Subject: General Tech | January 8, 2018 - 06:00 PM | Sebastian Peak
Tagged: SoC, qualcomm, QCC5100, low power, bluetooth, aptX HD, aptX, ANC, active noise cancellation
Qualcomm has announced a new low-power Bluetooth SoC with the QCC5100 series, a single-chip solution targeting wireless earbuds and other audio devices with the promise of longer battery life and better audio quality than existing solutions. The QCC5100 integrates ANC (active noise cancellation), aptX HD audio, and 3rd-party voice assistant support, among other features.
Qualcomm Biometric Headset Example Design
Features for the QCC5100 from Qualcomm:
- Low power design and ultra-small form factor
- Dual-core 32-bit processor application subsystem
- Dual-core Qualcomm® Kalimba™ DSP Audio subsystem
- Support for aptX and aptX HD, Qualcomm TrueWireless Stereo, and Enhanced ANC (Feed- Forward, Feed-Backward, Hybrid)
- Voice Assistant Services, low power wake word detection
- Bluetooth 5.0 and 2 Mbps Bluetooth® Low Energy support
- Embedded ROM + RAM and support for external Flash memory
- 2-ch 98dBA headset class D (integrated amplifier)
- 2-ch 99dBA line inputs (single ended)
- 192kHz 24-bit I2S & SPDIF interfaces
- Flexible software platform with powerful new IDE support
Qualcomm Occluded Earbuds Example Design
Qualcomm says this new chip - a ground-up design with a quad-core processor architecture (2x APs and 2x DSPs) - offers power savings of up to 65% and provides up to 3x playback time of current Bluetooth devices on the market.
Qualcomm has shown device designs using the new SoC including occluded earbuds (no wire connecting the two) and a biometric headset, and while there are no announcements on shipping products Qualcomm expects to have examples for manufacturers in the first half of 2018.
Full press release after the break.
Subject: Processors | March 15, 2016 - 12:52 PM | Sebastian Peak
Tagged: TSMC, SoC, servers, process technology, low power, FinFET, datacenter, cpu, arm, 7nm, 7 nm FinFET
ARM and TSMC have announced their collaboration on 7 nm FinFET process technology for future SoCs. A multi-year agreement between the companies, products produces on this 7 nm FinFET process are intended to expand ARM’s reach “beyond mobile and into next-generation networks and data centers”.
TSMC Headquarters (Image credit: AndroidHeadlines)
So when can we expect to see 7nm SoCs on the market? The report from The Inquirer offers this quote from TSMC:
“A TSMC spokesperson told the INQUIRER in a statement: ‘Our 7nm technology development progress is on schedule. TSMC's 7nm technology development leverages our 10nm development very effectively. At the same time, 7nm offers a substantial density improvement, performance improvement and power reduction from 10nm’.”
Full press release after the break.
Subject: Processors | January 5, 2015 - 07:30 PM | Josh Walrath
Tagged: SoC, low power, Intel, Cherry Trail, cell phones, ces 2015, CES, Bay Trail, 14 nm trigate, tablets
It wouldn’t be CES if there wasn’t an Intel release. Today they are releasing their latest 14 nm Cherry Trail SOC. Very little information has been released about this part, but it is the follow-up to the fairly successful Bay Trail. That particular part was a second generation 22 nm part that exhibited very good power and performance characteristics for the price. While Bay Trail was not as popular as Intel had hoped for, it did have some impressive design wins in multiple market sectors.
The next generation process technology from Intel will improve power and performance for the Cherry Trail parts as compared to previous products. It will work in both Windows and Android environments. While Cherry Trail is x86, Intel has been working very closely with Google to get Android to work effectively and quickly with a non-ARM based ISA.
Intel is shipping these parts to their partners for integration into phones, tablets, and small form factor computers. We had previously seen Bay Trail parts integrated into low cost motherboards with the J1800 and J1900 SKUs from Intel. We can expect these products to be refreshed with the latest Cherry Trail products that are being released today.
There is very little information being provided by Intel about the nuts and bolts of the Cherry Trail products. Intel promises to release more information once their partners start announcing individual products. We know that these parts will have improved graphics performance and will exist in the same TDPs as previous Bay Trail products. Other than that, feeds and speeds are a big question for this latest generation part.
These products will be integrating Intel’s RealSense technology. Password-less security, gestures, and 3D camera recognition are all aspects of this technology. I am sure we will get more information on how this technology leverages the power of the CPU cores and GPU cores in the latest Cherry Trail SOCs.
Follow all of our coverage of the show at http://pcper.com/ces!
