Subject: Storage | February 27, 2014 - 02:22 PM | Jeremy Hellstrom
Tagged: SSD 730, ssd, Intel, Overclocked
Today marks the release of the first overclocked SSD to hit the market, the Intel 730 which is based on the SSD DC S3500 and SSD DC S3700 series for data centers. As these were drives specifically crafted for the datacenter they were both more expensive than consumer models and were optimized for completely different uses. The new Intel 730 drive is overclocked, the NAND functions at 600MHz compared to the DC's 400MHz and the cache RAM speed is jumped up to 100MHz from 83MHz. The Tech Report discovered that extra frequency comes at a price, the wattage consumed by this drive is significantly higher than just about any other SSD they have reviewed, no wonder Intel labels this as specifically for desktops.
Make sure to check out Allyn's fresh off the presses review of this drive and don't let his temperature readings shock you too much.
"Intel's new 730 Series desktop SSD is rather unique. It's based on the company's datacenter drives, it has an extra flash die onboard, and the controller and NAND are both clocked well beyond their usual speeds. We take a closer look."
Here are some more Storage reviews from around the web:
- Intel SSD 730 Series @ The SSD Review
- The SSD Endurance Experiment: Data retention after 600TB @ The Tech Report
- OCZ Vector 150 and OCZ Vertex 460 Review: New SSDs from Toshiba's OCZ Storage Solutions @ X-Bit Labs
- Crucial M500 480GB SSD @ NikKTech
- Sandisk X210 240GB Business Class Solid State Drive @ eTeknix
- ntel’s 3rd Generation SSD Controller Manufactured By LSI @ SSD Review
- Angelbird Adler SSDs & SSD2Go PRO Review @ Hardware Canucks
- MyDigitalSSD Super Cache 2 128GB M.2 SATA 6G @ SSD Review
- 8 PCIe & SATA M.2 SSDs Test ASRock’s Fatal1ty 990FX Killer AM3+ AMD MotherBoard @ SSD Review
- SanDisk Extreme Pro 128GB USB 3.0 Flash Drive Review @ Legit Reviews
- SanDisk Connect 64GB Wireless Flash Drive Review @ Legit Reviews
- ADATA DashDrive Elite SE720 128GB External SSD @ Kitguru
- Kingston DataTraveler Mini 3.0 16GB Flash Drive Review @ Legit Reviews
- Seagate Desktop HDD 4 TB vs. Western Digital WD Black 4 TB Hard Drive Review @ Hardware Secrets
- Matsunichi 500GB USB 3.0 Portable HDD @ TechwareLabs
- Seagate Desktop SSHD 2 TB Hard Drive Review @ Hardware Secrets
- Thecus N5550 NAS Server @ NikKTech
Introduction, Specifications and Packaging
Intel launched their first consumer SSD more than five years ago. Their very first SSD, the X25-M, might have gotten off to a bit of a rocky start, but once the initial bugs were worked out, it proved to be an excellent example of what a 3Gb/sec SATA SSD was capable of. While the competition was using 4 or 8 flash channels, Intel ran circles around them with their 10-channel controller. It was certainly a great concept, and it most definitely had legs. The very same controller, with only minor tweaks, was able to hold its own all the way through into the enterprise sector, doing so even though the competition was moving to controllers capable of twice the throughput (SATA 6Gb/sec).
The various iterations featuring Intel's 10-channel controller, spanning the 20GB cache SSD (left), original X25M and X25-E (center), and finally X25-M G2, SSD 320, and SSD 710 (right).
While the older controller was extremely nimble, it was bottlenecked by a slower interface than the competition, who had all moved to the more modern SATA 6Gb/sec link. Intel also moved into this area, but not with their own native controller silicon. The SSD 510 launched in 2011 equipped with a Marvell controller, followed by the SSD 520, launched in 2012 with a SandForce controller. While Intel conjured up their own firmware for these models, their own older and slower controller was still more nimble and reliable than those other solutions, proven by the fact that the SSD 710, an enterprise-spec SSD using the older 10-channel controller, was launched in tandem with the consumer SSD 510.
