Subject: Storage, Shows and Expos | September 16, 2014 - 12:49 PM | Allyn Malventano
Tagged: ram, NVMe, IOPS, idf 2014, idf, ddr4, DDR
The Intel Developer Forum was last week, and there were many things to be seen for sure. Mixed in with all of the wearable and miniature technology news, there was a sprinkling of storage goodness. Kicking off the show, we saw new cold storage announcements from both HGST and Western Digital, but that was about it for HDD news, as the growing trend these days is with solid state storage technologies. I'll start with RAM:
First up was ADATA, who were showing off 64GB DDR3 (!) DIMMs:
Next up were various manufacturers pushing DDR4 technology quite far. First was SK Hynix's TSV 128GB DIMMs (covered in much greater depth last week):
Next up is Kingston, who were showing a server chassis equipped with 256GB of DDR4:
If you look closer at the stats, you'll note there is more RAM in this system than flash:
Next up is IDT, who were showing off their LRDIMM technology:
This technology adds special data buffers to the DIMM modules, enabling significantly higher amounts of installed RAM into a single system, with a 1-2 step de-rating of clock speeds as you take capacities to the far extremes. The above server has 768GB of DDR4 installed and running!:
Moving onto flash memory type stuff, Scott covered Intel's new 40 Gbit Ethernet technology last week. At IDF, Intel had a demo showing off some of the potential of these new faster links:
This demo used a custom network stack that allowed a P3700 in a local system to be matched in IOPS by an identical P3700 *being accessed over the network*. Both local and networked storage turned in the same 450k IOPS, with the remote link adding only 8ms of latency. Here's a close-up of one of the SFF-8639 (2.5" PCIe 3.0 x4) SSDs and the 40 Gbit network card above it (low speed fans were installed in these demo systems to keep some air flowing across the cards):
Stepping up the IOPS a bit further, Microsoft was showing off the capabilities of their 'Inbox AHCI driver', shown here driving a pair of P3700's at a total of 1.5 million IOPS:
...for those who want to get their hands on this 'Inbox driver', guess what? You already have it! "Inbox" is Microsoft's way of saying the driver is 'in the box', meaning it comes with Windows 8. Bear in bind you may get better performance with manufacturer specific drivers, but it's still a decent showing for a default driver.
Now for even more IOPS:
Yes, you are reading that correctly. That screen is showing a system running over 11 million IOPS. Think it's RAM? Wrong. This is flash memory pulling those numbers. Remember the 2.5" P3700 from a few pics back? How about 24 of them:
The above photo shows three 2U systems (bottom), which are all connected to a single 2U flash memory chassis (top). The top chassis supports three submodules, each with eight SFF-8639 SSDs. The system, assembled by Newisys, demonstrates just how much high speed flash you can fit within an 8U space. The main reason for connecting three systems to one flash chassis is because it takes those three systems to process the full IOPS capability of 24 low latency NVMe SSDs (that's 96 total lanes of PCIe 3.0!)!
So there you have it, IDF storage tech in a nutshell. More to come as we follow these emerging technologies to their maturity.
Subject: General Tech | September 15, 2014 - 03:00 PM | Jeremy Hellstrom
Tagged: idf 2014, sony, Panasonic, Samsung, cameras
At IDF there were a few new cameras on display which caught The Register's attention in amongst the smart appliances and other gadgets. For the highest quality selfies try the Panasonic HX-500 4K activity cam which is good at depths of up to 3 metres for up to 30 minutes. Perhaps you would prefer to pair your Galaxy Note 4 with the Samsung Galaxy VR headset to give you an Occulus like look at the world; a 96-degree view which is intended to look like a 175-inch screen seen from 2 metres away. Samsung users could also pick up the Olloclip for Android, giving you fisheye and wide angle lenses for your Galaxy S4 or S5. There is more in the article, check them all out here.
"Image is everything - or so it has been said, and if the gadgets at the recent IFA techfest in Berlin are anything to go by then manufacturers certainly seem to think we’re image obsessed. With selfies being a global compulsion, perhaps they know us better than we know ourselves."