Low Power and Low Price
Back at CES earlier this year, we came across a couple of interesting motherboards that were neither AM3+ nor FM2+. These small, sparse, and inexpensive boards were actually based on the unannounced AM1 platform. This socket is actually the FS1b socket that is typically reserved for mobile applications which require the use of swappable APUs. The goal here is to provide a low cost, upgradeable platform for emerging markets where price is absolutely key.
AMD has not exactly been living on easy street for the past several years. Their CPU technologies have not been entirely competitive with Intel. This is their bread and butter. Helping to prop the company up though is a very robust and competitive graphics unit. The standalone and integrated graphics technology they offer are not only competitive, but also class leading in some cases. The integration of AMD’s GCN architecture into APUs has been their crowning achievement as of late.
This is not to say that AMD is totally deficient in their CPU designs. Their low power/low cost designs that started with the Bobcat architecture all those years back have always been very competitive in terms of performance, price, and power consumption. The latest iteration is the Kabini APU based on the Jaguar core architecture paired with GCN graphics. Kabini will be the part going into the FS1b socket that powers the AM1 platform.
Kabini is a four core processor (Jaguar) with a 128 unit GCN graphics part (8 GCN cores). These APUs will be rated at 25 watts up and down the stack. Even if they come with half the cores, it will still be a 25 watt part. AMD says that 25 watts is the sweet spot in terms of performance, cooling, and power consumption. Go lower than that and too much performance is sacrificed, and any higher it would make more sense to go with a Trinity/Richland/Kaveri solution. That 25 watt figure also encompasses the primary I/O functionality that typically resides on a standalone motherboard chipset. Kabini features 2 SATA 6G ports, 2 USB 3.0 ports, and 8 USB 2.0 ports. It also features multiple PCI-E lanes as well as a 4x PCI-E connection for external graphics. The chip also supports DisplayPort, HDMI, and VGA outputs. This is a true SOC from AMD that does a whole lot of work for not a whole lot of power.
Subject: General Tech | July 30, 2013 - 12:41 PM | Jeremy Hellstrom
Tagged: Intel, arm, low power, server, Avoton, rangeley
Intel envisions a sea change in the server room, with servers, SANs and racks of switches which all have been controlled separately becoming much more software based as the ability to virtualize hardware becomes more prevalent. This is not to imply that the hardware will disappear and that Intel will go the way of IBM and get out of the chip business as neither are true; instead Intel is moving forward on the belief that the optimization of your virtualization software will be more important than specific hardware optimizations. While it is great to have tiered storage with expensive SSDs, solid SAS drives and other longer term and lower availability all working together there is little benefit if the software which allocates your data to those media doesn't do so properly.
In this new server room the SoC could be king, modular designs which offer scalable processing power to any and all tasks which is something that ARM cut its teeth on and is now scaling up their power to become a major player in server room design. Intel is coming at this market segment from the other direction as it has to trim power down on its chips without crippling them like we saw in the first 45nm Atom chips. To that end they are working on the new Silvermont architecture, the 22nm Avoton and Rangley which will be mature 64bit chips, something that ARM is still in early days with. Check out more info on these two chips and their successors, along with a teaser on Broadwell at The Tech Report.
"Last week, Intel hosted an event for press and analysts where it provided some updates on the state of its data center business. Then it proceeded to confound our expectations by demonstrating how it's gearing up for a protracted fight with ARM."
Here is some more Tech News from around the web:
- NVIDIA's Linux Driver On Ubuntu Is Very Competitive With Windows 8 @ Phoronix
- BeagleBone Black becomes a handheld classic gaming console @ Hack a Day
- Nvidia buys Portland Group for compiler smarts @ The Register
- KitGuru visit the Overclockers UK Store
- Funky Kit Interview with ASRock
Jaguar Hits the Embedded Space
It has long been known that AMD has simply not had a lot of luck going head to head against Intel in the processor market. Some years back they worked on differentiating themselves, and in so doing have been able to stay afloat through hard times. The acquisitions that AMD has made in the past decade are starting to make a difference in the company, especially now that the PC market that they have relied upon for revenue and growth opportunities is suddenly contracting. This of course puts a cramp in AMD’s style, but with better than expected results in their previous quarter, things are not nearly as dim as some would expect.
Q1 was still pretty harsh for AMD, but they maintained their marketshare in both processors and graphics chips. One area that looks to get a boost is that of embedded processors. AMD has offered embedded processors for some time, but with the way the market is heading they look to really ramp up their offerings to fit in a variety of applications and SKUs. The last generation of G-series processors were based upon the Bobcat/Brazos platform. This two chip design (APU and media hub) came in a variety of wattages with good performance from both the CPU and GPU portion. While the setup looked pretty good on paper, it was not widely implemented because of the added complexity of a two chip design plus thermal concerns vs. performance.
AMD looks to address these problems with one of their first, true SOC designs. The latest G-series SOC’s are based upon the brand new Jaguar core from AMD. Jaguar is the successor to the successful Bobcat core which is a low power, dual core processor with integrated DX11/VLIW5 based graphics. Jaguar improves performance vs. Bobcat in CPU operations between 6% to 13% when clocked identically, but because it is manufactured on a smaller process node it is able to do so without using as much power. Jaguar can come in both dual core and quad core packages. The graphics portion is based on the latest GCN architecture.
Subject: Processors | January 6, 2013 - 05:09 PM | Josh Walrath
Tagged: valleyview, low power, Intel, Bay Trail, atom
When the original Intel Atom hit the scene, it was a reasonably large success for Intel with the massive explosion of netbooks. The original design was very simplistic, but was fairly power efficient. The weak link of the original Atom was the 945 chipset graphics that were not only underpowered, but were based on a relatively power hungry desktop chipset. The eventual competition from AMD featured a next generation low power core based on the Bobcat architecture which featured a modern graphics core that was more than adequate for most scenarios.
Intel never stood still, but their advancement of the low power cores was slow as compared to the massive leaps and bounds we saw from the original Core architecture in 2006 on the desktop and server markets. Typically these products lagged the desktop products in terms of process nodes, but they continued to advance these cores little by little.
Leap forward a few years and we saw the eventual demise of the netbook and the massive uptake of mobile computing. Mobile computing was primarily comprised of tablets and smartphones. Intel was late to the party as compared to products from Qualcomm, Samsung, and NVIDIA. A fire was lit under the Atom group at Intel, as the competition had far surpassed the company in ultra-mobile parts.
Happily for those of us paying attention, the 3D Center Forum has released some very interesting slides about the 22 nm generation of Atom products and the platforms they will be integrated into. Valleyview is the SoC while Bay Trail is the platform.
Valleyview is based on Intel’s 22 nm process and will be a next generation Atom processor with a multitude of new features. It will be a SoC as it will no longer require a traditional southbridge. It will have improved graphics as compared to the most recent Atom processors. While the SoC will feature USB 3.0, it will not embrace SATA-6G or PCI-E 3.0. The CPU will go up to quad core units that will be 50% to 100% faster than current parts. These new chips will also introduce a boost functionality (think desktop Turbo Boost) that will run the frequency equal to or greater than 2.7 GHz.
Power is of course the primary concern, and these products will be offered from 3 watts and below (Bay Trail T) and up to 12 watts (Bay Trail D) These products will not be competing with the Haswell products which are rumored to get around 10 watts at the very lowest.
While Intel has been slow to react to the mobile push, they are starting to get that ball rolling. It will be very interesting to see if they can move fast enough to outrun and outwit the ARM based competition, not to mention AMD’s latest 28 nm products that will be released in the first half of 2013.
Subject: General Tech | June 25, 2012 - 03:59 PM | Jeremy Hellstrom
Tagged: low power, geode, G-T16R, embedded, amd
The new embedded processor from AMD replaces the old Geode series and brings new performance to the ultra low end as this is a 4.5W TPD processor. The G-T16R APU supports Windows 7 Embedded Compact 7, Green Hills Integrity and Express Logic Thread X operating systems which makes the lack of support for DirectX 11 a moot point as these OSes are not about to need that support to begin with. The ultra low TDP means that no fan is required to use this processor and so you can expect an average draw of 2.3W from the system.
DirectX 11 might be missing but looking below you can see that there is a lot of other features included with this chip, from SATA 6Gbps to HD audio as well as HDMI out and support for PCIe 2.0 4x cards, you can get quite a bit from this little chip. Check out the ASUS press release here or just read the summary available at The Inquirer.
"CHIP DESIGNER AMD launched its lowest power accelerator processing unit (APU) yet with the 4.5W TDP G-T16R.
AMD's G series embedded GPUs have been offering some of the lowest power DirectX 11 capable chips for some time and now the firm has brought the TDP down even further with the G-T16R. Although the G-T16R doesn't support DirectX 11, it claims considerable performance benefits over the almost archaic but popular Geode LX embedded processors."
Here is some more Tech News from around the web:
- Firefox 'new tab' feature exposes users' secured info: Fix promised @ The Register
- Share Your Library with XBMC using MySQL @ Computing on Demand
- Intel Publishes Ivy Bridge Programming Documentation @ Phoronix
- Ubuntu 12.10 Prepares To Improve Linux Performance @ Phoronix
- MSI to launch a slide ultrabook in 4Q12 with a price of US$799 @ DigiTimes
- Exclusive interview with Dr Lisa Su from AMD @ Kitguru
Subject: General Tech | April 12, 2012 - 12:32 PM | Jeremy Hellstrom
Tagged: microserver, Centerton, seamicro, atom, low power
Microservers are the newest old idea to hit the PR flacks, anyone who remembers the original blade servers already has a good idea what a microserver is. Intel has once again tried to take ownership of a form factor, in this case defining what they feel the market should consider a microserver. In some ways, the single socket design seems to run counter to current low power servers, which tend towards large arrays of low powered APUs but at the same time when you no longer have to worry about the interconnects between those APUs you can drop the price significantly.
AMD has had several forays into this market and while Intel has never put much effort into this segment vendors like Dell and HP have been creating microservers using an Intel processor for some time. This heralds a change in Intel's strategy when taking on ARM and AMD in the server room, with the 6W Atom Centerton chip they announced at IDF. The Inquirer was also told of 10W and 15W parts which would be more powerful although they could also require a bit more space than what the 6W part could survive in. It seems that those looking for inexpensive servers which require very little infrastructure will have a lot of choices to spend their money on by the end of this year.
"CHIPMAKER Intel dropped an Atom bomb on the second day of IDF in Beijing, announcing its 'Centerton' microserver chip that will draw just a miserly 6W of thermal design power (TDP).
It defines a microserver as a computer with one socket, error correction, 64-bit processing, and minimal memory and I/O. The Atom Centerton platform will have two cores, Hyperthreading and support for ECC DDR3 as well as VT-x virtualisation technology. Intel said the Atom Centerton chip will be available in the second half of this year."
Here is some more Tech News from around the web:
- Intel introduces 910 Series PCIe SSD @ The Tech Report
- Intel's SSD 910: Finally a PCIe SSD from Intel @ AnandTech
- Intel expected to bring forward the launch of Ivy Bridge @ DigiTimes
- Malware-infected flash cards shipped out with HP switches @ The Register
- US sues Apple and book publishers for ebook price fixing @ The Inquirer
- WD pushes out super-slim shock-resistant Ultrabook drive @ The Register
- Samsung WB150F Review @ TechReviewSource
- Intel predicts 15 billion connected devices by 2015 @ Kitguru
- Ninjalane Podcast - Server Update Choosing a Video Card HWBot Team Update
- Microsoft Visual Studio 11 Preview @ Techgage
Subject: Memory | March 23, 2012 - 03:56 PM | Jeremy Hellstrom
Tagged: Samsung, Samsung Green PC3-12800, low profile, low power
There is a reason that Samsung's branding of these new DIMMs is green; they suck a mere 1.35V at their full speed of DDR3 1600MHz @ 11-11-11-28 and with the low profile they will fit in just about any machine. Of more interest to some readers would be their overclocking potential, which TechPowerUp explored and discovered that 2400 MHz with 1.575V was not only possible but also stable. They also went the other way and discovered the DIMMs could still run at stock speeds at 1.2V which gives you a lot to tweak on this RAM. Read on to see how the DIMMs performed and to learn a little about tWCL as well.
"Several tech forums are buzzing about Samsung's lastest "Green" 30 nm DDR3, that sips the voltage, and sits on a tiny low-profile PCB. We snagged a pair to see what all the fuss is about, and boy, were we surprised!"
Here are some more Memory articles from around the web:
- G.Skill RipjawsX F3-2133C9-32GXH 32 GB PC3-17000 1.6 V DDR3 @ techPowerUp
- Topower Gold Vapour Injection-HD DDR3 1866MHz 8GB Memory Kit Review @ eTeknix
- GSkill RipjawsZ PC3 17000 CL9 Quad Channel Memory Kit @ Ninjalane
- G.Skill ARES 16GB 2133mhz Memory Kit @ Kitguru
- G.Skill ARES PC3-17000 16GB @ Tweaktown
- Ivy Bridge High-Speed RAM Run with G.Skill PC3-20800 2666MHz RipjawsZ @ Tweaktown
- Patriot Viper Extreme PC3-16000 CL9 1.65 V DDR3 @ techPowerUp
- Crucial Ballistix Elite 8GB 1866MHz @ OC3D
- Kingston HyperX Red Limited Edition DDR3-1600 2x4GB Memory Kit Review @ Hi Tech Legion