Subject: General Tech, Storage | February 22, 2017 - 12:14 AM | Tim Verry
Tagged: Optane, kaby lake, Intel, 3D XPoint
Intel has announced that its Optane memory will require an Intel Kaby Lake processor to function. While previous demonstrations of the technology used an Intel Skylake processor, it appears this configuration will not be possible on the consumer versions of the technology.
Further, the consumer application accelerator drives will also require a 200-series chipset motherboard, and either a M.2 2280-S1-B-M or M.2 2242-S1-B-M connector with two or four PCI-E lanes. Motherboards will have to support NVMe v1.1 and Intel RST (Rapid Storage Technology) 15.5 or newer.
It is not clear why Intel is locking Optane technology to Kaby Lake and whether it is due to technical limitations that they were not able to resolve to keep Skylake compatible or if it is just a matter of not wanting to support the older platform and focus on its new Kaby Lake processors. As such, Kaby Lake is now required if you want UHD Blu Ray playback and Optane 3D XPoint SSDs.
What are your thoughts on this latest bit of Optane news? Has Intel sweetened the pot enough to encourage upgrade hold outs?
- A Closer Look at Intel's Optane SSD DC P4800X Enterprise SSD Performance
- Intel Quietly Launches Official Optane Memory Site
- The Intel Core i7-7700K Review - Kaby Lake and 14nm+
Subject: Systems | February 21, 2017 - 06:55 PM | Jeremy Hellstrom
Tagged: upgrade, sandybridge, kaby lake
The tick-tock of Intel's waltz has stuttered a bit, with many users wondering if it is worth picking up a new Kaby Lake based system. Gone are the good old days when a new generation of processors guaranteed enough of an increase in performance to justify decreasing your bank account immediately. There are several reasons for this, including the difficulties in reducing the size of the process and increasing the amount of transistors, not just the current lack of competition in the marketplace.
At The Tech Report, one of their staff were curious enough to do the upgrade, dumping their i7-2600K for an i7-7700k. Check out the results of the upgrade, with some impressive effect on the wonky but beloved Arma III engine.
"The question of whether it's worth upgrading from Intel's Sandy Bridge chips accompanies every new TR CPU review. For one TR contributor, the arrival of Kaby Lake finally motivated him to make a move. See what the upgrade to a more modern platform did for him."
Here are some more Systems articles from around the web:
- Syber Intel Extreme Masters Pro GTX 1070 Gaming PC @ eTeknix
- Mesh 7EVEN (7600K & GTX 1060) Gaming PC @ Kitguru
- A Look At CyberPowerPC’s GUA2400BST AMD VR Gaming PC @ Techgage
- The Tech Report System Guide: February 2017 edition
Subject: Mobile | February 20, 2017 - 07:03 PM | Jeremy Hellstrom
Tagged: zenbook 3, UX390UA, ultrabook, kaby lake, asus. zenbook
We caught a glance at the new ASUS ZenBook 3 at CES and today Kitguru provides a full review of one, albeit a slightly different model. The UX3901UA model contains a Kaby Lake i5-7200U with HD 620 graphics, 8GB LPDDR3-2133 and a 512GB M.2 SATA SSD. The 12.5" screen is 1080p with no adaptive graphics or other tricks. Where things seem to go off the rails is when you look at the thickness of the Zenbook, at its thickest it is 11.9mm (0.46"). This means you get no ethernet nor USB type A plugs as they simply would not fit and you have to content yourself with a single Type C plug. For some the sacrifice is worth it; if you are one who likes petite sized computers you should head over for the full review.
"What has really caught my eye about the ZenBook 3 is its physical dimensions – it measures just 11.9mm thick, while it weighs a mere 910g. With Kaby Lake hardware inside, as well as the promise of a crisp 1080p display and Harman Kardon speakers, could this be our new ultrabook of choice?"