Here is some more Tech News from around the web:
- Get 1 TB of Military Grade Online Backup For $19 From iDrive @ Gizmodo
- Boffins say they've got Lithium batteries the wrong way around @ The Register
- Brando Nexus 7 II Protective Accessories Presentation @ Madshrimps
- Sandberg Credit Card 850mAh Powerbank Review @ NikKTech
Subject: General Tech | September 12, 2014 - 04:41 PM | Jeremy Hellstrom
Tagged: Realsense 3D, idf 2014, 3D rendering, 3d printing
There was an interesting use of Intel's Realsense 3D technology displayed at IDF by a company called Volumental. By using a new product with the new style of camera it would be possible to make a 3D map of your body accurate enough to make clothing patterns from. The example offered were a pair shoes that could be ordered online with no concerns about the fit as the shoes would be perfect for you. That is just the beginning though, you would also be able to order a perfectly tailored suit online without ever needing to appear in person for a fitting. It could also lead to an even worse Fappening in the future; choose your online clothing supplier carefully. There is more here at The Inquirer.
"The proof of concept software, called Volume Voice[sic], accurately scans parts of the human body with Intel's Realsense 3D depth cameras, which will soon feature on Intel-powered laptops and tablets. Volumental's cloud-based platform will then allow individuals to create products that are tailored to their own bodies, for example, shoes that fit perfectly without the need to try them on before buying."
Here is some more Tech News from around the web:
- TSMC forms IoT task force @ DigiTimes
- Intel launches digital signage turnkey solutions @ DigiTimes
- No TKO for LTO: Tape format spawns another 2 generations, sports 120TB bigness @ The Register
- Leak of '5 MEELLLION Gmail passwords' creates security flap @ The Register
- iPhone 6 Plus first impressions @ The Inquirer
- TP-Link AV500 Powerline @ HardwareHeaven
Subject: General Tech, Cases and Cooling, Systems, Shows and Expos | September 12, 2014 - 02:20 PM | Scott Michaud
Tagged: idf, idf 2014, nuc, Intel, SFF, small form factor
A few years ago, Intel introduced the NUC line of small form factor PCs. At this year's IDF, they have announced plans to make even smaller, and cheaper, specifications that are intended for OEMs to install Windows, Linux, Android, and Chrome OS on. This initiative is not yet named, but will consist of mostly soldered components, leaving basically just the wireless adapters user-replaceable, rather than the more user-serviceable NUC.
Image Credit: Liliputing
Being the owner of Moore's Law, they just couldn't help but fit it to some type of exponential curve. While it is with respect to generation, not time, Intel expects the new, currently unnamed form factor to halve both the volume (size) and bill of material (BOM) cost of the NUC. They then said that another generation after ("Future SFF") will halve the BOM cost again, to a quarter of the NUC.
What do our readers think? Would you be willing to give up socketed components for smaller and cheaper devices in this category or does this just become indistinguishable from mobile devices (which we already know can be cheap and packed into small spaces)?
Podcast #317 - ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!
Subject: General Tech | September 11, 2014 - 02:30 PM | Ken Addison
Tagged: podcast, video, asus, X99, X99 Deluxe, Intel, core m, xeon e5-2600 v3, idf, idf 2014, fortville, 40GigE, dell, 5k, nvidia, GM204, maxwell
PC Perspective Podcast #317 - 09/11/2014
Join us this week as we discuss our ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
- MP3 - Direct download link to the MP3 file
Hosts: Josh Walrath, Allyn Malventano, and Morry Tietelman
Program length: 1:33:48
Week in Review:
News items of interest:
1:15:50 NVIDIA GM204 info is leaking
Hardware/Software Picks of the Week:
Allyn: Read our IDF news!
Subject: General Tech | September 11, 2014 - 01:04 PM | Jeremy Hellstrom
Tagged: idf 2014, western digital, hgst, Intel, dell
The Tech Report have been busy scribing up the various announcements and product releases that Intel and others are revealing at this years IDF. The HDD is staying alive by offering larger capacities than were available previously, from Western Digital's 6.3 TB archival model to HGST's 10TB helium filled monster with a 3.2TB SSD also available for frequently accessed data. From Intel comes information on Skylake systems and their wireless charging to the first benchmarks we've seen for Core M ultraportables. Also present were Dell, which allowed TR some hands on time with their Venue 8 7000 and of course a small announcement from that other company.
"Somewhat surprisingly, the initial model's capacity is listed as 6.x TB. The Ae is based on an "innovative Progressive Capacity model" that allows WD to increase the capacity of shipping drives as yields improve and the company gets better at squeezing more data onto the platters. The gains will be small—capacities of 6.1, 6.2, and 6.3 TB are listed as examples—but WD says the folks who need drives like these are hungry for even incremental improvements."
