Subject: Mobile | December 16, 2015 - 11:32 PM | Jeremy Hellstrom
Tagged: yoga 900, yoga, Skylake, Lenovo, Intel
You may remember that back in November Ryan took a look at the Lenovo Yoga 900 with its snazzy watchband hinge and 3200x1800 resolution. If not then now is the perfect time to revisit that video review but if you do still remember perhaps you would like a second opinion on the Skylake powered 2-in-1 device. At 324x225x14.9mm and weighing 1.3kg in the complete package it is very portable, though you could just pop the 13.3" IPS display around the keyboard for use as a tablet. The Inquirer takes a look at the good, the bad and the ugly attributes of the Yoga 900 in their review.
"This latest addition to the Yoga line is perhaps its fanciest yet, with a faux-leather finish and a complex ‘watchband' hinge. The real good news, though, is that this Skylake-powered convertible is as speedy and practical as it is eye-catching."
Here are some more Mobile articles from around the web:
- Sony Xperia Z5 Premium @ The Inquirer
- Lumia 950 & 950 XL – The Phone That Works Like Your PC @ Tech ARP
- Evolution Of Google Nexus : Huawei’s Transcendence @ Tech ARP
- Xtorm AL420 Waterproof Power Bank Xtreme 9000mAh Review @ NikKTech
Subject: Processors | December 11, 2015 - 07:08 PM | Sebastian Peak
Tagged: Skylake, overclocking, Intel, Core i3-6100, bios, BCLK, asrock
The days of Intel overclocking being limited to their more expensive unlocked parts appear to be over, as TechSpot has posted benchmarks from an overclocked Intel Core i3-6100 using a new (pre-release) BIOS update from ASRock.
Image credit: TechSpot
"In overclocking circles it was recently noted that BCLK (base clock) overclocking might become a possibility in Skylake processors. Last night Asrock contacted us with an updated BIOS that enabled this. We jumped at the opportunity and have already tested and benched a Core i3-6100 Skylake CPU with a 1GHz overclock (4.7GHz) on air cooling."
The 1.0 GHz overclock was achieved with a 127 MHz base clock on the i3 processor, with a vcore of ~1.36v. Apparently the ASRock motherboard requires the processor's graphics portion to be disabled for overclocking with this method, and TechSpot used an NVIDIA GTX 960 for test system. The results were impressive, as you might imagine.
The following is a small sampling of the benchmark results available from the sourced TechSpot article:
Image credit: TechSpot
Image credit: TechSpot
The overclocked i3-6100 was able to come very close to the multi-threaded performance of the stock AMD FX-8320E (8-core) processor in Cinebench, with double the per-thread performance. Results from their Handbrake encode test were even better, with the overclocked i3-6100 essentially matching the performance of the Core i5-4430 processor tested.
Gaming was underwhelming, with very similar performance from the GTX 960 from all CPUs at the settings tested.
Image credit: TechSpot
So what did the article say about this new overclocking-friendly BIOS availability? "We are told this updated BIOS for their Z170 motherboards will be available to owners very soon." It will be interesting to see if other vendors offer the same, as there are results out there using a SuperMicro board as well.
Subject: Processors | December 5, 2015 - 04:35 AM | Sebastian Peak
Tagged: Skylake, Intel, heatsink, damage, cpu cooler, Core i7 6700K, Core i7 6600K, bend, 6th generation, 3rd party
Some Intel 6th-gen "Skylake" processors have been damaged by the heatsink mounts of 3rd-party CPU coolers according to a report that began with pcgameshardware.de and has since made its rounds throughout PC hardware media (including the sourced Ars Technica article).
The highly-referenced pcgameshardware.de image of a bent Skylake CPU
The problem is easy enough to explain, as Skylake has a notably thinner construction compared to earlier generations of Intel CPUs, and if enough pressure is exerted against these new processors the green substrate can bend, causing damage not only to the CPU but the pins in the LGA 1151 socket as well.
The only way to prevent the possibility of a bend is avoid overtightening the heatsink, but considering most compatible coolers on the market were designed for Haswell and earlier generations of Intel CPU this leaves users to guess what pressure might be adequate without potentially bending the CPU.
Intel has commented on the issue:
"The design specifications and guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations and are available for partners and 3rd party manufacturers. Intel can’t comment on 3rdparty designs or their adherence to the recommended design specifications. For questions about a specific cooling product we must defer to the manufacturer."
It's worth noting that while Intel states that their "guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations", it is specifically a change in substrate thickness that has caused the concerns. The problem is not limited to any specific brands, but certainly will be more of an issue for heatsink mounts that can exert a tremendous amount of pressure.