Here are some more Mobile articles from around the web:
More Mobile Articles
- Asus ROG G701VI @ Kitguru
- MSI GE72 7RE Apache Pro @ Kitguru
- Dell XPS 13 @ Kitguru
- Aorus X3 Plus v7-CF1 @ Kitguru
- Sandberg PowerBank 18200 Review @ NikKTech
- The Honor 6X Media Preview – Double Or Nothing @ TechARP
- The Xiaomi Redmi Note 4 @ TechARP
Subject: General Tech | February 15, 2017 - 06:29 PM | Jeremy Hellstrom
Tagged: vulkan, Intel, Intel Skylake, kaby lake
The open source API, Vulkan, just received a big birthday present from Intel as they added official support on their Skylake and Kaby Lake CPUs under Windows 10. We have seen adoption of this API from a number of game engine designers, Unreal Engine and Unity have both embraced it, the latest DOOM release was updated to support Vulkan and there is even a Nintendo 64 renderer which runs on it. Ars Technica points out that both AMD and NVIDIA have been supporting this API for a while and that we can expect to see Android implementations of this close to the metal solution in the near future.
"After months in beta, Intel's latest driver for its integrated GPUs (version 126.96.36.19990) adds support for the low-overhead Vulkan API for recent GPUs running in Windows 10. The driver supports HD and Iris 500- and 600-series GPUs, the ones that ship with 6th- and 7th-generation Skylake and Kaby Lake processors."
Here is some more Tech News from around the web:
- XPoint: Leaked Intel specs reveal 'launch-ready' SSD – report @ The Register
- Patch Tuesday put on hold, SMB zero-day exploit likely to blame @ The Inquirer
- Roses are red, violets are blue, fake-news-detecting AI is fake news, too @ The Register
- Google's Not-so-secret New OS @ Slashdot
- Linksys Velop Mesh Wi-Fi Router System @ Custom PC Review
Subject: Processors | February 9, 2017 - 02:38 AM | Josh Walrath
Tagged: Zen, Skylake, Samsung, ryzen, kaby lake, ISSCC, Intel, GLOBALFOUNDRIES, amd, AM4, 14 nm FinFET
Yesterday EE Times posted some interesting information that they had gleaned at ISSCC. AMD released a paper describing the design process and advances they were able to achieve with the Zen architecture manufactured on Samsung’s/GF’s 14nm FinFETT process. AMD went over some of the basic measurements at the transistor scale and how it compares to what Intel currently has on their latest 14nm process.
The first thing that jumps out is that AMD claimes that their 4 core/8 thread x86 core is about 10% smaller than what Intel has with one of their latest CPUs. We assume it is either Kaby Lake or Skylake. AMD did not exactly go over exactly what they were counting when looking at the cores because there are some significant differences between the two architectures. We are not sure if that 44mm sq. figure includes the L3 cache or the L2 caches. My guess is that it probably includes L2 cache but not L3. I could be easily wrong here.
Going down the table we see that AMD and Samsung/GF are able to get their SRAM sizes down smaller than what Intel is able to do. AMD has double the amount of L2 cache per core, but it is only about 60% larger than Intel’s 256 KB L2. AMD also has a much smaller L3 cache as well than Intel. Both are 8 MB units but AMD comes in at 16 mm sq. while Intel is at 19.1 mm sq. There will be differences in how AMD and Intel set up these caches, and until we see L3 performance comparisons we cannot assume too much.
(Image courtesy of ISSCC)
In some of the basic measurements of the different processes we see that Intel has advantages throughout. This is not surprising as Intel has been well known to push process technology beyond what others are able to do. In theory their products will have denser logic throughout, including the SRAM cells. When looking at this information we wonder how AMD has been able to make their cores and caches smaller. Part of that is due to the likely setup of cache control and access.
One of the most likely culprits of this smaller size is that the less advanced FPU/SSE/AVX units that AMD has in Zen. They support AVX-256, but it has to be done in double the cycles. They can do single cycle AVX-128, but Intel’s throughput is much higher than what AMD can achieve. AVX is not the end-all, be-all but it is gaining in importance in high performance computing and editing applications. David Kanter in his article covering the architecture explicitly said that AMD made this decision to lower the die size and power constraints for this product.
Ryzen will undoubtedly be a pretty large chip overall once both modules and 16 MB of L3 cache are put together. My guess would be in the 220 mm sq. range, but again that is only a guess once all is said and done (northbridge, southbridge, PCI-E controllers, etc.). What is perhaps most interesting of it all is that AMD has a part that on the surface is very close to the Broadwell-E based Intel i7 chips. The i7-6900K runs at 3.2 to 3.7 GHz, features 8 cores and 16 threads, and around 20 MB of L2/L3 cache. AMD’s top end looks to run at 3.6 GHz, features the same number of cores and threads, and has 20 MB of L2/L3 cache. The Intel part is rated at 140 watts TDP while the AMD part will have a max of 95 watts TDP.