Here is some more Tech News from around the web:
- The TR Podcast 161: Haswell extremes, FX redux, and Tonga devil magic
- Intel demos Skylake silicon; production expected in 2H 2015 @ The Tech Report
- IDF: Intel announces A-Wear to push big data apps via Internet of Things @ The Inquirer
- Whopping 10TB disks spin out of HGST – plus 3.2TB flash slabs @ The Register
- Intel Publishes Initial Skylake Linux Graphics Support @ Phoronix
- Intel Core M 5Y70 Broadwell-Y Benchmarked At IDF 2014 @ Legit Reviews
- Use home networking kit? DDoS bot is BACK... and it has EVOLVED @ The Register
- Quanta lands half of Acer notebook orders for 2015 @ DigiTimes
- Robotic Arm Control from the BeagleBone Black @ Linux.com
Subject: Storage, Shows and Expos | September 10, 2014 - 03:34 PM | Allyn Malventano
Tagged: TSV, Through Silicon Via, memory, idf 2014, idf
If you're a general computer user, you might have never heard the term "Through Silicon Via". If you geek out on photos of chip dies and wafers, and how chips are assembled and packaged, you might have heard about it. Regardless of your current knowledge of TSV, it's about to be a thing that impacts all of you in the near future.
Let's go into a bit of background first. We're going to talk about how chips are packaged. Micron has an excellent video on the process here:
The part we are going to focus on appears at 1:31 in the above video:
This is how chip dies are currently connected to the outside world. The dies are stacked (four high in the above pic) and a machine has to individually wire them to a substrate, which in turn communicates with the rest of the system. As you might imagine, things get more complex with this process as you stack more and more dies on top of each other:
16 layer die stack, pic courtesy NovaChips
...so we have these microchips with extremely small features, but to connect them we are limited to a relatively bulky process (called package-on-package). Stacking these flat planes of storage is a tricky thing to do, and one would naturally want to limit how many of those wires you need to connect. The catch is that those wires also equate to available throughput from the device (i.e. one wire per bit of a data bus). So, just how can we improve this method and increase data bus widths, throughput, etc?
Before I answer that, let me lead up to it by showing how flash memory has just taken a leap in performance. Samsung has recently made the jump to VNAND:
By stacking flash memory cells vertically within a die, Samsung was able to make many advances in flash memory, simply because they had more room within each die. Because of the complexity of the process, they also had to revert back to an older (larger) feature size. That compromise meant that the capacity of each die is similar to current 2D NAND tech, but the bonus is speed, longevity, and power reduction advantages by using this new process.
I showed you the VNAND example because it bears a striking resemblance to what is now happening in the area of die stacking and packaging. Imagine if you could stack dies by punching holes straight through them and making the connections directly through the bottom of each die. As it turns out, that's actually a thing:
Core M 5Y70 Early Testing
During a press session today with Intel, I was able to get some early performance results on Broadwell-Y in the form of the upcoming Core M 5Y70 processor.
Testing was done on a reference design platform code named Llama Mountain and at the heart of the system is the Broadwell-Y designed dual-core CPU, the Core M 5Y70, which is due out later this year. Power consumption of this system is low enough that Intel has built it with a fanless design. As we posted last week, this processor has a base frequency of just 1.10 GHz but it can boost as high as 2.6 GHz for extra performance when it's needed.
Before we dive into the actual result, you should keep in mind a couple of things. First, we didn't have to analyze the systems to check driver revisions, etc., so we are going on Intel's word that these are setup as you would expect to see them in the real world. Next, because of the disjointed nature of test were were able to run, the comparisons in our graphs aren't as great as I would like. Still, the results for the Core M 5Y70 are here should you want to compare them to any other scores you like.
First, let's take a look at old faithful: CineBench 11.5.
UPDATE: A previous version of this graph showed the TDP for the Intel Core M 5Y70 as 15 watts, not the 4.5 watt listed here now. The reasons are complicated. Even though the Intel Ark website lists the TDP of the Core M 5Y70, Intel has publicly stated the processor will make very short "spikes" at 15 watts when in its highest Turbo Boost modes. It comes to a discussion of semantics really. The cooling capability of the tablet is only targeted to 4.5-6.0 watts and those very short 15 watt spikes can be dissipated without the need for extra heatsink surface...because they are so short. SDP anyone? END UPDATE
With a score of 2.77, the Core M 5Y70 processor puts up an impressive fight against CPUs with much higher TDP settings. For example, Intel's own Pentium G3258 gets a score of 2.71 in CB11, and did so with a considerably higher thermal envelope. The Core i3-4330 scores 38% higher than the Core M 5Y70 but it requires a TDP 3.6-times larger to do so. Both of AMD's APUs in the 45 watt envelope fail to keep up with Core M.
