Subject: General Tech | September 15, 2013 - 06:30 PM | Tim Verry
Tagged: z87, Thunderbolt 2, sonnet, Intel, idf 2013, idf, gigabyte, asus, asrock, aja, 4k
Intel recently launched its next generation Thunderbolt 2 interface, and several devices using the new connection were shown off at the Intel Developer Forum. The major takeaway from Thunderbolt 2 is the increased bandwidth and benefits to video production houses working with large uncompressed media. Specifically, Thunderbolt 2 is a PCI-Express based external interface that sends both video output and data down a single cable. Upgrades over the original 10Gbps Thunderbolt standard include an updated to the DisplayPort 1.2 video standard and double the bandwidth to 20Gbps. Thanks to the increased bandwidth, Thunderbolt 2 enables simultaneous video output and video file transfer of 4K media. Video editors can watch and transfer 4K video to an DisplayPort-equipped monitor and external RAID array respectively.
Intel is kicking off the Thunderbolt 2 standard with the launch of its DSL5520 and DSL5320 Thunderbolt 2 controllers, which are already in the hands of device manufactures. In fact, there were quite a few bits of hardware being shown off at this years IDF that already support the new Thunderbolt 2 standard. Intel is expecting even more devices in 2014.
Professional video editing and workstation hardware with Thunderbolt 2
While consumer PC hardware will be supporting Thunderbolt 2, the new interface is most beneficial to professional users and IDF was the launch pad for several high end pieces of production gear. Sonnet launched the Echo Express III external PCI-E card chassis that allows users to hook up PCI-E cards to systems via Thunderbolt 2 (for example: video capture card or fast solid state storage). Also, AJA showed off a video/audio capture box called the IO 4K that supports daisy chaining other Thunderbolt 2 devices and acts as a video capture card capable of taking in 4K and UltraHD video sources as well as high end audio inputs. Finally, PROMISE Technology showed off its Pegasus2 RAID 5 enclosure and SANLink2 Thunderbolt 2 bridge device.
External boxes are not the only professional products with Thunderbolt 2 at IDF, however. The technology is also being integrated into workstations, including the Apple Mac Pro with six Thunderbolt 2 ports and HP’s new lineup of desktop workstations.
Z87 Motherboards With Thunderbolt 2
Thunderbolt 2 will also be used in consumer gear as well, including Z87 motherboards. Asus, AsRock, and Gigabyte all had motherboards on display that each featured two Thunderbolt 2 ports. The new interface will be available on the multiple boards from the manufacturers. German tech site ComputerBase.de posted several photos of Thunderbolt 2-equipped motherboards and gave a glimpse at the upcoming hardware.
The Asus Z87-Deluxe/Quad, an AsRock Z87 motherboard, and Gigabyte Z87X-UD5 TH spotted at IDF by ComputerBase.de.
Of note are the ASUS Z87-Deluxe/Quad, AsRock Extreme 11/ac, and Gigabyte Z87X-UD7 TH. All boards off LGA 1150 CPU sockets, four DDR3 DIMM slots, a slew of SATA 6Gbps ports, multiple PCI-E 3.0 x16 and x1 slots, and rich rear IO including two Thunderbolt 2 ports (naturally).
The AsRock Z87 Extreme 11/ac via ComputerBase.de.
The following chart breaks down the specifications. Unfortunately pricing and availability have not been announced for these boards, but expect to pay a premium for the high end gaming hardware and new Thunderbolt 2 controller. (The Asrock Extreme 11/ac in particular takes the word “high end” to the, well, extreme.)
|ASUS Z87-Deluxe/Quad||AsRock Extreme 11/ac||Gigabyte Z87X-UD7 TH|
|PCI-E 3.0 x16||3||4||5|
|PCI-E 3.0 x1||4||3||2|
|Audio||6 x analog, 1 x optical||5 x analog, 1 x optical||5 x analog, 1 x optical|
|Video out||1 x HDMI||1 x HDMI, 1 x DP||1 x HDMI, 1 x DVI|
|USB 3.0||6 (+4 USB 2.0)||6 (+2 USB 2.0)||6|
It is promising to see so many devices this early into Thunderbolt 2's launch, and the various high end motherboard using both Thunderbolt 2 and USB 3 gives consumers the best of both worlds and access to all manner of external peripherals. The bandwidth increase is certainly welcome, and I am interested to see what sorts of new devices it enables. For now, I think Thunderbolt 2 is going to be mainly a professional (or at least "pro-sumer") technology. With that siad, 4K capture and video output is already being worked on, and I am curious to see what other applications and technologies will really be able to push the new 20Gbps interface and what trickles down to the consumer space!
