Microsoft is making friends again, no new Win 7/8 updates for new chips

Subject: General Tech | March 17, 2017 - 01:11 PM |
Tagged: ryzen, kaby lake, microsoft, Windows 7, windows 8

KB4012982 describes the error you will see if you attempt to update Windows 7 or 8.x on 7th generation Intel processors, AMD Bristol Ridge and newer or Qualcomm "8996" and more recent models.  Microsoft has implemented the hardware based obsolescence which they had discussed several months ago when they stated that new chips would need Windows 10 to run.  This move will of course be heralded as brilliant and no one could possibly find this upsetting in the least, especially not in this Reddit thread.  It is a good thing Microsoft does not have a near monopoly in the market and that anyone who does not support this decision can choose from a wide variety of easily implemented alternatives.

Expect there to be workarounds, the vast majority of Enterprise customers have no interest in moving their infrastructure to Windows 10, nor the budget available to do so if they wanted.

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"Microsoft has started the process of built-in obsolescence to current hardware by blocking updates of Windows 7 and Windows 8.1 to Intel 7th Generation (Kaby Lake), AMD Ryzen and Qualcomm Snapdragon 82x processors."

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Tech Talk

Source: Reddit
Manufacturer: RockIt Cool

Introduction

Introduction

With the introduction of the Intel Kaby Lake processors and Intel Z270 chipset, unprecedented overclocking became the norm. The new processors easily hit a core speed of 5.0GHz with little more than CPU core voltage tweaking. This overclocking performance increase came with a price tag. The Kaby Lake processor runs significantly hotter than previous generation processors, a seeming reversal in temperature trends from previous generation Intel CPUs. At stock settings, the individual cores in the CPU were recording in testing at hitting up to 65C - and that's with a high performance water loop cooling the processor. Per reports from various enthusiasts sites, Intel used inferior TIM (thermal interface material) in between the CPU die and underside of the CPU heat spreader, leading to increased temperatures when compared with previous CPU generations (in particular Skylake). This temperature increase did not affect overclocking much since the CPU will hit 5.0GHz speed easily, but does impact the means necessary to hit those performance levels.

Like with the previous generation Haswell CPUs, a few of the more adventurous enthusiasts used known methods in an attempt to address the heat concerns of the Kaby Lake processor be delidding the processor. Unlike in the initial days of the Haswell processor, the delidding process is much more stream-lined with the availability of delidding kits from several vendors. The delidding process still involves physically removing the heat spreader from the CPU, and exposing the CPU die. However, instead of cooling the die directly, the "safer" approach is to clean the die and underside of the heat spreader, apply new TIM (thermal interface material), and re-affix the heat spreader to the CPU. Going this route instead of direct-die cooling is considered safer because no additional or exotic support mechanisms are needed to keep the CPU cooler from crushing your precious die. However, calling it safe is a bit of an over-statement, you are physically separating the heat spreader from the CPU surface and voiding your CPU warranty at the same time. Although if that was a concern, you probably wouldn't be reading this article in the first place.

Continue reading our Kaby Lake Relidding article!

MSI's Trident 3 ballistic mini-system

Subject: Systems | March 10, 2017 - 02:57 PM |
Tagged: msi, Trident 3, kaby lake, i7-7700, gtx 1060

MSI's Trident 3 is much smaller than an Ohio class submarine, measuring roughly the same size as a PS4 Pro, albeit with a very different look.  Inside you will find a Kaby Lake i7-7700, 16GB of DDR4-2400 and a GTX 1060 with storage consisting of a 256GB Kingston M.2 SATA SSD and a 1TB Hitachi Travelstar.  It does lack USB 3.1 and Thunderbolt as the USB Type-C port you see is USB 3.0, it is also worth mentioning the front HDMI port will not function without the included HDMI passthrough connected on the back.  The Tech Report tested it against a similar machine, the Zotac Magnus EN1070 which features a much more powerful mobile GTX 1070.  On the other hand the $1300 Trident 3 comes ready to play, whereas the Zotac lacks a Windows license, storage and memory so even though it sells at $100 less than the MSI system, it may cost you more in the long run.

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"MSI's Trident 3 compact PC houses a desktop Core i7-7700 CPU and a GeForce GTX 1060 6GB graphics card in a case no larger than many of today's consoles. We put that tantalizing combo to the test to see whether MSI has achieved small-form-factor gaming nirvana."

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Systems

 

Flipped your lid and want to reattach it?

Subject: Processors | February 23, 2017 - 11:07 AM |
Tagged: Intel, Skylake, kaby lake, delidding, relidding

[H]ard|OCP have been spending a lot of time removing the integrated heatspreader on recent Intel chips to see what effect it has on temperatures under load.  Along the way we picked up tips on 3D printing a delidder and thankfully there was not much death along the way.  One of their findings from this testing was that it can be beneficial to reattach the lid after changing out the thermal interface material and they have published a guide on how to do so.   You will need a variety of tools, from Permatex Red RTV to razor blades, by way of isopropyl alcohol and syringes; as well as a steady hand.  You may have many of the items on hand already and none are exceptionally expensive.

