Subject: General Tech | February 21, 2018 - 09:00 AM | Josh Walrath
Tagged: modem, Kigen, iSIM, iot, cortex, cellular, arm
Last year ARM went on a bit of a buying spree thanks to the financial help of its holding company, SoftBank. One of the companies that it scooped up was that of Simulity Labs for around 12 million pounds. The company was developing IoT security products based on eSIM technology and a robust OS that provides provisioning on a cellular network.
Many believe that the nearly ubiquitous cellular networks that surround us are the key to truly successful IoT products. There are massive cellular deployments around the world. It is a well regulated spectrum. Security through SIM cards is a well known and understood process. It is not impossible to break this security, but it is questionable if it is worth the time and effort to do so.
ARM has gone ahead and provided the means to productize and push this technology with the aim of providing a vast, secure IoT infrastructure that would be relatively easy to rollout with current cellular networks. There are multiple parts to this technology, but ARM is hoping to offer an all-in-one solution that would provide an inexpensive platform for OEMs and Mobile Network Operators (MNOs) to roll out products on.
Hot on the heels of the 5G momentum that saw Qualcomm announce working with 18 different device OEMs and 18 different network providers to bring 5G hardware and carriers online for wide adoption in 2019, the mobile giant is launching another 4G LTE modem. The new Snapdragon X24 LTE modem will provide connectivity speeds as high as 2.0 Gbps (Cat 20) and happens to be the first chip officially announced to be built on a 7nm process technology. It will be shipping in products by the end of 2018.
With the 5G wave of products just on the horizon it might seem odd to see Qualcomm launch yet another LTE modem, especially one that offers such high performance and capability. The truth is that while 2019 will see the first nationwide (and global) 5G networks launched, 4G LTE will remain a fallback for the many years going forward. In fact, the first 5G devices (phones, laptops, tablets) will be connected to both 5G and 4G networks simultaneously to maintain connectivity through location changes. This will be temporary as the 5G networks scale to outdoor and internal designs, but expect that to be the case for at least 5 years.
As a result, newer LTE modems will remain a key differentiation point for mobile devices and chipsets. While the Snapdragon 845 Mobile Platform (Sebastian recently posted a story with early benchmarks if you’re interested) uses the Snapdragon X20 LTE modem, which only runs at 1.2 Gbps peak download rate, the new X24 will start by shipping as a discrete modem/chip solution. As has been the case with the X16 and X20 before it, you should then expect to see the X24 integrated into the next-generation of Qualcomm Snapdragon application processor.
Obviously the flagship feature of this new modem is its ability to raise peak download speeds to 2.0 Gbps, doubling that of the X16 modem that brought Gigabit-class LTE to the world. This is possible due to the chips ability to handle 7x CA (carrier aggregation) downlink and improved unlicensed spectrum support. You can see from the diagram above that the X24 modem greatly increases the complexity and potential combinations of spectrum.
The Snapdragon X24 also marks the first publicly announced 7nm chip in the world. Though it wasn’t confirmed by Qualcomm, this is being made at TSMC, the only foundry with currently available 7nm technology in place. This move to a new technology means Qualcomm can offer a chip that is smaller and more power efficiency than would be possible on 10nm or 14nm nodes. The company also has the world’s first 14nm RF transceiver chip to pair with the X24 modem, another improvement in power and space efficiency.
Qualcomm will be demonstrating the new Snapdragon X24 modem technology running at 2.0 Gbps at Mobile World Congress, working with Ericsson, Telstra, and Netgear later this month.
Subject: General Tech, Mobile | February 27, 2017 - 11:12 AM | Sebastian Peak
Tagged: x50, Sub-6 Ghz, qualcomm, OFDM, NR, New Radio, MWC, multi-mode, modem, mmWave, LTE, 5G, 3GPP
Qualcomm has announced their first successful 5G New Radio (NR) connection using their prototype sub-6 GHz prototype system. This announcement was followed by today's news of Qualcomm's collaboration with Ericsson and Vodafone to trial 5G NR in the second half of 2017, as we approach the realization of 5G. New Radio is expected to become the standard for 5G going forward as 3GPP moves to finalize standards with release 15.
