Subject: Processors, Mobile | October 18, 2016 - 11:32 AM | Sebastian Peak
Tagged: SoC, Snapdragon 653, Snapdragon 626, Snapdragon 427, snapdragon, smartphone, qualcomm, mobile
Qualcomm has announced new 400 and 600-series Snapdragon parts, and these new SoCs (Snapdragon 653, 626, and 427) inherit technology found previously on the 800-series parts, including fast LTE connectivity and dual-camera support.
The integrated LTE modem has been significantly for each of these SoCs, and Qualcomm lists these features for each of the new products:
- X9 LTE with CAT 7 modem (300Mbps DL; 150Mbps UL) designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
- LTE Advanced Carrier Aggregation with up to 2x20 MHz in the downlink and uplink
- Support for 64-QAM in the uplink
- Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.
In addition to the new X9 modem, all three SoCs offer faster CPU and GPU performance, with the Snapdragon 653 (which replaces the 652) now supporting up to 8GB of memory - up from a max of 4GB previously. Each of the new SoCs also feature Qualcomm's Quick Charge 3.0 for fast charging.
Full specifications for these new products can be found on the updated Snapdragon product page.
Availability of the new 600-series Snapdragon processors is set for the end of this year, so we could start seeing handsets with the faster parts soon; while the Snapdragon 427 is expected to ship in devices early in 2017.
Subject: Networking, Mobile | October 17, 2016 - 11:00 PM | Sebastian Peak
Tagged: Snapdragon X50, snapdragon, qualcomm, modem, mobile, mmWave, LTE, cellular, 5G
Qualcomm has officially unveiled the development of a new 5G modem with the Snapdragon X50, which targets OEMs and early 5G development. The X50 supports milimeter wave (mmWave) technology initially, and rather than replace existing LTE solutions the X50 is designed to work alongside LTE modems integrated into Snapdragon SoCs, for a seamless handoff between 5G and 4G networks.
"The Snapdragon X50 5G modem will initially support operation in millimeter wave (mmWave) spectrum in the 28GHz band. It will employ Multiple-Input Multiple-Output (MIMO) antenna technology with adaptive beamforming and beam tracking techniques, which facilitates robust and sustained mobile broadband communications in non-line-of-sight (NLOS) environments. With 800 MHz bandwidth support, the Snapdragon X50 5G modem is designed to support peak download speeds of up to 5 gigabits per second.
Designed to be used for multi-mode 4G/5G mobile broadband, as well as fixed wireless broadband devices, the Snapdragon X50 5G modem can be paired with a Qualcomm® Snapdragon™ processor with an integrated Gigabit LTE modem and interwork cohesively via dual-connectivity. Gigabit LTE will become an essential pillar for the 5G mobile experience, as it can provide a wide coverage layer for nascent 5G networks."
Ratification of an official “5G” standard has not taken place, but Qualcomm hopes to position itself at the forefront of its development. The mmWave technology (which is explained in this video) is only one part of the puzzle:
"Work has begun on defining, standardizing and designing the new OFDM-based 5G New Radio (NR) as part of the global 3GPP standard. 5G NR is being designed to support a wide variation of device-types, services and deployments. It is also being designed to get the most out of every bit of spectrum across a wide array of available spectrum bands and regulatory paradigms."
(More information is available on Qualcomm's 5G Technologies page.)
The Snapdragon X50 modem is set to begin sampling to OEMs in the second half of 2017, with the first half of 2018 projected for the first commercial products featuring the new modem.
Introduction and Specifications
The iPhone 7 and 7 Plus are here, and while outwardly they look very similar to last year’s 6s models, there have been some significant upgrades (and a highly controversial change) to the new phones. Is there enough in this iterative update to justify an upgrade? After spending a couple of weeks using one as my primary device, I will attempt to answer this question.
While there had been rumors swirling of an all-new design featuring an OLED display, Apple appears to be holding back until next year - which just happens to be the 10th anniversary of the iPhone. Considering this fact, it may just be that the iPhone 7 is something of a stop-gap for 2017. Some of the rumored elements are here, however; with the elimination of the physical home button (it's a solid-state version now) and 3.5 mm headphone jack (the latter causing much consternation). The camera on both phones is completely new as well, with a special dual-lens version exclusive to the 7 Plus.