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"So we have covered a lot about taking your shiny new Intel CPUs apart lately, affectionately known as "delidding." What we have found in our journey is that "relidding" the processor might be an important part of the process as well. But what if you do not have a fancy tool that will help you put Humpty back together again?"

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Processors

Source: [H]ard|OCP
Subject: Motherboards
Manufacturer: GIGABYTE

Introduction and Technical Specifications

Introduction

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Courtesy of GIGABYTE

With the release of Intel Z270 chipset, GIGABYTE is unveiling its AORUS line of products. The AORUS branding will be used to differentiate enthusiast and gamer friendly products from their other product lines, similar to how ASUS uses the ROG branding to differentiate their high performance product line. The Z270X-Gaming 5 is among the first to be released as part of GIGABYTE's AORUS line. The board features the black and white branding common to the AORUS product line, with the rear panel cover and chipset featuring the brand logos. The board is designed around the Intel Z270 chipset with in-built support for the latest Intel LGA1151 Kaby Lake processor line (as well as support for Skylake processors) and Dual Channel DDR4 memory running at a 2400MHz speed. The Z270X-Gaming 5 can be found in retail with an MSRP of $189.99.

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Courtesy of GIGABYTE

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Courtesy of GIGABYTE

GIGABYTE integrated the following features into the Z270X-Gaming 5 motherboard: three SATA-Express ports; one U.2 32Gbps port; two M.2 PCIe x4 capable ports with Intel Optane support built-in; two RJ-45 GigE ports - an Intel I219-V Gigabit NIC and a Rivet Networks Killer E2500 NIC; three PCI-Express x16 slots; three PCI-Express x1 slots; ASMedia 8-Channel audio subsystem; integrated DisplayPort and HDMI video ports; and USB 2.0, 3.0, and 3.1 Type-A and Type-C port support.

Continue reading our preview of the GIGABYTE Z270X-Gaming 5 motherboard!

Intel Details Optane Memory System Requirements

Subject: General Tech, Storage | February 21, 2017 - 07:14 PM |
Tagged: Optane, kaby lake, Intel, 3D XPoint

Intel has announced that its Optane memory will require an Intel Kaby Lake processor to function. While previous demonstrations of the technology used an Intel Skylake processor, it appears this configuration will not be possible on the consumer versions of the technology.

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Further, the consumer application accelerator drives will also require a 200-series chipset motherboard, and either a M.2 2280-S1-B-M or M.2 2242-S1-B-M connector with two or four PCI-E lanes. Motherboards will have to support NVMe v1.1 and Intel RST (Rapid Storage Technology) 15.5 or newer.

It is not clear why Intel is locking Optane technology to Kaby Lake and whether it is due to technical limitations that they were not able to resolve to keep Skylake compatible or if it is just a matter of not wanting to support the older platform and focus on its new Kaby Lake processors. As such, Kaby Lake is now required if you want UHD Blu Ray playback and Optane 3D XPoint SSDs.

What are your thoughts on this latest bit of Optane news? Has Intel sweetened the pot enough to encourage upgrade hold outs?

Also Read: 

 

Source: Bit-Tech

Should you hang out on the Bridge, or is it worth heading onto the Lake?

Subject: Systems | February 21, 2017 - 01:55 PM |
Tagged: upgrade, sandybridge, kaby lake

The tick-tock of Intel's waltz has stuttered a bit, with many users wondering if it is worth picking up a new Kaby Lake based system.  Gone are the good old days when a new generation of processors guaranteed enough of an increase in performance to justify decreasing your bank account immediately.  There are several reasons for this, including the difficulties in reducing the size of the process and increasing the amount of transistors, not just the current lack of competition in the marketplace.

At The Tech Report, one of their staff were curious enough to do the upgrade, dumping their  i7-2600K for an i7-7700k.  Check out the results of the upgrade, with some impressive effect on the wonky but beloved Arma III engine.

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"The question of whether it's worth upgrading from Intel's Sandy Bridge chips accompanies every new TR CPU review. For one TR contributor, the arrival of Kaby Lake finally motivated him to make a move. See what the upgrade to a more modern platform did for him."

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Systems

Jack Sprat would approve of the third incarnation of the ASUS Zenbook

Subject: Mobile | February 20, 2017 - 02:03 PM |
Tagged: zenbook 3, UX390UA, ultrabook, kaby lake, asus. zenbook

We caught a glance at the new ASUS ZenBook 3 at CES and today Kitguru provides a full review of one, albeit a slightly different model.  The UX3901UA model contains a Kaby Lake i5-7200U with HD 620 graphics, 8GB LPDDR3-2133 and a 512GB M.2 SATA SSD.  The 12.5" screen is 1080p with no adaptive graphics or other tricks.  Where things seem to go off the rails is when you look at the thickness of the Zenbook, at its thickest it is 11.9mm (0.46").  This means you get no ethernet nor USB type A plugs as they simply would not fit and you have to content yourself with a single Type C plug.  For some the sacrifice is worth it; if you are one who likes petite sized computers you should head over for the full review.