"5G NR will make the best use of a wide range of spectrum bands, and utilizing spectrum bands below 6 GHz is critical for achieving ubiquitous coverage and capacity to address the large number of envisioned 5G use cases. Qualcomm Technologies’ sub-6 GHz 5G NR prototype, which was announced and first showcased in June 2016, consists of both base stations and user equipment (UE) and serves as a testbed for verifying 5G NR capabilities in bands below 6 GHz."
The Qualcomm Sub-6 GHz 5G NR prototype (Image credit: Qualcomm)
Qualcomm first showed their sub-6 Ghz prototype this past summer, and it will be on display this week at MWC. The company states that the system is designed to demonstrate how 5G NR "can be utilized to efficiently achieve multi-gigabit-per-second data rates at significantly lower latency than today’s 4G LTE networks". New Radio, or NR, is a complex topic as it related to a new OFDM-based wireless standard. OFDM refers to "a digital multi-carrier modulation method" in which "a large number of closely spaced orthogonal sub-carrier signals are used to carry data on several parallel data streams or channels". With 3GPP adopting this standard going forward the "NR" name could stick, just as "LTE" (Long Term Evolution) caught on to describe the 4G wireless standard.
Along with this 5G NR news comes the annoucement of the expansion of its X50 modem family, first announced in October, "to include 5G New Radio (NR) multi-mode chipset solutions compliant with the 3GPP-based 5G NR global system", according to Qualcomm. This 'multi-mode' solution provides full 4G/5G compatibility with "2G/3G/4G/5G functionality in a single chip", with the first commercial devices expected in 2019.
"The new members of the Snapdragon X50 5G modem family are designed to support multi-mode 2G/3G/4G/5G functionality in a single chip, providing simultaneous connectivity across both 4G and 5G networks for robust mobility performance. The single chip solution also supports integrated Gigabit LTE capability, which has been pioneered by Qualcomm Technologies, and is an essential pillar for the 5G mobile experience as the high-speed coverage layer that co-exists and interworks with nascent 5G networks. This set of advanced multimode capabilities is designed to provide seamless Gigabit connectivity – a key requirement for next generation, premium smartphones and mobile computing devices."
Full press releases after the break.
Subject: Mobile | February 21, 2017 - 08:19 AM | Sebastian Peak
Tagged: X20, snapdragon, qualcomm, modem, LTE, DSDV, Category 18, Carrier Aggregation, CA, 5x20 MHz
Qualcomm has announced the Snapdragon X20 LTE modem, their 2nd-generation Gigabit LTE solution built on 10nm FinFET and offering what Qualcomm says are “a number of industry firsts”, which include first to Category 18 (downlink) and first to receive up to 12 spacial LTE data streams simultaneously.
“It is the first commercially announced Gigabit LTE chipset designed to deliver fiber-like LTE Category 18 download speeds of up to 1.2 Gbps, a 20 percent improvement in download speeds over the previous generation. Additionally, it allows support for up to 5x20 MHz downlink Carrier Aggregation (CA) across licensed and unlicensed FDD and TDD radio frequencies, as well as 4x4 MIMO on up to three aggregated LTE carriers. Lastly, it supports integrated Dual SIM Dual VoLTE (DSDV) capability, a first for Snapdragon LTE modems. These leading-edge features of the Snapdragon X20 LTE modem are supported by the first commercially announced single-chip RF transceiver capable of simultaneously receiving up to 12 spatial streams of LTE data.”
Compared the the X16 modem featured in the upcoming Snapdragon 835 SoC, the Snapdragon X20 LTE modem moves from Cat 16 to Cat 18 on the downlink, with support for 5x20 MHz (vs. the X16’s 4x20 MHz) Carrier Aggregation and “can simultaneously receive 12 unique streams of data on as few as three 20 MHz carriers”, with up to 256-QAM and 100 Mbps per stream. Uplink is at the same 2x20 MHz/64-QAM as the X16 modem, for speeds of up to 150 Mbps.
The X20 LTE modem now includes VoLTE for both cards in a dual-SIM implementation:
“The Snapdragon X20 LTE modem also features more advanced dual SIM functionality and, as the first Snapdragon LTE modem to support DSDV, it provides users with the benefits of Ultra HD Voice and other IMS-based services on both SIMs inserted into the device.”