Fast forward to mid-2013, where Intel finally introduced their own native SATA 6Gb/s solution. This controller dropped the channel count to a more standard figure of 8, and while it did perform well, it was only available in Intel's new enterprise 'Data Center' line of SSDs. The SSD DC S3500 and SSD DC S3700 (reviewed here) were great drives, but they were priced too high for consumers. While preparing that review, I remember saying how that controller would be a great consumer unit if they could just make it cheaper and tune it for standard workloads. It appears that wish has just been granted. behold the Intel SSD 730:
Subject: General Tech | February 27, 2014 - 11:37 AM | Jeremy Hellstrom
Tagged: euv, photolithography, Intel, TSMC, DSA
A recent test at TSMC proved their experimental extreme UV lithography process is a little too extreme after a misaligned laser caused serious internal damage to their prototype. This is rather sad news for TSMC as EUV has been touted as the best way to reduce the chip making process below 10nm. Intel has been hedging their bets about EUV, they have invested heavily in the development of the technology but recently have teamed up with ASML Holdings and Arkema to work on directed self assembly, where the chips are convinced to form out of solution on a molecular basis. We are not quite talking Von Neumann machines but it is certainly within the same realm of thought. Other researchers are working on electron etching; forsaking light and its comparatively large wavelength for much smaller etching tools. You can read more about how companies such as Intel are trying to keep Moore's law alive at The Register.
"A recent test of the next-generation chip-etching technology known as extreme ultraviolet lithography (EUV) has come a cropper at chip-baking giant Taiwan Semiconductor Manufacturing Company (TSMC)."
Here is some more Tech News from around the web:
- AMD Press Talks Up Major Open-Source Linux Driver Features, But Fails @ Phoronix
- Galaxy S5 vs iPhone 5S specs comparison @ The Inquirer
- 'Black Phone': This handset will SELF-DESTRUCT in 30 seconds @ The Register
- Microsoft's Office 2013 Service Pack 1 slips out with fixes, features @ The Register
- Mantle no more? GDC sessions point to the next DirectX @ The Tech Report
- BlackBerry brings back call, end keys, touchpad to Q20 keyboard cutie @ The Register
- Google makes it easy for Gmail users to dump newsletters @ The Inquirer
- Taste-O-Vision Is Now A Thing @ Hack a Day
- The TR Podcast 150: From Mantle to Maxwell, and beyond
Subject: General Tech, Graphics Cards, Processors | February 25, 2014 - 01:33 PM | Scott Michaud
Tagged: Ivy Bridge, Intel, iGPU, haswell
Recently, Intel released the 126.96.36.19912 (188.8.131.52.3412 for 64-bit) drivers for their Ivy Bridge and Haswell integrated graphics. The download was apparently published on January 29th while its patch notes are dated February 22nd. It features expanded support for Intel Quick Sync Video Technology, allowing certain Pentium and Celeron-class processors to access the feature, as well as an alleged increase in OpenGL-based games. Probably the most famous OpenGL title of our time is Minecraft, although I do not know if that specific game will see improvements (and if so, how much).
The new driver enables Quick Sync Video for the following processors:
- Pentium 3558U
- Pentium 3561Y
- Pentium G3220(Unsuffixed/T/TE)
- Pentium G3420(Unsuffixed/T)
- Pentium G3430
- Celeron 2957U
- Celeron 2961Y
- Celeron 2981U
- Celeron G1820(Unsuffixed/T/TE)
- Celeron G1830
Besides the addition for these processors and the OpenGL performance improvements, the driver obviously fixes several bugs in each of its supported OSes. You can download the appropriate drivers from the Intel Download Center.
Subject: Mobile | February 24, 2014 - 04:00 AM | Ryan Shrout
Tagged: xmm, MWC 14, MWC, lte-advanced, LTE, Intel, 7260
Intel also announced Merrifield and Moorefield SoCs at Mobile World Congress today.