If Ryzen is truly competitive in this top end space (with a price to undercut Intel, yet not destroy their own margins) then AMD is going to be in a good position for the rest of this year. We will find out exactly what is coming our way next month, but all indications point to Ryzen being competitive in overall performance while being able to undercut Intel in TDPs for comparable cores/threads. We are counting down the days...
Subject: Processors | February 8, 2017 - 06:16 PM | Jeremy Hellstrom
Tagged: kaby lake, i5-7600K, Intel
[H]ard|OCP followed up their series on replacing the TIM underneath the heatspreader on Kaby Lake processors with another series depicting the i5-7600K in the buff. They removed the heatspreader completely and tried watercooling the die directly. As you can see in the video this requires more work than you might immediately assume, it was not simply shimming which was involved, some of the socket on the motherboard needed to be trimmed with a knife in order to get the waterblock to sit directly on the core. In the end the results were somewhat depressing, the risks involved are high and the benefits almost non-existent. If you are willing to risk it, replacing the TIM and reattaching the heatspreader is a far better choice.
"After our recent experiments with delidding and relidding our 7700K and 7600K to see if we could get better operating temperatures, we decided it was time to go topless! Popping the top on your CPU is one thing, and getting it to work in the current processor socket is another. Get out your pocket knife, we are going to have to make some cuts."
Here are some more Processor articles from around the web:
Subject: Systems, Mobile | February 6, 2017 - 08:37 PM | Sebastian Peak
Tagged: xeon, Thinkpad, quadro, P71, P51s, P51, nvidia, notebook, mobile workstation, Lenovo, kaby lake, core i7
Lenovo has announced a trio of new ThinkPad mobile workstations, featuring updated Intel 7th-generation Core (Kaby Lake) processors and NVIDIA Quadro graphics, and among these is the thinnest and lightest ThinkPad mobile workstation to date in the P51s.
"Engineered to deliver breakthrough levels of performance, reliability and long battery life, the ThinkPad P51s features a new chassis, designed to meet customer demands for a powerful but portable machine. Developed with engineers and professional designers in mind, this mobile workstation features Intel’s 7th generation Core i7 processors and the latest NVIDIA Quadro dedicated workstation graphics, as well as a 4K UHD IPS display with optional IR camera."
Lenovo says that the ThinkPad P51s is more than a half pound lighter than the previous generation (P50s), stating that "the P51s is the lightest and thinnest mobile workstation ever developed by ThinkPad" at 14.4 x 9.95 x 0.79 inches, and weight starting at 4.3 lbs.
Specs for the P51s include:
- Up to a 7th Generation Intel Core i7 Processor
- NVIDIA Quadro M520M Graphics
- Choice of standard or touchscreen FHD (1920 x 1080) IPS, or 4K UHD (3840 x 2160) IPS display
- Up to 32 GB DDR4 2133 RAM (2x SODIMM slots)
- Storage options including up to 1 TB (5400 rpm) HDD and 1 TB NVMe PCIe SSDs
- USB-C with Intel Thunderbolt 3
- 802.11ac and LTE-A wireless connectivity
Lenovo also announced the ThinkPad P51, which is slightly larger than the P51s, but brings the option of Intel Xeon E3-v6 processors (in addition to Kaby Lake Core i7 CPUs), Quadro M2200M graphics, faster 2400 MHz memory up to 64 GB (4x SODIMM slots), and up to a 4K IPS display with X-Rite Pantone color calibration.
Finally there is the new VR-ready P71 mobile workstation, which offers up to an NVIDIA Quadro P5000M GPU along with Oculus and HTC VR certification.
"Lenovo is also bringing virtual reality to life with the new ThinkPad P71. One of the most talked about technologies today, VR has the ability to bring a new visual perspective and immersive experience to our customers’ workflow. In our new P71, the NVIDIA Pascal-based Quadro GPUs offer a stunning level of performance never before seen in a mobile workstation, and it comes equipped with full Oculus and HTC certifications, along with NVIDIA’s VR-ready certification."