Qualcomm has begun to sample the Snapdragon X20 LTE modem to customers, with the first commercial devices expected 1H 2018.
Full press release after the break.
Subject: Networking, Mobile | October 17, 2016 - 11:00 PM | Sebastian Peak
Tagged: Snapdragon X50, snapdragon, qualcomm, modem, mobile, mmWave, LTE, cellular, 5G
Qualcomm has officially unveiled the development of a new 5G modem with the Snapdragon X50, which targets OEMs and early 5G development. The X50 supports milimeter wave (mmWave) technology initially, and rather than replace existing LTE solutions the X50 is designed to work alongside LTE modems integrated into Snapdragon SoCs, for a seamless handoff between 5G and 4G networks.
"The Snapdragon X50 5G modem will initially support operation in millimeter wave (mmWave) spectrum in the 28GHz band. It will employ Multiple-Input Multiple-Output (MIMO) antenna technology with adaptive beamforming and beam tracking techniques, which facilitates robust and sustained mobile broadband communications in non-line-of-sight (NLOS) environments. With 800 MHz bandwidth support, the Snapdragon X50 5G modem is designed to support peak download speeds of up to 5 gigabits per second.
Designed to be used for multi-mode 4G/5G mobile broadband, as well as fixed wireless broadband devices, the Snapdragon X50 5G modem can be paired with a Qualcomm® Snapdragon™ processor with an integrated Gigabit LTE modem and interwork cohesively via dual-connectivity. Gigabit LTE will become an essential pillar for the 5G mobile experience, as it can provide a wide coverage layer for nascent 5G networks."
Ratification of an official “5G” standard has not taken place, but Qualcomm hopes to position itself at the forefront of its development. The mmWave technology (which is explained in this video) is only one part of the puzzle:
"Work has begun on defining, standardizing and designing the new OFDM-based 5G New Radio (NR) as part of the global 3GPP standard. 5G NR is being designed to support a wide variation of device-types, services and deployments. It is also being designed to get the most out of every bit of spectrum across a wide array of available spectrum bands and regulatory paradigms."
(More information is available on Qualcomm's 5G Technologies page.)
The Snapdragon X50 modem is set to begin sampling to OEMs in the second half of 2017, with the first half of 2018 projected for the first commercial products featuring the new modem.
Subject: Mobile | February 12, 2016 - 04:26 PM | Sebastian Peak
Tagged: X16 modem, qualcomm, mu-mimo, modem, LTE, Gigabit LTE, FinFET, Carrier Aggregation, 14nm
Qualcomm’s new X16 LTE Modem is the industry's first Gigabit LTE chipset to be announced, achieving speeds of up to 1 Gbps using 4x Carrier Aggregation. The X16 succeeds the recently announced X12 modem, improving on the X12's 3x Carrier Aggregation and moving from LTE CAT 12 to CAT 16 on the downlink, while retaining CAT 13 on the uplink.
"In order to make a Gigabit Class LTE modem a reality, Qualcomm added a suite of enhancements – built on a foundation of commercially-proven Carrier Aggregation technology. The Snapdragon X16 LTE modem employs sophisticated digital signal processing to pack more bits per transmission with 256-QAM, receives data on four antennas through 4x4 MIMO, and supports for up to 4x Carrier Aggregation — all of which come together to achieve unprecedented download speeds."
Gigabit speeds are only possible if multiple data streams are connected to the device simultaneously, and with the new X16 modem such aggregation is performed using LTE-U and LAA.
(Image via EE Times)
What does all of this mean? Aggregation is a term you'll see a lot as we progress into the next generation of cellular data technology, and with the X16 Qualcomm is emphasizing carrier over link aggregation. Essentially Carrier Aggregation works by combining the carrier LTE data signal (licensed, high transmit power) with a shorter-range, shared spectrum (unlicensed, low transmit power) LTE signal. When the signals are combined at the device (i.e. your smartphone), significantly better throughput is possible with this larger (aggregated) data ‘pipe’.
Qualcomm lists the four main options for unlicensed LTE deployment as follows:
- LTE-U: Based on 3GPP Rel. 12, LTE-U targets early mobile operators deployments in USA, Korea and India, with coexistence tests defined by LTE-U forum
- LAA: Defined in 3GPP Rel. 13, LAA (Licensed Assisted Access) targets deployments in Europe, Japan, & beyond.