An LGA socket damaged from a bent Skylake CPU (credit: pcgameshardware)
From the Ars report:
"Noctua, EK Water Blocks, Scythe, Arctic, Thermaltake, and Thermalright, commenting to Games Hardware about the issue, suggested that damage from overly high mounting pressure is most likely to occur during shipping or relocation of a system. Some are recommending that the CPU cooler be removed altogether before a system is shipped."
Scythe has been the first vendor to offer a solution to the issue, releasing this statement on their support website:
"Japanese cooling expert Scythe announces a change of the mounting system for Skylake / Socket 1151 on several coolers of its portfolio. All coolers are compatible with Skylake sockets in general, but bear the possibility of damage to CPU and motherboard in some cases where the PC is exposed to strong shocks (e.g. during shipping or relocation).This problem particularly involves only coolers which will mounted with the H.P.M.S. mounting system. To prevent this, the mounting pressure has been reduced by an adjustment of the screw set. Of course, Scythe is going to ship a the new set of screws to every customer completely free of charge! To apply for the free screw set, please send your request via e-mail to firstname.lastname@example.org or use the contact form on our website."
The thickness of Skylake (left) compared to Haswell (right) (credit: pcgameshardware)
As owner of an Intel Skylake i5-6600K, which I have been testing with an assortment of CPU coolers for upcoming reviews, I can report that my processor appears to be free of any obvious damage. I am particularly careful about pressure when attaching a heatsink, but there have been a couple (including the above mentioned Scythe HPMS mounting system) that could easily have been tightened far beyond what was needed for a proper connection.
We will continue to monitor this situation and update as more vendors offer their response to the issue.
Subject: General Tech | December 1, 2015 - 09:20 PM | Jeremy Hellstrom
Tagged: Intel, apollo lake, 14nm, rumours
DigiTimes has heard rumours that Intel will be refreshing their processor lineup with Apollo Lake processors in June and August 2016, with devices powered by the new processors in October. This is rather good news considering how slowly new PC sales have been growing over the past year, it is nice to see that we will still have some new CPUs in the coming year. Details are rather scarce, the 14nm chips will come in dual and quad-core options and use the new Gen9 GPU which will support Ultra HD output. You can expect 6-10W TDP, these are very much mobile oriented chips.
"Seeing the trend, Intel is scheduled to mass produce its next-generation Apollo Lake-based processors in June-August 2016 with related entry-level PC products becoming available in the market in October 2016, according to sources from the upstream supply chain."
Here is some more Tech News from around the web:
- After Twenty Years of Flash, Adobe Kills the Name @ Slashdot
- A Look At NVIDIA’s Standalone Iray Plugins & Iray Server @ Techgage
- Windows 10: Enterprise adoption rate seems a bit optimistic @ The Inquirer
- Belkin's N150 router is perfect for learning hacking skills – wait, what, it's in production? @ The Register
- VPN users menaced by port forwarding blunder @ The Register
- Microsoft takes PUPs behind the shed with gun in hand @ The Register
- TP-LINK Touch P5 AC1900 Wi-Fi Gigabit Router Review @ Madshrimps
- AK RACING Nitro Gaming Chair Review @ NikKTech
- Tech ARP Elephone Q Smartphone Giveaway
Subject: Processors, Mobile | December 1, 2015 - 12:30 PM | Scott Michaud
Tagged: TSMC, SoC, LG, Intel, arm
So this story came out of nowhere. Whether the rumors are true or false, I am stuck on how everyone seems to be talking about it with a casual deadpan. I spent a couple hours Googling whether I missed some big announcement that made Intel potentially fabricating ARM chips a mundane non-story. Pretty much all that I found was Intel allowing Altera to make FPGAs with embedded ARM processors in a supporting role, which is old news.
Image Credit: Internet Memes...
The rumor is that Intel and TSMC were both vying to produce LG's Nuclon 2 SoC. This part is said to house two quad-core ARM modules in a typical big.LITTLE formation. Samples were allegedly produced, with Intel's part (2.4 GHx) being able to clock around 300 MHz faster than TSMC's offering (2.1 GHz). Clock rate is highly dependent upon the “silicon lottery,” so this is an area that production maturity can help with. Intel's sample would also be manufactured at 14nm (versus 16nm from TSMC although these numbers mean less than they used to). LG was also, again allegedly, interesting in Intel's LTE modem. According to the rumors, LG went with TSMC because they felt Intel couldn't keep up with demand.
Now that the rumor has been reported... let's step back a bit.
I talked with Josh a couple of days ago about this post. He's quite skeptical (as I am) about the whole situation. First and foremost, it takes quite a bit of effort to port a design to a different manufacturing process. LG could do it, but it is questionable, especially for a second chip ever sort of thing. Moreover, I still believe that Intel doesn't want to manufacture chips that directly compete with them. x86 in phones is still not a viable business, but Intel hasn't given up and you would think that's a prerequisite.