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"What has really caught my eye about the ZenBook 3 is its physical dimensions – it measures just 11.9mm thick, while it weighs a mere 910g. With Kaby Lake hardware inside, as well as the promise of a crisp 1080p display and Harman Kardon speakers, could this be our new ultrabook of choice?"

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Source: Kitguru

Vulkan is not extinct, in fact it might be about to erupt

Subject: General Tech | February 15, 2017 - 01:29 PM |
Tagged: vulkan, Intel, Intel Skylake, kaby lake

The open source API, Vulkan, just received a big birthday present from Intel as they added official support on their Skylake and Kaby Lake CPUs under Windows 10.  We have seen adoption of this API from a number of game engine designers, Unreal Engine and Unity have both embraced it, the latest DOOM release was updated to support Vulkan and there is even a Nintendo 64 renderer which runs on it.  Ars Technica points out that both AMD and NVIDIA have been supporting this API for a while and that we can expect to see Android implementations of this close to the metal solution in the near future.

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"After months in beta, Intel's latest driver for its integrated GPUs (version 15.45.14.4590) adds support for the low-overhead Vulkan API for recent GPUs running in Windows 10. The driver supports HD and Iris 500- and 600-series GPUs, the ones that ship with 6th- and 7th-generation Skylake and Kaby Lake processors."

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Source: Ars Technica

AMD Details Zen at ISSCC

Subject: Processors | February 8, 2017 - 09:38 PM |
Tagged: Zen, Skylake, Samsung, ryzen, kaby lake, ISSCC, Intel, GLOBALFOUNDRIES, amd, AM4, 14 nm FinFET

Yesterday EE Times posted some interesting information that they had gleaned at ISSCC.  AMD released a paper describing the design process and advances they were able to achieve with the Zen architecture manufactured on Samsung’s/GF’s 14nm FinFETT process.  AMD went over some of the basic measurements at the transistor scale and how it compares to what Intel currently has on their latest 14nm process.

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The first thing that jumps out is that AMD claimes that their 4 core/8 thread x86 core is about 10% smaller than what Intel has with one of their latest CPUs.  We assume it is either Kaby Lake or Skylake.  AMD did not exactly go over exactly what they were counting when looking at the cores because there are some significant differences between the two architectures.  We are not sure if that 44mm sq. figure includes the L3 cache or the L2 caches.  My guess is that it probably includes L2 cache but not L3.  I could be easily wrong here.

Going down the table we see that AMD and Samsung/GF are able to get their SRAM sizes down smaller than what Intel is able to do.  AMD has double the amount of L2 cache per core, but it is only about 60% larger than Intel’s 256 KB L2.  AMD also has a much smaller L3 cache as well than Intel.  Both are 8 MB units but AMD comes in at 16 mm sq. while Intel is at 19.1 mm sq.  There will be differences in how AMD and Intel set up these caches, and until we see L3 performance comparisons we cannot assume too much.

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(Image courtesy of ISSCC)

In some of the basic measurements of the different processes we see that Intel has advantages throughout.  This is not surprising as Intel has been well known to push process technology beyond what others are able to do.  In theory their products will have denser logic throughout, including the SRAM cells.  When looking at this information we wonder how AMD has been able to make their cores and caches smaller.  Part of that is due to the likely setup of cache control and access.

One of the most likely culprits of this smaller size is that the less advanced FPU/SSE/AVX units that AMD has in Zen.  They support AVX-256, but it has to be done in double the cycles.  They can do single cycle AVX-128, but Intel’s throughput is much higher than what AMD can achieve.  AVX is not the end-all, be-all but it is gaining in importance in high performance computing and editing applications.  David Kanter in his article covering the architecture explicitly said that AMD made this decision to lower the die size and power constraints for this product.

Ryzen will undoubtedly be a pretty large chip overall once both modules and 16 MB of L3 cache are put together.  My guess would be in the 220 mm sq. range, but again that is only a guess once all is said and done (northbridge, southbridge, PCI-E controllers, etc.).  What is perhaps most interesting of it all is that AMD has a part that on the surface is very close to the Broadwell-E based Intel i7 chips.  The i7-6900K runs at 3.2 to 3.7 GHz, features 8 cores and 16 threads, and around 20 MB of L2/L3 cache.  AMD’s top end looks to run at 3.6 GHz, features the same number of cores and threads, and has 20 MB of L2/L3 cache.  The Intel part is rated at 140 watts TDP while the AMD part will have a max of 95 watts TDP.

If Ryzen is truly competitive in this top end space (with a price to undercut Intel, yet not destroy their own margins) then AMD is going to be in a good position for the rest of this year.  We will find out exactly what is coming our way next month, but all indications point to Ryzen being competitive in overall performance while being able to undercut Intel in TDPs for comparable cores/threads.  We are counting down the days...

Source: AMD