Subject: Processors | December 12, 2018 - 09:00 AM | Sebastian Peak
Tagged: xeon, Sunny Cove, processor, intel core, Intel, integrated graphics, iGPU, Foveros, cpu, 3D stacking
Intel’s Architecture Day was held yesterday and brought announcements of three new technologies. Intel shared details of a new 3D stacking technology for logic chips, a brand new CPU architecture for desktop and server, and some surprising developments on the iGPU front. Oh, and they mentioned that whole discrete GPU thing…
3D Stacking for Logic Chips
First we have Foveros, a new 3D packaging technology that follows Intel’s previous EMIB (Embedded Multi-die Interconnect Bridge) 2D packaging technology and enables die-stacking of high-performance logic chips for the first time.
“Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies. Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors for the first time.”
Foveros will allow for a new “chiplet” paradigm, as “I/O, SRAM, and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top”. This new approach would permit design elements to be “mixed and matched”, and allow new device form-factors to be realized as products can be broken up into these smaller chiplets.
The first range of products using this technology are expected to launch in the second half of 2019, beginning with a product that Intel states “will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die,” which Intel says “will enable the combination of world-class performance and power efficiency in a small form factor”.
Intel Sunny Cove Processors - Coming Late 2019
Next up is the announcement of a brand new CPU architecture with Sunny Cove, which will be the basis of Intel’s next generation Core and Xeon processors in 2019. No mention of 10nm was made, so it is unclear if Intel’s planned transition from 14nm is happening with this launch (the last Xeon roadmap showed a 10 nm transition with "Ice Lake" in 2020).
Intel states that Sonny Cove is “designed to increase performance per clock and power efficiency for general purpose computing tasks” with new features included “to accelerate special purpose computing tasks like AI and cryptography”.
Intel provided this list of Sunny Cove’s features:
- Enhanced microarchitecture to execute more operations in parallel.
- New algorithms to reduce latency.
- Increased size of key buffers and caches to optimize data-centric workloads.
- Architectural extensions for specific use cases and algorithms. For example, new performance-boosting instructions for cryptography, such as vector AES and SHA-NI, and other critical use cases like compression and decompression.
Integrated Graphics with 2x Performance
Intel slide image via ComputerBase
Intel did reveal next-gen graphics, though it was a new generation of the company’s integrated graphics announced at the event. The update is nonetheless significant, with the upcoming Gen11 integrated GPU “expected to double the computing performance-per-clock compared to Intel Gen9 graphics” thanks to a huge increase in Execution Units, from 24 EUs with Gen9 to 64 EUs with Gen11. This will provide “>1 TFLOPS performance capability”, according to Intel, who states that the new Gen11 graphics are also expected to feature advanced media encode/decode, supporting “4K video streams and 8K content creation in constrained power envelopes”.
And finally, though hardly a footnote, the new Gen11 graphics will feature Intel Adaptive Sync technology, which was a rumored feature of upcoming discrete GPU products from Intel.
And now for that little part about discrete graphics: At the event Intel simply “reaffirmed its plan to introduce a discrete graphics processor by 2020”. Nothing new here, and this obviously means that we won’t be seeing a new discrete GPU from Intel in 2019 - though the beefed-up Gen11 graphics should provide a much needed boost to Intel’s graphics offering when Sonny Cove launches “late next year”.
Subject: Systems, Mobile | January 4, 2017 - 10:15 AM | Sebastian Peak
Tagged: nvidia, notebook, laptop, kaby lake, intel core, detachable, convertible, CES 2017, CES, asus, all in one, AIO, 7th generation
ASUS has refreshed their notebook and all-in-one (AiO) desktop lineup with the new 7th-generation Intel Core (Kaby Lake) processors, with models ranging from the ultra-thin UX330 to the 27-inch ZN270IE AiO.
The ZenBook UX330
The refreshed notebook lineup includes the 13.3-inch ZenBook models UX310 and UX330, and 15.6-inch ZenBook UX510. The convertible ZenBook Flip UX360UA and detachable Transformer Pro T304 have also been updated to Kaby Lake.
ZenBook Flip UX360
On the all-in-one side the refreshed models include Zen AiO Pro Z240IE and Zen AiO ZN241IC desktops, with a new model announced in the Zen AiO ZN270IE, a 27-inch (FHD) model which pairs a 7th-gen Core i7 processor with discrete NVIDIA graphics.