Pricing and availability is as follows:
- ThinkPad P51s, starting at $1049, March
- ThinkPad P51, starting at $1399, April
- ThinkPad P71, starting at $1849, April
Subject: Processors | January 30, 2017 - 07:29 PM | Jeremy Hellstrom
Tagged: kaby lake, core i7 7700k, overclocking, delidding, risky business
Recently [H]ard|OCP popped the lid off of an i7-7700k to see if the rumours that once again Intel did not use high quality thermal interface material underneath the heatspreader. The experiment was a success in one way, the temperatures dropped 25.28%, from 91C to 68C. However the performance did not change much, they still could not reach a stable 5GHz overclock. They did not let that initial failure discourage them and spent some more time with their enhanced Kaby Lake processor to find scenarios in which they could reach or pass the 5GHz mark. They met with success when they reduced the RAM frequency to 2666MHz, by disabling Hyperthreading they could reach 5GHz with 3600MHz RAM but only when they increased the VCore did they manage to break 5GHz.
Of course you must exercise caution when tweaking to this level, a higher VCore will certainly reduce the lifespan of your chip and delidding can have a disastrous outcome even if done carefully. If you are interested in trying this, The Tech Report has a link to a 3D printed tool to help you in your endeavours.
"Last week we shared our overclocking results with our retail purchased Core i7-7700K Kaby Lake processor. We then took the Integrated Heat Spreader off, replaced the Thermal Interface Material and tried again for 5GHz with 3600MHz memory and failed. This time, less RAM MHz and more core voltage!"
Here are some more Processor articles from around the web:
Courtesy of ASUS
With the latest revision of the TUF line, ASUS made the decision to drop the well-known "Sabertooth" moniker from the board name, naming the board's with the TUF branding only. The TUF Z270 Mark 1 motherboard is the flagship board in ASUS' TUF (The Ultimate Force) product line designed with the Intel Z270 chipset. The board offers support for the latest Intel Kaby Lake processor line as well as Dual Channel DDR 4 memory because of its integrated Intel Z270 chipset. While the MSRP for the board may be a bit higher than expected, its $239 price is more than justified by the board's build quality and "armored" offerings.
Courtesy of ASUS
The TUF Z270 Mark 1 motherboard is built with the same quality and attention to detail that you've come to expect from TUF-branded motherboards. Its appearance follows the standard tan plastic armor overlay on the top with a 10-phase digital power system. The board contains the following integrated features: six SATA 3 ports; two M.2 PCIe x4 capable ports; dual GigE controllers - an Intel I219-V Gigabit NIC and an Intel I211 Gigabit NIC; three PCI-Express x16 slots; three PCI-Express x1 slots; an 8-channel audio subsystem; MEM OK! and USB BIOS Flashback buttons; integrated DisplayPort and HDMI; and USB 2.0, 3.0, and 3.1 Type-A and Type-C port support.
Courtesy of ASUS
ASUS also chose to include the armored backplate with the TUF Z270 Mark 1 motherboard, dubbed the "TUF Fortifier".
Subject: Processors | January 16, 2017 - 09:11 PM | Jeremy Hellstrom
Tagged: kaby lake, sandy bridge
Not too long ago the release of a new processor family meant a noticeable improvement from the previous generation and the only question was how to upgrade, not if you should upgrade. Like many other things, that has passed on into the proverbial good old days and now we need reviews like this one published by [H]ard|OCP. Is there any noticeable performance difference between the two chips outside of synthetic benchmarks?
The test systems are slightly different as the memory has changed, the 7700K has 2666MHz DDR4 while the 2600K has 2133MHz DDR3; both CPUs are clocked at 4.5GHz however. Their results show actual performance deltas in productivity software such as HandBrake and Blender, justifying the upgrade for those who focus on content creation. As for gaming, if you have no GPU then you will indeed see performance increases; but nothing compared to buying a GPU.
"There are many HardOCP readers that are still running Sandy Bridge CPUs and have been waiting with anticipation of one day upgrading to a new system. One of the biggest things asked in the last month is just how the 2600K stacks up against the new 7700K processor. So we got hold of one of our readers 2600K systems and put it to the test."
Here are some more Processor articles from around the web: