly does comprise a high-end SoC like the Snapdragon 820? Ryan covered the launch in detail back in November (and we introduced aspects of the new SoC in a series of articles leading up to the launch). In brief, the Snapdragon 820 includes a custom quad-core CPU (Kryo), the Andreno 530 GPU, a new DSP (Hexagon 680), new ISP (Spectra), and a new LTE modem (X12). The previous flagship Snapdragon 810 used stock ARM cores (Cortex-A57, Cortex-A53) in a big.LITTLE configuration, but for various reasons Qualcomm has chosen not to introduce another 8-core SoC with this new product.


The four Kryo CPU cores found in the Snapdragon 820 can operate at speeds of up to 2.2 GHz, and since is half the number of the octo-core Snapdragon 810, the IPC (instructions per clock) of this new part will help determine how competitive the SD820's performance will be; but there’s a lot more to the story. This SoC design placed equal emphasis on all components therein, and the strategy with the SD820 seems to be leveraging the capability of the advanced signal processing (Hexagon 680) which should help offload the work to allow the CPU to work with greater efficiency, and at lower power.

Continue reading our performance preview of the new Snapdragon 820 SoC!!

Samsung Announces Exynos 8 Octa 8890 Application Processor

Subject: Processors, Mobile | November 12, 2015 - 09:30 AM |
Tagged: SoC, smartphone, Samsung Galaxy, Samsung, mobile, Exynos 8890, Exynos 8 Octa, Exynos 7420, Application Processor

Coming just a day after Qualcomm officially launched their Snapdragon 820 SoC, Samsung is today unveiling their latest flagship mobile part, the Exynos 8 Octa 8890.


The Exynos 8 Octa 8890 is built on Samsung’s 14 nm FinFET process like the previous Exynos 7 Octa 7420, and again is based on the a big.LITTLE configuration; though the big processing cores are a custom design this time around. The Exynos 7420 was comprised of four ARM Cortex A57 cores and four small Cortex A53 cores, and while the small cores in the 8890 are again ARM Cortex A53, the big cores feature Samsung’s “first custom designed CPU based on 64-bit ARMv8 architecture”.

“With Samsung’s own SCI (Samsung Coherent Interconnect) technology, which provides cache-coherency between big and small cores, the Exynos 8 Octa fully utilizes benefits of big.LITTLE structure for efficient usage of the eight cores. Additionally, Exynos 8 Octa is built on highly praised 14nm FinFET process. These all efforts for Exynos 8 Octa provide 30% more superb performance and 10% more power efficiency.”


Another big advancement for the Exynos 8 Octa is the integrated modem, which provides Category 12/13 LTE with download speeds (with carrier aggregation) of up to 600 Mbps, and uploads up to 150 Mbps. This might sound familiar, as it mirrors the LTE Release 12 specs of the new modem in the Snapdragon 820.

Video processing is handled by the Mali-T880 GPU, moving up from the Mali-T760 found in the Exynos 7 Octa. The T880 is “the highest performance and the most energy-efficient mobile GPU in the Mali family”, with up to 1.8x the performance of the T760 while being 40% more energy-efficient. 

Samsung will be taking this new SoC into mass production later this year, and the chip is expected to be featured in the company’s upcoming flagship Galaxy phone.

Full PR after the break.

Source: Samsung