First we'll go over the specs of these phones. As you can see, there are still some areas that are not fully known, such as the exact speed of the low-power cores in the new quad-core SoC, and the specifics about this year's GPU.
|Apple iPhone 7||Apple iPhone 7 Plus|
|Processor||Apple A10 Fusion SoC
2.34 GHz dual-core + 2x low-power cores (? MHz)
|Graphics||6-core (unknown GPU)|
|Screen||4.7-inch IPS, DCI-P3 capable||5.5-inch IPS, DCI-P3 capable|
|Cameras||Back: 12MP, ƒ/1.8, OIS
Front: 7MP, ƒ/2.2
|Back: 12MP, f /1.8, OIS
Dual-camera with 2x telephoto lens
Front: 7MP, ƒ/2.2
|Video||Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps||Video: 4K @ 30 fps, 1080p @ 60/30 fps, 720p @ 30 fps|
|Wireless||802.11a/b/g/n/ac Wi‑Fi with MIMO
Bluetooth 4.2, NFC
|FDD-LTE (Bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26, 27, 28, 29, 30)
TD-LTE (Bands 38, 39, 40, 41)
UMTS/HSPA+/DC-HSDPA (850, 900, 1700/2100, 1900, 2100 MHz)
GSM/EDGE (850, 900, 1800, 1900 MHz)
|Battery||1960 mAh||2900 mAh|
|Dimensions||138.3 x 67.1 x 7.1 mm
(5.44 x 2.64 x 0.28 inches)
138 g (4.87 oz)
|158.2 x 77.9 x 7.3 mm
(6.23 x 3.07 x 0.29 inches)
188 g (6.63 oz)
|Price||$649 - $849||$769 - $969|
Nearly a Decade of iPhone
The iPhone was introduced in 2007 (Image credit: Apple, via archive.org)
It’s hard to believe it’s been nine years since the original iPhone launched. Announced in January of 2007 by Steve Jobs during his keynote speech at CES, it set a standard that the rest of the industry would take some time to meet (remember, the first Android phone was over a year away at this point.) But nine years is an age in technology years, and that first version seems like an antique now. (The original iPhone specs: 3.5-inch display with 320x480 resolution, single-core ARM processor running at 412 MHz, 128 MB of system memory, 4GB/8GB storage.)
Subject: Mobile | September 7, 2016 - 09:16 PM | Sebastian Peak
Tagged: smartphone, mobile, iPhone 7 Plus, iPhone 7, iphone, DCI P3, apple, a10
Another Apple announcement is in the books, and with it comes the expected refresh to the iPhone lineup. The new iPhone 7 and 7 Plus offer some notable upgrades from the previous models, though it's the lack of a 3.5 mm headphone jack that has been getting much of the attention.
Looking past the omission of the headphone jack for a moment, what exactly is new and noteworthy here? For starters, the iPhone 7 brings a new SoC to the table with the A10, a new design that is Apple's first foray into a "big.LITTLE" type of configuration. Unlike the A9 SoC's processor, a dual-core 1.85 GHz design, the A10 now offers a pair of high-performance cores, and a pair of high-efficiency cores that Apple says require only 1/5 of the larger pair's power. This sort of processor configuration is obviously similar to a number of existing ARM designs, which similarly combine faster and slower cores in an effort to reduce power consumption - though the 1/5 number is significant. It will be enlightening to see what the actual core speeds are - as well as particulars on the GPU, which is "50% faster" than the A9's PowerVR GT7600.
Other major updates include the cameras, which now features optical image stabilization (OIS) in the regular 7 as well as the 7 Plus (it was a 6/6s Plus-exclusive feature previously). The camera - or rather cameras - on the iPhone 7 Plus provide separate wide-angle and telephoto lenses, and allow for some powerful depth-of-field effects as demoed during the presentation. The displays contain another significant update - but not in resolution. The previous (low) 750x1344 resolution from the 6s remains in the iPhone 7, with the 7 Plus sticking to 1080x1920. The upgrade comes from the backlighting, which now provides 25% greater brightness and much wider color from the DCI P3 color space.
The lack of a 3.5 mm headphone jack was rumored for months leading up to today's announcement, and of course it will be a controversial topic. The Lightning connector is the only port on the iPhone 7/7 Plus, and Lightning-connected earbuds are included along with a 3.5 mm adapter (which also includes the DAC and headphone amp). The new haptic motor for the new non-mechanical home button is partly to blame for the omission of the headphone jack, but might also have been removed as part of the process to make the iPhone water resistant - a first for Apple.
Wireless earbuds ("AirPods") were also announced, which look pretty much like the existing "EarPods" with the cord cut off. One final note on sound: the new iPhones have stereo speakers for the first time, with sound claimed to be 50% louder than previous, and now emanating from both ends of the phone.