Zen AiO ZN270
Pricing and availability of the updated machines is as follows:
Available immediately are the ZenBook UX310UA ($699), ZenBook UX330UA ($749), and ZenBook UX510UW ($999). The ZenBook UX360UAK ($899) and Transformer Pro T304 ($999) will be available in May. Updated AiO desktops will be available in March, with the ZN241IC and ZN270IE priced at $999, and the Zen AIO Pro Z240IE at $1799.
Follow all of our coverage of the show at https://pcper.com/ces!
Subject: Systems | December 17, 2015 - 11:36 PM | Sebastian Peak
Tagged: mini-pc, LIVA, intel core, ECS, CES 2016
ECS will announce a new LIVA mini PC at CES 2016, which they are describing as a "one-liter book-size Core i mini PC".
"ECS is proud to introduce its brand new LIVA mini-PC - One at CES 2016. It features a flexible hardware configuration in a book-size, one-liter form factor. In addition, LIVA mini PC with Windows 10 will have a remote control application natively built-in; providing full wireless usage with your own mobile devices."
No images were provided, but the prospect of an Intel Core processor alone makes it a much more attractive proposition than prior versions which use underpowered Atom processors.
The first three generations of LIVA from our look at the LIVA X2.
PC Perspective will be covering CES as new products are officially unveiled, and we will have more on this new hardware from the show.
Subject: Systems | January 6, 2015 - 08:09 PM | Sebastian Peak
Tagged: nuc, intel core, Intel, ces 2015, CES, Broadwell
Intel has announced new NUC units with 5th generation Intel Core processors and a dizzying array of complex model names.
It comes as no surprise that Intel's NUC lineup hs been upgraded to their newest 5th generation Core architecture, and these new units are powered by Core i3 and i5 Broadwell CPUs. The move to Broadwell will enable these new NUCs to operate with greater efficiency and lower power consumption, an especially vital advantage for systems housed in enclosures as small as 115mm x 111mm x 48.7mm (4.53" x 4.37" x 1.92"). There are a variety of new models to choose from, and Intel is highlighting specific usage examples to aid in the buying decision.
The featured NUC, memorably named NUC5i5RYH, is powered by the Core i5 5250U CPU which offers dual-core, 4-thread performance up to 2.7 GHz and supports 2.5" hard drives. Graphics are handled by the integrated Intel HD 6000 GPU which offers multi-display support via Mini DisplayPort (1.2) and Mini HDMI (1.4a). This model supports up to 16GB dual-channel DDR3L memory via two SoDIMM slots, with connectivity provided by Intel PRO Gigabit Ethernet and Intel Wireless-AC 7265.
Storage options for the NUC5i5RYH include M.2 (x4) and SATA 6.0 Gb/s for a SSD/HDD up to 9.5mm thick.
The NUC5i5RYH is joined by the NUC5i5RYK, NUC5i3RYH, NUC5i3RYK... Actually, just follow the link to see a comparison of the new Broadwell NUCs.
The new Broadwell NUCs will be shipping in February and March, depending on model.
Follow all of our coverage of the show at http://pcper.com/ces!
Introduction and Design
The last three years have been great for ultraportables and netbooks. Laptops with displays below fourteen inches in size have exploded in popularity thanks not only to Intel's Atom, but also a wide selection of Intel ultra-low voltage products. Many of the laptops that we've reviewed over the past year, such as the Lenovo IdeaPad U260 and the Alienware M11x, would have been impossible prior to the release of those processors.
Mainstream laptops have enjoyed less progress, however. The 15.6" laptop remains the most popular category with consumers, but while it has enjoyed a boost in performance with the release of the original Core i series processors, issues like battery life and graphics performance remained largely unaddressed. These mainstream laptops have continued to represent a major compromise, as they've been unable to provide great battery life but also (unless supplimented with a discrete GPU) lack the chops to play any but the most basic 3D games.
According to Intel, these flaws could soon be addressed. Intel's Sandy Bridge mobile processors are nothing short of the savior of mainstream laptops. These processors not only offer the typical improvements in speed but also drastically improved integrated graphics and provide much better battery life.
Or, at least, that's what Intel says. They've said such things in the past, however - Intel's IGPs have often promised more than they can deliver. But every piece of hardware deserves a fair shake, and now it's time for Intel's Sandy Bridge to step up to the plate, appearing today in the form of the ASUS K53E. Let's see what is under the hood.