Subject: General Tech | October 9, 2018 - 09:46 PM | Tim Verry
Tagged: Trident Z RGB, samsung b-die, G.Skill, double capacity DIMM, ddr4, DC DIMM, 64GB
G.Skill has joined forces with ASUS to release a new series of Trident Z RGB DC DDR4 memory modules aimed at ASUS’ Z390 motherboards and take advantage of “double capacity DIMM” technology that uses taller form factors to allow twice the memory ICs per stick.
The new Trident Z RGB DC memory modules feature 16 Samsung B-die memory ICs for a total capacity of 32 GB when using 8Gb chips. Initially, G.Skill will offer the new double capacity modules in 64GB kits (32GB x 2) clocked at 3000 MHz and 3200 MHz. As part of the company’s Trident Z RGB family, the new DC series continue to support RGB LEDs which can be customized by software including Asus Aura Sync. The 3000 MHz kit comes with 14-14-14-34 timings. There are two 3200 MHz kits (both 64 GB) that come either with 14-14-14-34 or 14-15-15-35 timings. All three kits operate at 1.35V out of the box.
The double capacity DIMMs will work with select ASUS motherboard based around the Intel Z390 chipset including the ROG Z390 Maximus XI APEX, ROG Maximus XI Gene, and ROG STRIX Z390-I Gaming.
The Mini ITX Strix Z390-I Gaming board would benefit the most from the double capacity DIMMs at they will allow enthusiasts to pack more than the 32 GB limit of today’s JEDEC standard UDIMMs into the only two memory slots on the board. Meanwhile, the larger Z390 boards will be able to host even more memory enabling workstation workloads to be run (or a big ass home virtual lab environment heh).
G.Skill has not yet released pricing or availability information for these new memory kits. I am curious whether the double capacity DIMM standard will catch on and if it will be adopted by other motherboard manufacturers or if it will stay an ASUS exclusive feature. At least on paper, it appears the only tradeoff is having to accommodate taller modules when considering which CPU cooler to purchase.
Subject: General Tech | June 11, 2018 - 11:25 PM | Tim Verry
Tagged: Trident Z RGB, samsung b-die, overclocking, msi, LN2, liquid nitrogen, Intel, G.Skill, ddr4, computex 2018, computex
G.Skill held its annual extreme overclocking competitions (the OC World Cup Competition and OC World Record Stage) at Computex 2018 in Taipei where the overclockers managed to break 13 world records including the two highest DDR4 clockspeeds and the fastest Core i7-8700K clockspeed.
Overclocking teams from around the world using Intel processors, G.Skill DDR4 memory, and motherboards from MSI, EVGA, and ASRock along with extreme cooling methods (de-lidding and loads of LN2) were used to set the world records in 3DMark Fire Strike, SuperPi, Maxxmem, Geekbench 4, GPUPi for CPU, WPrime, and PiFast benchmarks along with hardware records of DDR4 5543 MHz and an Intel Core i7-8700K at 7409.03 MHz.
On the memory front, G.Skill notes that Toppc is now the world record holder with the DDR4-5543 MHz overclock achieved using an Intel i7-8700K, MSI Z370I Gaming Pro Carbon AC, and G.Skill Trident Z RGB memory. Following Toppc’s overclock Kovan Yang managed to achieve the second highest DDR4 clockspeed record at DDR4-5541 MHz on the MSI X299 Gaming Pro Carbon AC motherboard and Intel Core i7-7740X processor which is an interesting feat on the HEDT platform.
Other notable benchmark world records include a 3DMark Fire Strike Extreme Single score of 20,320 (i9-7980XE and EVGA X299 Dark platform), Geekbench4 Single Core score of 9842 points (i7-8700K on an ASRock Z170M OC Formula), WPRIME -32M score of 1.937 seconds, and a SuperPi 32M score of 4 minutes and 8.922 seconds.
Interestingly, G.Skill’s video coverage (embedded below) shows both manual full pot cooling as well as the automated Roboclocker LN2 cooler being used. The video jumps from scene to scene quickly but it does give you some glimpses at the process and the pots/heatsinks used with the RAM and processor to keep things cool even when cranking up the voltage and clocks!
Subject: General Tech, Memory | February 11, 2018 - 04:45 PM | Tim Verry
Tagged: G.Skill, Trident Z RGB, ddr4, Samsung, samsung b-die, xmp
G.Skill will soon be upgrading its Trident Z RGB line of DDR4 DIMMs with a 16 GB kit capable of running at 4700 MHz. With the claimed fastest commercial kit of RGB-equipped memory modules, the new 2 x 8 GB kit uses Samsung B-die ICs and supports XMP 2.0 memory profiles. The super-fast memory kit has been in development for quite a while and is slated for availability in Q2 2018.
G.Skill has managed to tighten the timings on its 4700 MHz kit to CL19-19-19-39 while needing only 1.45V which is nice to see. The company has reportedly validated the new memory using a MSI Z370 Gaming Pro Carbon AC motherboard and Intel i7 8700k processor. G.Skill notes that the new kit is notable because it is the first retail kit to hit 4700 MHz as well as the first memory kit with RGB LEDs to hit that lofty memory speed. Corsair comes close at 4600 MHz with its 16 GB Vengeance LPX DDR4 kit at 15-15-15-36 which will set you back a cool $589.99 MSRP.
I am curious on the overclocking headroom on these modules actually (heh). G.Skill is reportedly using highly screened B-dies so maybe the 5,000 MHz its other kits have hit (when overclocked) would be possible. I would like to see AMD’s Infinity Fabric performance at that point when it is not being held back by memory speed especially where its upcoming APUs are concerned. On the Intel side of things, I think tighter timings are preferrable (after a certain threshold of acceptable speed of course) when pursuing the best performance so a "slower" 3600 to 4600 MHz kit at CL15 or lower might be a better buy. In any case, memory continues to be pricey, and I would uess G.Skill's new kit will hit at least $600 MSRP.
G.Skill is not yet talking pricing on these modules, but they aren’t going to be cheap. We should know more in a couple of months as we enter the second quarter.