So this whole thing doesn't seem right.
Subject: Processors | November 20, 2015 - 11:21 PM | Scott Michaud
Tagged: xeon, Intel, FPGA
UPDATE (Nov 26th, 3:30pm ET): A few readers have mentioned that FPGAs take much less than hours to reprogram. I even received an email last night that claims FPGAs can be reprogrammed in "well under a second." This differs from the sources I've read when I was reading up on their OpenCL capabilities (for potential evolutions of projects) back in ~2013. That said, multiple sources, including one who claim to have personal experience with FPGAs, say that it's not the case. Also, I've never used an FPGA myself -- again, I was just researching them to see where some GPU-based projects could go.
Designing integrated circuits, as I've said a few times, is basically a game. You have a blank canvas that you can etch complexity into. The amount of “complexity” depends on your fabrication process, how big your chip is, the intended power, and so forth. Performance depends on how you use the complexity to compute actual tasks. If you know something special about your workload, you can optimize your circuit to do more with less. CPUs are designed to do basically anything, while GPUs assume similar tasks can be run together. If you will only ever run a single program, you can even bake some or all of its source code into hardware called an “application-specific integrated circuit” (ASIC), which is often used for video decoding, rasterizing geometry, and so forth.
This is an old Atom back when Intel was partnered with Altera for custom chips.
FPGAs are circuits that can be baked into a specific application, but can also be reprogrammed later. Changing tasks requires a significant amount of time (sometimes hours) but it is easier than reconfiguring an ASIC, which involves removing it from your system, throwing it in the trash, and printing a new one. FPGAs are not quite as efficient as a dedicated ASIC, but it's about as close as you can get without translating the actual source code directly into a circuit.
Intel, after purchasing FPGA manufacturer, Altera, will integrate their technology into Xeons in Q1 2016. This will be useful to offload specific tasks that dominate a server's total workload. According to PC World, they will be integrated as a two-chip package, where both the CPU and FPGA can access the same cache. I'm not sure what form of heterogeneous memory architecture that Intel is using, but this would be a great example of a part that could benefit from in-place acceleration. You could imagine a simple function being baked into the FPGA to, I don't know, process large videos in very specific ways without expensive copies.
Again, this is not a consumer product, and may never be. Reprogramming an FPGA can take hours, and I can't think of too many situations where consumers will trade off hours of time to switch tasks with high performance. Then again, it just takes one person to think of a great application for it to take off.
Podcast #376 - Intel Speed Shift, CPU Coolers from Noctua and DEEPCOOL, Broadwell-E Rumors, and more!
Subject: General Tech | November 19, 2015 - 07:42 PM | Ken Addison
Tagged: podcast, video, noctua, Deepcool, Gamer Storm Gabriel, Intel, speed shift, amd, R9, fury x, trixx, Broadwell-E, kaby lake, nvidia, shield tablet k1, knights landing, asus, chromebit
PC Perspective Podcast #376 - 11/19/2015
Join us this week as we discuss Intel Speed Shift, CPU Coolers from Noctua and DEEPCOOL, Broadwell-E Rumors, and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Sebastian Peak
Program length: 1:19:22
Week in Review:
0:32:10 This episode of PC Perspective Podcast is brought to you by Braintree. Even the best mobile app won’t work without the right payments API. That’s where the Braintree v.0 SDK comes in. One amazingly simple integration gives you every way to pay. Try out the sandbox and see for yourself at braintreepayments.com/pcper
News item of interest:
Hardware/Software Picks of the Week:
Subject: Processors | November 18, 2015 - 12:34 PM | Scott Michaud
Tagged: Xeon Phi, knights landing, Intel
The add-in board version of the Xeon Phi has just launched, which Intel aims at supercomputing audiences. They also announced that this product will be available as a socketed processor that is embedded in, as PC World states, “a limited number of workstations” by the first half of next year. The interesting part about these processors is that they combine a GPU-like architecture with the x86 instruction set.
Image Credit: Intel (Developer Zone)
In the case of next year's socketed Knights Landing CPUs, you can even boot your OS with it (and no other processor installed). It will probably be a little like running a 72-core Atom-based netbook.
To make it a little more clear, Knights Landing is a 72-core, 512-bit processor. You might wonder how that can compete against a modern GPU, which has thousands of cores, but those are not really cores in the CPU sense. GPUs crunch massive amounts of calculations by essentially tying several cores together, and doing other tricks to minimize die area per effective instruction. NVIDIA ties 32 instructions together and pushes them down the silicon. As long as they don't diverge, you can get 32 independent computations for very little die area. AMD packs 64 together.
Knight's Landing does the same. The 512-bit registers can hold 16 single-precision (32-bit) values and operate on them simultaneously.