In 2011, Intel acquired SysDSoft to improve and accelerate the companies transition into the mobile wireless controllers, LTE in particular. As a result, Intel released the XMM 7160 modem in 2013 which included the X-GOLD 716 baseband controller that could support LTE and HSPA functions. This modem was adopted by a handful of OEMs in the market with Cat 4 bandwidth up to 150 Mbps (downstream) and 50 Mbps (upstream), LTE voice implementation and globally capability with 15 bands.
This modem was available as a multi-chip solution for mobile device vendors to implement but was shipped in a M.2 module. The latter form gave a quick option for notebook and tablet vendors to include in ready-built systems.
At Mobile World Congress today though, Intel is announcing its next generation modem, the XMM 7260 LTE-Advanced. As the name implies, this update includes support for LTE-Advanced that adds in features like carrier aggregation and a pair of downlink channels for up to 300 Mbps data rates. Carrier aggregation can be used for additional bandwidth performance or to disperse spectrum in a more efficient way to improve reliability. Intel claims that this controller and modem meets the maximum specification levels of LTE today.
The XMM 7260 LTE-Advanced includes the X-GOLD 726 that is truly a global market ready part with frequency compatibility on LTE FDD/TDD, WCDMA/HSPA+, TD-SCDMA/TD-HSPA/EDGE. This iteration uses fewer components, thus is smaller and easier to integrate than the 7160, and will be "on shelf" as early as next quarter. There is no CDMA support included, though. For users on Verizon and Sprint, we'll have to see if handset makers for those carriers have adjusted their timelines for LTE-only devices. AT&T and T-Mobile, in the US, will have no issues with 4G and 3G support.
This modem is meant to compete directly with the stranglehold that Qualcomm has on the LTE market (and one source tells me that carriers "are dying for an alternative" to help drive down costs). Though it might seem odd in some ways, I fully expect this XMM 7260 modem to be paired with non-Intel SoC devices, including smartphones and tablets. In fact, it is quite possible that the XMM 7260 LTE-Advanced modem might have more successful adoption than the upcoming Merrifield SoCs, also announced today. Device manufacturers might be satisfied with their choice in SoCs, not demanding an alternative in x86, but also might appreciate a new modem.
As a side note, the XMM 7260 is being built on TSMC's 28nm process technology rather than on Intel's own fabs (this isn't the first time it has happened). I don't expect this to be a concern for performance but it is interesting to see a chip that Intel is placing so much emphasis on being constructed outside its own walls.
The XMM 7269 LTE-Advanced modem is currently in certification and is expected to be available for integration in Q2, 2014.
Subject: Processors, Mobile | February 24, 2014 - 04:00 AM | Ryan Shrout
Tagged: z3480, PowerVR, MWC 14, MWC, moorefield, merrifield, Intel, atom
Intel also announced an LTE-Advanced modem, the XMM 7260 at Mobile World Congress today.
Last May Intel shared with us details of its new Silvermont architecture, a complete revamp of the Atom brand with an out-of-order design and vastly improved performance per watt. In September we had our first real-hands on with a processor built around Silvermont, code named Bay Trail. The Atom Z37xx and Z36xx products were released and quickly found their way into products like the ASUS T100 convertible notebook. In fact, both the Bay Trail processor and the ASUS T100 took home honors in our end-of-year hardware recognitions.
Today at Mobile World Congress 2014, Intel is officially announcing the Atom Z35xx and Z34xx processors based on the same Silvermont architecture, code named Moorefield and Merrifield respectively. These new processors share the same power efficiency of Bay Trail and excellent performance but have a few changes to showcase.
Though there are many SKUs yet to be revealed for Merrifield and Moorefield, this comparison table gives you a quick idea of how the new Atom Z3480 compares to the previous generation, Atom Z2580 and Clover Trail+.
The Atom Z3480 is a dual core (single module) processor with a clock speed as high as 2.13 GHz. And even though it doesn't have HyperThreading support, the new architecture is definitely faster than the previous product. The cellular radio listed on this table is a separate chip, not integrated into the SoC - at least not yet. PowerVR G6400 quad core/cluster graphics should present performance somewhere near that of the iPhone 5s with support for OpenCL and RenderScript acceleration. Intel claims that this PowerVR architecture will give Merrifield a 2x performance advantages over the graphics system in Clover Trail+. A new image processor allows for 1080p60 video capture (vs 30 FPS before) and support Android 4.4.2 is ready.