The family of iPhones now includes the new iPhone 7 and 7 Plus, along with existing 6s, 6s Plus, and the iPhone SE. In a surprising move, Apple announced that they would upgrade last year's 6s models to shipping with double the base storage - 32GB vs. 16GB - for the same price.
Pre-orders for the new iPhones begin on September 9th, with pricing beginning at $649 for the 32GB iPhone 7, and $769 for the 32GB iPhone 7 Plus.
Subject: Processors, Mobile | August 31, 2016 - 07:30 AM | Sebastian Peak
Tagged: SoC, Snapdragon 821, snapdragon, SD821, qualcomm, processor, mobile, adreno
Qualcomm has officially launched the Snapdragon 821 SoC, an upgraded successor to the existing Snapdragon 820 found in such phones as the Samsung Galaxy S7.
"With Snapdragon 820 already powering many of the premier flagship Android smartphones today, Snapdragon 821 is now poised to become the processor of choice for leading smartphones and devices for this year’s holiday season. Qualcomm Technologies’ engineers have improved Snapdragon 821 in three key areas to ensure Snapdragon 821 maintains the level of industry leadership introduced by its predecessor."
Specifications were previously revealed when the Snapdragon 821 was announced in July, with a 10% increase on the CPU clocks (2.4 GHz, up from the previous 2.2 GHz max frequency). The Adreno 530 GPU clock increases 5%, to 650 MHz from 624 MHz. In addition to improved performance from CPU and GPU clock speed increases, the SD821 is said to offer lower power consumption (estimated at 5% compared to the SD820), and offers new functionality including improved auto-focus capability.
Enhanced overall user experience:
The Snapdragon 821 has been specifically tuned to support a more responsive user experience when compared with the 820, including:
- Shorter boot times: Snapdragon 821 powered devices can boot up to 10 percent faster.
- Faster application launch times: Snapdragon 821 can reduce app load times by up to 10 percent.
- Smoother, more responsive user interactions: UI optimizations and performance enhancements designed to allow users to enjoy smoother scrolling and more responsive browsing performance.
Improved performance and power consumption:
- CPU speeds increase: As we previously announced, the 821 features Qualcomm Kryo CPU speeds up to 2.4GHz, representing an up to 10 percent improvement in performance over Snapdragon 820.
- GPU speeds increase: The Qualcomm Adreno GPU received a 5 percent speed increase over Snapdragon 820.
- Power savings: The 821 is engineered to deliver an incremental 5 percent power savings when comparing standard use case models. This power savings can extend battery life and support OEMs interested in reducing battery size for slimmer phones.
New features and functionality:
- Snapdragon 821 introduces several new features and capabilities, offering OEMs new options to create more immersive and engaging user experiences, including support for:
- Snapdragon VR SDK (Software Development Kit): Offers developers a superior mobile VR toolset, provides compatibility with the Google Daydream platform, and access to Snapdragon 821’s powerful heterogeneous architecture. Snapdragon VR SDK supports a superior level of visual and audio quality and more immersive virtual reality and gaming experiences in a mobile environment.
- Dual PD (PDAF): Offers significantly faster image autofocus speeds under a wide variety of conditions when compared to single PDAF solutions.
- Extended Laser Auto-Focus Ranging: Extends the visible focusing range, improving laser focal accuracy over Snapdragon 820.
- Android Nougat OS: Snapdragon 821 (as well as the 820) will support the latest Android operating system when available, offering new features, expanded compatibility, and additional security compared to prior Android versions.
Qualcomm says the ASUS ZenFone 3 Deluxe is the first phone to use this new Snapdragon 821 SoC while other OEMs will be working on designs implementing the upgraded SoC.
Subject: Editorial | August 18, 2016 - 02:20 PM | Ryan Shrout
Tagged: video, podcast, pascal, nvidia, msi, mobile, Intel, idf, GTX 1080, gtx 1070, gtx 1060, gigabyte, FMS, Flash Memory Summit, asus, arm, 10nm
PC Perspective Podcast #413 - 08/18/2016
Join us this week as we discuss the new mobile GeForce GTX 10-series gaming notebooks, ARM and Intel partnering on 10nm, Flash Memory Summit and more!