Subject: Shows and Expos | September 9, 2014 - 05:27 PM | Ryan Shrout
Tagged: Skylake, Intel, idf 2014, idf, 14nm
2015 is shaping up to be an interesting year for Intel's consumer processor product lines. We are still expected to see Broadwell make some kind of debut in a socketed form in addition to the mobile releases trickling out beginning this holiday, but it looks like we will also get our first taste of Skylake late next year.
Skylake is Intel's next microarchitecture and will be built on the same 14nm process technology currently shipping with Broadwell-Y. Intel stated that it expects to see dramatic improvements in all areas of measurement including performance, power consumption and silicon efficiency.
On stage the company demoed Skylake running the 3DMark Fire Strike benchmark though without providing any kind of performance result (obviously). That graphics demo was running on an engineering development board and platform and though it looked incredibly good from where we were sitting, we can't make any guess as to the performance quite yet.
Intel then surprised us by bringing a notebook out from behind the monitor showing Skylake up and running in a mobile form factor decoding and playing back 4K video. Once again, the demo was smooth and impressive though you expect no more from an overly rehearsed keynote.
Intel concluded that it was "excited about the health of Skylake" and that they should be in mass production in the first quarter of 2015 with samples going out to customers. Looking even further down the rabbit hole the company believes they have a "great line of sight to 10nm and beyond."
Even though details were sparse, it is good news for Intel that they would be willing to show Skylake so early and yet I can't help but worry about a potentially shorter-than-expected life span for Broadwell in the desktop space. Mobile users will find the increased emphasis on power efficiency a big win for thin and light notebooks but enthusiast are still on the look out for a new product to really drive performance up in the mainstream.
Subject: Storage, Shows and Expos | September 9, 2014 - 04:51 PM | Allyn Malventano
Tagged: WDC< Western Digital, WD, idf 2014, idf, hdd, Cold, Archival, Ae
We talked about helium filled, shingled HDD's from HGST earlier today. Helium may give you reduced power demands, but at the added expensive of hermetically sealed enclosures over conventional HDD's. Shingling may give added capacity, but at the expense of being forced into specific writing methods. Now we know Western Digital's angle into archival / cold storage:
..so instead of going with higher cost newer technologies, WD is taking their consumer products and making them more robust. They are also getting rid of the conventional thinking of capacity increments and are moving to 100GB increments. The idea is that once a large company or distributor has qualified a specific HDD model on their hardware, that model will stick around for a while, but be continued at an increased capacity as platter density yields increase over time. WD has also told me that capacities may even be mixed an matched within a 20-box of drives, so long as the average capacity matches the box label. This works in the field of archival / cold storage for a few reasons:
- Archival storage systems generally do not use conventional RAID (where an entire array of matching capacity disks are spinning simultaneously). Drives are spun up and written to individually, or spun up individually to service the occasional read request. This saves power overall, and it also means the individual drives can vary in capacity with no ill effects.
- Allowing for variable capacity binning helps WD ship more usable platters/drives overall (i.e. not rejecting drives that can't meet 6TB). This should drive overall costs down.
- Increasing capacity by only a few hundred GB per drive turns into *huge* differences in cost when you scale that difference up to the number of drives you would need to handle a very large total capacity (i.e. Exabytes).
So the idea here is that WD is choosing to stick with what they do best, which they can potentially do for even cheaper than their consumer products. That said, this is really meant for enterprise use and not as a way for a home power user to save a few bucks on a half-dozen drives for their home NAS. You really need an infrastructure in place that can handle variable capacity drives seamlessly. While these drives do not employ SMR to get greater capacity, that may work out as a bonus, as writes can be performed in a way that all systems are currently compatible with (even though I suspect they will be tuned more for sequential write workloads).
Here's an illustration of this difference:
The 'old' method meant that drives on the left half of the above bell curve would have to be sold as 5TB units.
With the 'new' method, drives can be sold based on a spec closer to their actual capacity yield. For a given model, shipping capacities would increase as time goes on (top to bottom of the above graphic).
To further clarify what is meant by the term 'cold storage' - the data itself is cold, as in rarely if ever accessed:
Examples of this would be Facebook posts / images from months or years ago. That data may be rarely touched, but it needs to be accessible enough to be browsed to via the internet. The few second archival HDD spinup can handle this sort of thing, while a tape system would take far too long and would likely timeout that data request.