Most interestingly, the Merrifield and Moorefield SoCs do not use Intel's HD graphics technology and instead return to the world of Imagination Technology and the PowerVR IP. Specifically, the Merrifield chip, the smaller of the two new offerings from Intel, is using the PowerVR G6400 GPU; the same base technology that powers the A7 SoC from Apple in the iPhone 5s.
A comparison between the Merrifield and Moorefield SoCs reveals the differences between what will likely be targeted smartphone and tablet processors. The Moorefield part uses a pair of modules with a total of four cores, double that of Merrifield, and also includes a slightly higher performance PowerVR GPU option, the G6430.
Intel has provided some performance results of the new Atom Z3480 using a reference phone, though of course, with all vendor provided benchmarks, take them as an estimate until some third parties get a hold of this hardware for independent testing.
Looking at GFXBench 2.7, Intel estimates that Merrifield will run faster than the Apple A7 in the iPhone 5s and just slightly behind the Qualcomm Snapdragon 800 found in the Samsung Galaxy S4. Moorefield, the SoC that adds slightly to GPU performance and doubles the CPU core count, would improve performance to best the Qualcomm result.
WebXPRT is a web application benchmark and with it Intel's Atom Z3480 has the edge over both the Apple A7 and the Qualcomm S800. Intel also states that they can meet these performance claims while also offering better battery life than the Snapdragon S800 as well - interestingly the Apple A7 was left out of those metrics.
Finally, Intel did dive into the potential performance improvements that support for 64-bit technology will offer when Android finally implements support. While Kitkat can run a 64-bit kernel, the user space is not yet supported so benchmarking is a very complicated and limited process. Intel was able to find instances of 16-34% performance improvements from the move to 64-bit on Merrifield. We are still some time from 64-bit Android OS versions but Intel claims they will have full support ready when Google makes the transistion.
Both of these SoCs should be showing up in handsets and tablets by Q2. Intel did have design wins for Clover Trail+ in a couple of larger smartphones but the company has a lot more to prove to really make Silvermont a force in the mobile market.
Subject: Processors, Mobile | February 21, 2014 - 10:47 AM | Ryan Shrout
Tagged: wearables, wearable computing, quark, Intel, arm
On a post from the official ARM blogs, the guns are blazing in the battle for the wearable market mind share. Pretty much all the currently available wearable computing devices are using ARM-based processors but that hasn't prevented Intel from touting its Quark platform as the best platform for wearables. There are still lots of questions about Quark when it comes to performance and power consumption but ARM decided to pit its focus on heat.
For a blog post on ARM's website:
Intel’s Quark is an example that has a relatively low level of integration, but has still been positioned as a solution for wearables. Fine you may think, there are plenty of ARM powered communication chipsets it could be paired with, but a quick examination of the development board brings the applicability further into question. Quark runs at a rather surprising, and sizzling to the touch, 57°C. The one attribute it does offer is a cognitive awareness, not through any hardware integration suitable for the wearable market, but from the inbuilt thermal management hardware (complete with example code), which in the attached video you can see is being used to toggle a light switch once touched by a finger which, acting as a heat sync, drops the temperature below 50°C.
Along with this post is a YouTube video that shows this temperature testing taking place.
Of course, when looking at competitive analysis between companies you should always take the results as tentative at best. There is likely to be some change between the Quark Adruino board (Galileo) integration of the X1000 and what would make it into a final production wearable device. Obviously this is something Intel is award of as well and they are also aware of what temperature means for devices that users will have such direct contact with.
The proof will be easy to see, either way, as we progress through 2014. Will device manufacturers integrated Quark in any final design wins and what will the user experience of those units be like?
Still, it's always interesting to see marketing battles heat up between these types of computing giants.