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Hosts: Allyn Malventano, Sebastian Peak, Josh Walrath and Jeremy Hellstrom
Week in Review:
This episode of PC Perspective is brought to you by Casper!! Use code “PCPER”
News items of interest:
0:42:05 Final news from FMS 2016
Hardware/Software Picks of the Week
Take your Pascal on the go
Easily the strongest growth segment in PC hardware today is in the adoption of gaming notebooks. Ask companies like MSI and ASUS, even Gigabyte, as they now make more models and sell more units of notebooks with a dedicated GPU than ever before. Both AMD and NVIDIA agree on this point and it’s something that AMD was adamant in discussing during the launch of the Polaris architecture.
Both AMD and NVIDIA predict massive annual growth in this market – somewhere on the order of 25-30%. For an overall culture that continues to believe the PC is dying, seeing projected growth this strong in any segment is not only amazing, but welcome to those of us that depend on it. AMD and NVIDIA have different goals here: GeForce products already have 90-95% market share in discrete gaming notebooks. In order for NVIDIA to see growth in sales, the total market needs to grow. For AMD, simply taking back a portion of those users and design wins would help its bottom line.
But despite AMD’s early talk about getting Polaris 10 and 11 in mobile platforms, it’s NVIDIA again striking first. Gaming notebooks with Pascal GPUs in them will be available today, from nearly every system vendor you would consider buying from: ASUS, MSI, Gigabyte, Alienware, Razer, etc. NVIDIA claims to have quicker adoption of this product family in notebooks than in any previous generation. That’s great news for NVIDIA, but might leave AMD looking in from the outside yet again.
Technologically speaking though, this makes sense. Despite the improvement that Polaris made on the GCN architecture, Pascal is still more powerful and more power efficient than anything AMD has been able to product. Looking solely at performance per watt, which is really the defining trait of mobile designs, Pascal is as dominant over Polaris as Maxwell was to Fiji. And this time around NVIDIA isn’t messing with cut back parts that have brand changes – GeForce is diving directly into gaming notebooks in a way we have only seen with one release.
The ASUS G752VS OC Edition with GTX 1070
Do you remember our initial look at the mobile variant of the GeForce GTX 980? Not the GTX 980M mind you, the full GM204 operating in notebooks. That was basically a dry run for what we see today: NVIDIA will be releasing the GeForce GTX 1080, GTX 1070 and GTX 1060 to notebooks.
Subject: Processors | April 5, 2016 - 06:30 AM | Josh Walrath
Tagged: mobile, hp, GCN, envy, ddr4, carrizo, Bristol Ridge, APU, amd, AM4
Today AMD is “pre-announcing” their latest 7th generation APU. Codenamed “Bristol Ridge”, this new SOC is based off of the Excavator architecture featured in the previous Carrizo series of products. AMD provided very few hints as to what was new and different in Bristol Ridge as compared to Carrizo, but they have provided a few nice hints.
They were able to provide a die shot of the new Bristol Ridge APU and there are some interesting differences between it and the previous Carrizo. Unfortunately, there really are no changes that we can see from this shot. Those new functional units that you are tempted to speculate about? For some reason AMD decided to widen out the shot of this die. Those extra units around the border? They are the adjacent dies on the wafer. I was bamboozled at first, but happily Marc Sauter pointed it out to me. No new functional units for you!
This is the Carrizo shot. It is functionally identical to what we see with Bristol Ridge.
AMD appears to be using the same 28 nm HKMG process from GLOBALFOUNDRIES. This is not going to give AMD much of a jump, but from information in the industry GLOBALFOUNDRIES and others have put an impressive amount of work into several generations of 28 nm products. TSMC is on their third iteration which has improved power and clock capabilities on that node. GLOBALFOUNDRIES has continued to improve their particular process and likely Bristol Ridge is going to be the last APU built on that node.
All of the competing chips are rated at 15 watts TDP. Intel has the compute advantage, but AMD is cleaning up when it comes to graphics.
The company has also continued to improve upon their power gating and clocking technologies to keep TDPs low, yet performance high. AMD recently released the Godavari APUs to the market which exhibit better clocking and power characteristics from the previous Kaveri. Little was done on the actual design, rather it was improved process tech as well as better clock control algorithms that achieved these advances. It appears as though AMD has continued this trend with Bristol Ridge.
We likely are not seeing per clock increases, but rather higher and longer sustained clockspeeds providing the performance boost that we are seeing between Carrizo and Bristol Ridge. In these benchmarks AMD is using 15 watt TDP products. These are mobile chips and any power improvements will show off significant gains in overall performance. Bristol Ridge is still a native quad core part with what looks to be an 8 module GCN unit.
Again with all three products at a 15 watt TDP we can see that AMD is squeezing every bit of performance it can with the 28 nm process and their Excavator based design.