16 times 72 is 1152. All of a sudden, we're in shader-count territory. This is one of the reasons why they can achieve such high performance with “only” 72 cores, compared to the “thousands” that are present on GPUs. They're actually on a similar scale, just counted differently.
Update: (November 18th @ 1:51 pm EST) I just realized that, while I kept saying "one of the reasons", I never elaborated on the other points. Knights Landing also has four threads per core. So that "72 core" is actually "288 thread", with 512-bit registers that can perform sixteen 32-bit SIMD instructions simultaneously. While hyperthreading is not known to be 100% efficient, you could consider Knights Landing to be a GPU with 4608 shader units. Again, it's not the best way to count it, but it could sort-of work.
So in terms of raw performance, Knights Landing can crunch about 8 TeraFLOPs of single-precision performance or around 3 TeraFLOPs of double-precision, 64-bit performance. This is around 30% faster than the Titan X in single precision, and around twice the performance of Titan Black in double precision. NVIDIA basically removed the FP64 compute units from Maxwell / Titan X, so Knight's Landing is about 16x faster, but that's not really a fair comparison. NVIDIA recommends Kepler for double-precision workloads.
So interestingly, Knights Landing would be a top-tier graphics card (in terms of shading performance) if it was compatible with typical graphics APIs. Of course, it's not, and it will be priced way higher than, for instance, the AMD Radeon Fury X. Knight's Landing isn't available on Intel ARK yet, but previous models are in the $2000 - $4000 range.
Subject: Processors, Systems | November 17, 2015 - 04:21 PM | Sebastian Peak
Tagged: Skylake, NUC6i5SYK, NUC6i5SYH, NUC6i3SYK, NUC6i3SYH, nuc, mini-pc, Intel, i5-6260U, i3-6100U
(Image credit: PCMag)
NUC systems sporting the latest Intel 6th-gen Skylake processors are coming, with the NUC6i5SYH, NUC6i5SYK, NUC6i3SYH, NUC6i3SYK listed with updated Core i5 and i3 CPUs. As this is a processor refresh the appearance and product nomenclature remain unchanged (unfortunately).
The four new Skylake Intel NUC models listed on Intel's product page
Here's Intel's description of the Skylake Core i5-powered NUC6i5SYH:
"Intel NUC Kit NUC6i5SYH is equipped with Intel’s newest architecture, the 6th generation Intel Core i5-6260U processor. Intel Iris graphics 540 with 4K display capabilities provides brilliant resolution for gaming and home theaters. NUC5i5SYH has room for a 2.5” drive for additional storage and an M.2 SSD so you can transfer your data at lightning speed. Designed for Windows 10, NUC6i5SYH has the performance to stream media, manage spreadsheets, or create presentations."
The NUC6i5SYH and NUC6i5SYK feature the i5-6260U is a dual-core, Hyper-Threaded 15W part with a base speed of 1.9 GHz with up to 2.8 GHz Turbo. It has 4 MB cache and supports up to 32GB 2133 MHz DDR4. The processor also provides Intel Iris graphics 540 (Skylake GT3e), which offers 48 Execution Units and 64 MB of dedicated eDRAM. The lower-end NUC6i3SYH and NUC6i3SYK models offer the i3-6100U, which is also a dual-core, Hyper-Threaded part, but this 15W processor's speed is fixed at 2.3 GHz without Turbo Boost, and it offers the lesser Intel HD Graphics 520.
Availability and pricing are not yet known, but expect to see the new models for sale soon.
Subject: General Tech | November 16, 2015 - 08:55 PM | Jeremy Hellstrom
Tagged: Skylake, LGA 1151, leak, kaby lake, intel 200, Intel, cannon lake
Benchlife.info got hold of two slides from an Intel presentation for Kaby Lake which cover some of the features you can expect to find on the new processor family. As with all leaks you should ensure you take a dosage of Sodium Chloride while looking through the information.
The Intel 200 chipset will provide up to 30 PCIe lanes, 24 of which can be dedicated to PCIe slots and another half dozen for SATA 6Gbps. The chipset can also manage up to 10 USB 3.0 ports though do not expect to see all of these present on a board at the same time, there is only so much bandwidth to go around, as M.2 slots were not mentioned and will also share the PCIe pool. If you are wondering what Intel Optane Technology is you can be forgiven as apparently calling it NVME support would be too easy.
As for the processor, it will remain LGA 1151 with power ranging from 35W to 95W which means it should be compatible with existing boards, assuming a UEFI update is released. The processor will support hardware acceleration for 10-bit VP9 playback and 10-bit HVEC encoding, as well as supporting 5K video at 30Hz and 60Hz, impressive for an onboard GPU. The processors will be unlocked and have enhanced BCLK overclocking as well. As you would expect the CPU is ready for NVMe, Thunderbolt 3 and even Intel RealSense. Follow the link if you want to give your translator program a workout.