Subject: General Tech, Processors, Mobile | February 19, 2014 - 03:28 AM | Scott Michaud
Tagged: Intel, SoC, atom, haswell, Haswell-E, Airmont, Ivy Bridge-EX
Every few months, we get another snapshot at some of Intel's products. This timeline has a rough placement for every segment, from their Internet of Things (IoT) product, the Quark, up to the Xeon E7 v2. While it covers from now through December, it is not designed to be a strict schedule and might contain an error or two.
Image Credit: VR-Zone
First up is Ivy Bridge-EX (Xeon E7 v2). PCMag has an interesting rundown on these parts in depth, although some aspects are a little fuzzy. These 22nm-based chips range from 6 to 15 cores and can access up to 1.5TB of memory, per socket. Intel also claims they will support up to four times the I/O bandwidth for disk and network transactions. Naturally, they have all the usual virtualization and other features that are useful for servers. Most support Turbo Boost and all but one have Hyper-Threading Technology.
Jumping back to the VR-Zone editorial, the timeline suggests that the Quark X1000 will launch in April. As far as I can tell, this is new information. Quark is Intel's ultra low-end SoC that is designed for adding intelligence to non-computing devices. One example given by Intel at CES was a smart baby bottle warmer.
The refresh of Haswell is also expected to happen in April.
Heading into the third quarter, we should see Haswell-E make an appearance for the enthusiast desktop and moderately high-end server. This should be the first time since Sandy Bridge-E (2011) that expensive PCs get a healthy boost to single-threaded performance, clock for clock. Ivy Bridge-E, while a welcome addition, was definitely aimed at reducing power consumption.
Ending the year should be the launch of Airmont at 14nm. The successor to Silvermont, Airmont will be the basis of Cherry Trail tablets and lower end PCs at the very end of the year. Moorefield, which is Airmont for smartphones, is not listed on this roadmap and should not surface until 2015.
Subject: General Tech | February 13, 2014 - 01:26 PM | Jeremy Hellstrom
Tagged: Intel, Broadwell
There are many possible reasons why Intel is delaying the arrival of the 14nm Broadwell, from a lack of competition to the slowing of the laptop market to simply wanting to sell more Haswell chips. Regardless of the cause, DigiTimes is reporting that we will not see the first Broadwell chips until the beginning of 2015 with the arrival of Celeron and Pentium branded chips. The first ones to be shipped will be to mobile system builders in the last quarter of this year, limited amounts of U- and Y-series models will be distributed to manufacturers to be sold at the beginning of 2015. That is a long way off, don't give up all hope but don't hold your breath.
"Intel's upcoming 14nm Broadwell-based processors were previously scheduled for mass production at the end of the first quarter for release in the third; however, sources from the upstream supply chain say the processors have recently been delayed and will not be available until the fourth quarter."
Here is some more Tech News from around the web:
- VMware and Google announce Windows applications for Chrome OS @ The Inquirer
- Sandisk announces world's fastest memory card for 4K video @ The Inquirer
- Have a Linksys router? Now's a good time to update that firmware @ The Register
- John McAfee declares war on Android @ The Register
- Bad luck, n00bs: Mozilla to splurge ADS inside empty Firefox tiles @ The Inqurier
- An Introduction to the AWS Command Line Tool @ Linux.com
Subject: General Tech, Systems | February 12, 2014 - 08:25 PM | Scott Michaud
Tagged: ubuntu, SteamOS, nuc, Intel, debian
Two days ago, Intel added a new BIOS for the NUC to their download center. Its main update addresses a problem with booting some operating systems, such as SteamOS. Ars Technica published an editorial a couple of weeks ago about using the Haswell-based NUC with four Linux distributions. It basically comes down to the NUC not seeing a bootloader file that Debian-based OSes leave in their own branded folder. The BIOS was available less than two weeks later.
The update also addresses (PDF) fan speed control, a bug with disk encryption passwords, a couple of BIOS settings, and a system hang with certain USB thumb drives.
If you have a NUC and want to make it a SteamOS (or Ubuntu, etc.) device, this should fix your woes. I mean, there was already a workaround involving four terminal commands but it is that much easier nonetheless. It is available now at Intel's store.