Subject: Motherboards | August 5, 2015 - 07:00 PM | Jeremy Hellstrom
Tagged: Z170, lga1151, gigabyte
Gigabyte have launched their Z170 series of LGA1151 motherboard and you have quite a few to choose from. The 10 motherboards that are being released are the GA-Z170X-UD5, GA-Z170X-UD3, GA-Z170X-Gaming 7, GA-Z170X-Gaming 5, GA-Z170X-Gaming 3, GA-Z170X-Gaming G1, GA-Z170XP-SLI, GA-Z170-HD3P, GA-Z170M-D3H and GA-Z170-HD3. All the boards have differences of course, but let Gigabyte's PR explain to you the similarities.
City of Industry, California, August 5th, 2015 – GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is proud to announce today its new 100 series motherboards based on the Intel Z170 chipset with support for Intel’s new 6th Gen. Core processor. This updated platform marks a new era for the desktop PC with the continued support of DDR4, introduction of USB 3.1 over the new Type-C connector, as well as an array of onboard features and technologies that lets the user unleash the full power of their PC.
"We are very excited to launch our new 100 series motherboards based on Intel’s new Z170 chipset here at Gamescom in Germany, ” commented Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. “We know everyone has been eagerly waiting for this, so we made sure our 100 series motherboards are packed with features which will make them stand out and provide the best possible experience from the latest 6th Gen. Core CPU from Intel.”
GIGABYTE 100 Series Motherboards
With the 100 series, GIGABYTE offers three motherboard segments to satisfy everyone’s specific needs. The Ultra Durable caters to users looking for a board that has long lasting, high quality components while the G1 Gaming targets gamers that demand cutting edge audio and graphics performance, and with the SOC Force GIGABYTE is bringing a solution for those who are looking to push their hardware performance off the charts. GIGABYTE brings a series of features that won’t let anyone down.
Intel 6th Gen. Core CPUs and Z170 Chipset
With its new 6th Gen. Core CPUs and Z170 chipset, Intel provides notable improvements over the previous generation and revolutionary new features such as support for Windows 10 and DirectX 12, the latest and greatest operating system and API from Microsoft which are both supported natively on GIGABYTE motherboards. Additionally, the new LGA 1151 socketed 14nm CPU from Intel brings both DDR4 and DDR3 support as well as enough power to support up to 3 independent digital displays and enhanced full range BCLK overclocking!
Introduction and Technical Specifications
Our Intel Skylake launch coverage is intense! Make sure you hit up all the stories and videos that are interesting for you!
- The Intel Core i7-6700K Review - Skylake First for Enthusiasts (Video)
- Skylake vs. Sandy Bridge: Discrete GPU Showdown (Video)
- ASUS Z170-A Motherboard Preview
- Intel Skylake / Z170 Rapid Storage Technology Tested - PCIe and SATA RAID
ASUS used the introduction of the Z170 chipset and Intel LGA1151 processors to revamp their new motherboard product lines, updating the aesthetics and features with the latest innovations. We are giving you a preview of what to expect from the ASUS Z170 chipset boards, using the Z170-A board provided for evaluation. A more detailed evaluation of the ASUS Z170-A will be released in the coming weeks as we receive evaluation samples from other manufacturers with which we can compare it.
Courtesy of ASUS
Courtesy of ASUS
ASUS updated the aesthetics of the channel series boards, changing the previous generation's black and gold design to a much more eye-catching black and white with blue accents. The Z170-A motherboard even comes with an integrated rear panel cover and large black-chromed heat sinks for its VRMs. The board offers full support for Intel's new line of LGA1151 "Skylake-S" processors, paired with dual channel DDR4 memory.
Courtesy of ASUS
ASUS integrated their latest overclocking technology into the Z170-A motherboard, giving their "entry-level" model the same overclocking potential as offered with their flagship board. ASUS uses a tri-chip design to ensure the board's overclocking capabilities - the Pro Clock control chip, the TPU chip, and the EPU chip. The three chips work in concert to unlock ultra-high frequencies for pushing you Skylake processor to its limits.
Courtesy of ASUS
The Z170-A motherboard also has the latest ASUS sound technology integrated - Crystal Sound 3. Like its predecessors, Crystal Sound 3 integrates the audio components on a isolated PCB from the other main board components minimizing noise generation caused by those other integrated devices. ASUS designed the audio subsystem with high-quality Japanese-sourced audio and power circuitry for a top-notch audio experience.
Subject: General Tech | June 18, 2015 - 12:20 PM | Jeremy Hellstrom
Tagged: Skylake, lga1151, Intel, i7-6700K, i5-6600K, H110, 14nm
DigiTimes has some dates for Skylake, with the desktop chips you are most interesting being revealed at Gamescon in Germany at the end of August. There will be a pair of i7 models, one unlocked K model and a power optimized T model and six i5 models, three with lower TDPs and at least one unlocked i5, the 6600K. A month after the new chips are shown off will come the arrival of the new LGA 1151 socketed H110 chipset, which will likely be compatible with a certain AiO watercooler. Mobile versions will not be for sale until the new year but the long wait will likely mean the inclusion of the new USB 3.1 Type-C ports on those laptops.
"Intel will then unveil its Skylake-based Core i7-6700/6700T, Core i5-6600, 6500, 6400, 6600T, 6500T and 6400T, and H170 and B150 chipsets between August 30-September 5."
Here is some more Tech News from around the web:
- Heartbleed-like flaw puts smartphone users' passwords and location data at risk @ The Inquirer
- Encryption Would Not Have Protected Secret Federal Data Says DHS @ Slashdot
- Apple CORED: Boffins reveal password-killer 0-days for iOS and OS X @ The Register
- AT&T fined about 3 days of profit ($100m) for limiting 'unlimited' plans @ The Register
Subject: Processors | April 15, 2015 - 10:04 PM | Ryan Shrout
Tagged: Intel, Skylake, skylake-s, lga1151, 100 series
Some slides have leaked out with information about Intel's forthcoming 6th Generation Core processor, code named Skylake. We have known that Skylake was coming, and coming this year, but there have been a lot of questions about enthusiast parts and what that means for DIY builders. The slides were first seen over at WCCFTech.com and show some interesting new information.
Dubbed Skylake-S, the LGA (socketed) processor will use a new derivative with 1151 pins as well as a new set of chipsets, the Intel 100-series. Skylake is built on the same 14nm process technology used with Broadwell but will feature a new microarchitecture for both the IA cores and the graphics systems. Obviously you can read the slide yourself above, but some of the highlights are worth touching on individually. Skylake will support both DDR3L and DDR4 memory systems with the enthusiast grade parts likely the only ones to attempt to push the newer, faster DDR4 speeds.
Enthusiasts will also be glad to know that there are planned 95 watt quad-core SKUs that will support unlocked features and overclocking capability. Intel lists an "enhanced" BCLK overclocking with the term "full range" which likely means there will no longer be a need for straps to 125 MHz, etc. A 95 watt TDP is higher than the 88 watt limit we saw on Haswell processors so there is a chance we might actually witness usable performance gains if Intel can get the clock speeds up and above where they sit today with current generation parts.
The use of DMI 3.0, the connection between the processor and the chipset, sees the first increase in bandwidth in many generations. Rated at 8 GT/s, twice that of the DMI 2.0 interface used on Haswell, should allow for fewer bottlenecks on storage and external PCIe connections coming from the chipset.
The new Intel 100-series chipsets will come in three variants at launch: the Z170, the H170 and the H110. The one we are most concerned with is the Z170 of course as it will be paired wit the higher end 65 watt and 95 watt enthusiast processors. Based on these specs, Skylake will continue to operate with only 16 lanes of PCI Express 3.0 capable of running at 1 x16, 2 x8 or 1 x8 and 2 x4 connections. With either DDR3L or DDR4 you will have a dual-channel memory system.
For storage, the Z170 still has six SATA 6.0 Gb/s ports, moves to 14 USB ports maximum with 10 of them capable of USB 3.0 speeds and it upgrades Intel RST to support PCIe storage drivers. Of note here is that the Intel chipset does not include USB 3.1 capability so motherboard vendors will continue to need an external controller to integrate it. Without a doubt the 100-series chipsets will be able to support booting and compatibility with the new Intel 750-series PCIe SSDs, the current king of the hill.
As for timing, the roadmap lists the Z170 chipset and the Skylake-S processor as a Q3 2015 release. I would normally expect that to line up with Computex in early June but that doesn't appear to be the case based on other information I am getting.