The basic core and GPU design look relatively unchanged, but obviously there were a lot of tweaks applied to give the better performance at comparable TDPs.
AMD is announcing this along with the first product that will feature this APU. The HP Envy X360. This convertible tablet offers some very nice features and looks to be one of the better implementations that AMD has seen using its latest APUs. Carrizo had some wins, but taking marketshare back from Intel in the mobile space has been tortuous at best. AMD obviously hopes that Bristol Ridge in the sub-35 watt range will continue to show fight for the company in this important market. Perhaps one of the more interesting features is the option for the PCIe SSD. Hopefully AMD will send out a few samples so we can see what a more “premium” type convertible can do with the AMD silicon.
The HP Envy X360 convertible in all of its glory.
Bristol Ridge will be coming to the AM4 socket infrastructure in what appears to be a Computex timeframe. These parts will of course feature higher TDPs than what we are seeing here with the 15 watt unit that was tested. It seems at that time AMD will announce the full lineup from top to bottom and start seeding the market with AM4 boards that will eventually house the “Zen” CPUs that will show up in late 2016.
Fighting for Relevance
AMD is still kicking. While the results of this past year have been forgettable, they have overcome some significant hurdles and look like they are improving their position in terms of cutting costs while extracting as much revenue as possible. There were plenty of ups and downs for this past quarter, but when compared to the rest of 2015 there were some solid steps forward here.
The company reported revenues of $958 million, which is down from $1.06 billion last quarter. The company also recorded a $103 million loss, but that is down significantly from the $197 million loss the quarter before. Q3 did have a $65 million write-down due to unsold inventory. Though the company made far less in revenues, they also shored up their losses. The company is still bleeding, but they still have plenty of cash on hand for the next several quarters to survive. When we talk about non-GAAP figures, AMD reports a $79 million loss for this past quarter.
For the entire year AMD recorded $3.99 billion in revenue with a net loss of $660 million. This is down from FY 2014 revenues of $5.51 billion and a net loss of $403 million. AMD certainly is trending downwards year over year, but they are hoping to reverse that come 2H 2016.
Graphics continues to be solid for AMD as they increased their sales from last quarter, but are down year on year. Holiday sales were brisk, but with only the high end Fury series being a new card during this season, the impact of that particular part was not as great as compared to the company having a new mid-range series like the newly introduced R9 380X. The second half of 2016 will see the introduction of the Polaris based GPUs for both mobile and desktop applications. Until then, AMD will continue to provide the current 28 nm lineup of GPUs to the market. At this point we are under the assumption that AMD and NVIDIA are looking at the same timeframe for introducing their next generation parts due to process technology advances. AMD already has working samples on Samsung’s/GLOBALFOUNDRIES 14nm LPP (low power plus) that they showed off at CES 2016.
Introduction and CPU Performance
We had a chance this week to go hands-on with the Snapdragon 820, the latest flagship SoC from Qualcomm, in a hardware session featuring prototype handsets powered by this new silicon. How did it perform? Read on to find out!
As you would expect from an all-new flagship part, the Snapdragon 820 offers improvements in virtually every category compared to their previous products. And with the 820 Qualcomm is emphasizing not only performance, but lower power consumption with claims of anywhere from 20% to 10x better efficiency across the components that make up this new SoC. And part of these power savings will undoubtedly come as the result of Qualcomm’s decision to move to a quad-core design with the 820, rather than the 8-core design of the 810.
So what exactly does comprise a high-end SoC like the Snapdragon 820? Ryan covered the launch in detail back in November (and we introduced aspects of the new SoC in a series of articles leading up to the launch). In brief, the Snapdragon 820 includes a custom quad-core CPU (Kryo), the Andreno 530 GPU, a new DSP (Hexagon 680), new ISP (Spectra), and a new LTE modem (X12). The previous flagship Snapdragon 810 used stock ARM cores (Cortex-A57, Cortex-A53) in a big.LITTLE configuration, but for various reasons Qualcomm has chosen not to introduce another 8-core SoC with this new product.
The four Kryo CPU cores found in the Snapdragon 820 can operate at speeds of up to 2.2 GHz, and since is half the number of the octo-core Snapdragon 810, the IPC (instructions per clock) of this new part will help determine how competitive the SD820's performance will be; but there’s a lot more to the story. This SoC design placed equal emphasis on all components therein, and the strategy with the SD820 seems to be leveraging the capability of the advanced signal processing (Hexagon 680) which should help offload the work to allow the CPU to work with greater efficiency, and at lower power.