- LWA: Defined in 3GPP Rel. 13, LWA (LTE - Wi-Fi link aggregation) targets deployments where the operators already has carrier Wi-Fi deployments.
- MulteFire: Broadens the LTE ecosystem to new deployment opportunities by operating solely in unlicensed spectrum without a licensed anchor channel
The X16 is also Qualcomm’s first modem to be built on 14nm FinFet process, which Qualcomm says is highly scalable and will enable the company to evolve the modem product line “to address an even wider range of product, all the way down to power-efficient connectivity for IoT devices.”
Qualcomm has already begun sampling the X16, and expects the first commercial products in the second half of 2016.
Subject: General Tech | March 2, 2015 - 01:49 PM | Jeremy Hellstrom
Tagged: SoFIA, silvermont, modem, LTE, Intel, Cherry Trail, atom x7, atom x5, atom x3, 7260
With MWC in full swing Intel showed off their mobile silicon to Ryan and to The Tech Report who compiled complete specifications of the Cherry Trail based Atom x5-8300 and 8500 as well as the x7-8700. All three of these chips will have an Intel designed XMM 7260 LTE modem as well as WiFi and NFC connectivity with the X7 also featuring Intel WiGig. You can also expect RealSense, True Key facial recognition and Pro Wireless Display to send secure wireless video to compatible displays for meetings. Check out the full list of stats here.
"Intel says the dual-core Atom x3-C3130 is shipping now, while the quad-core Atom x3-C3230RK is coming later in the first half of the year. The LTE-infused Atom x3-C3440 will follow in the second half. In all, the chipmaker names 19 partners on board with the Atom x3 rollout, including Asus, Compal, Foxconn, Pegatron, Weibu, and Wistron."
Here is some more Tech News from around the web:
- News: The TR Podcast 171: Nvidia takes heat, Carrizo runs cool, and Fractal stays quiet
- Seagate NAS owners: hide it behind a firewall. Fast. @ The Register
- The Samsung Galaxy S6 & Galaxy S6 Edge Unpacked Event @ Tech ARP
- MWC: Galaxy S6 and Galaxy S6 Edge arrive with metal redesign and QHD screens @ The Inquirer
- Acer enters Windows Phone fray with cheap Liquid M220 mobe @ The Register
- Microsoft Swarms all over Docker Machines @ The Register
SoFIA, Cherry Trail Make Debuts
Mobile World Congress is traditionally dominated by Samsung, Qualcomm, HTC, and others yet Intel continues to make in-roads into the mobile market. Though the company has admittedly lost a lot of money during this growing process, Intel pushes forward with today's announcement of a trio of new processor lines that keep the Atom brand. The Atom x3, the Atom x5, and the Atom x7 will be the company's answer in 2015 for a wide range of products, starting at the sub-$75 phone market and stretching up to ~$400 tablets and all-in-ones.
There are some significant differences in these Atom processors, more than the naming scheme might indicate.
Intel Atom x3 SoFIA Processor
For years now we have questioned Intel's capability to develop a processor that could fit inside the thermal envelope that is required for a smartphone while also offering performance comparable to Qualcomm, MediaTek, and others. It seemed that the x86 architecture was a weight around Intel's ankles rather than a float lifting it up. Intel's answer was the development of SoFIA, (S)mart (o)r (F)eature phone with (I)ntel (A)rchitecture. The project started about 2 years ago leading to product announcements finally reaching us today. SoFIA parts are "designed for budget smartphones; SoFIA is set to give Qualcomm and MediaTek a run for their money in this rapidly growing part of the market."
The SoFIA processors are based on the same Silvermont architecture as the current generation of Atom processors, but they are more tuned for power efficiency. Originally planned to be a dual-core only option, Intel has actually built both dual-core and quad-core variants that will pair with varying modem options to create a combination that best fit target price points and markets. Intel has partnered with RockChip for these designs, even though the architecture is completely IA/x86 based. Production will be done on a 28nm process technology at an unnamed vendor, though you can expect that to mean TSMC. This allows RockChip access to the designs, to help accelerate development, and to release them into the key markets that Intel is targeting.