Are you excited about Thunderbolt 2? Let us know what you think of the IDF-launched products and the interface technology in general in the comments below!
Subject: General Tech | September 12, 2013 - 03:04 PM | Ken Addison
Tagged: video, quark, podcast, IVB-EP, ifa, idf 2013, idf, hawell-y, E5-2600, ddr4, Bay Trail
PC Perspective Podcast #268 - 09/12/2013
Join us this week as we discuss Intel Bay Trail Tablets, Intel's Quark SoC, and news from IFA and IDF
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
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Hosts: Jeremy Hellstrom, Josh Walrath, Allyn Malventano, and Morry Teitelman
Program length: 1:20:06
Week in Review:
News items of interest:
0:49:00 Quick IFA roundup
1:04:10 A Steamy family
Hardware/Software Picks of the Week:
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Subject: Mobile | September 11, 2013 - 08:36 PM | Ryan Shrout
Tagged: transformer t100, idf 2013, Bay Trail, atom z3740, asus
Last week at IFA 2013 I wrote about a new ASUS Transformer device called the Trio that combined a Haswell processor and Atom Z2760 Clover Trail CPU for a very interesting 3-scenario unit. It is definitely an interesting product worth reading about, but ASUS took some time tonight to announce another new Transformer Book: the T100.
The Transformer Book T100 is a 10.1-in ultraportable that can be used as either a standard notebook or as a stand alone tablet; exactly how previous Transformers have functioned. The design is sleek and light weight: 2.4 pounds for both sections and only 1.2 pounds in tablet only form.
Powering the T100 is the brand new Intel Atom Z3740 quad-core SoC (max burst rate of 1.8 GHz) based on the Bay Trail platform and Silvermont architecture. Earlier today we published our review of the Bay Trail processor and the performance improvements over Clover Trail are impressive and noticeable. Energy efficiency is also improved and ASUS claims that the T100 will get more than 11 hours of battery life.
The screen is an IPS panel with a resolution of 1366x768. It runs Windows 8.1 and includes USB 3.0 for accessories and external storage.
The ASUS Transformer T100 will sell for $349 with 32GB of storage and $399 with 64GB. For the kind of performance levels and platform flexibility we see with Bay Trail, the sub-$350 price point is very impressive. Will Android tablets start to take a hit with these low priced Windows options?
Being announced today along with the T100, the ASUS Transformer Book T300 is a larger version of the T100 but powered by Intel's 4th Generation Core processors, Haswell. The ultra-low voltage processor is the Core i5-4200U or 4500U, both of which are new dual-core variants with 15 watt TDPs. The 13.3-in screen has a 1920x1080 resolution while the hardware can include storage up to 256GB and DDR3 memory up to 8GB.
With a weight of 2.4 pounds when docked and 1.8 pounds in tablet form, the T300 is still able to muster a solid 8 hours of battery life.
I am going to have some hands on time with these notebooks / tablets very soon so stay tuned for more info!!
Subject: General Tech | September 11, 2013 - 01:30 PM | Jeremy Hellstrom
Tagged: Ivy Bridge-EP, xeon, xeon E5-2600 v2, idf 2013
A second coming of the Xeon E5-2600 family uses the Ivy Bridge-EP architecture and will sport up to 12 cores, using 22nm Trigate technology. The three CPUs which will be arriving are each aimed at a separate market segment with different core counts and TDP. The lower power chips will sport either 4 or 6 cores and have a TDP between 40-80W with the same 15MB L3 cache as SB-EP. The second has a 25MB L3 cache, 6, 8 or 10 cores and TDPs ranging from 70-130W and uses the same interconnects as previously existed. The last is the beast with 12 cores, TDPs of 115-130W and three rings linking the cores and cache segments with a split memory controller. Check The Register for more info on the high powered end of IDF.
"Companies with workloads that like to ride on lots of threads and cores are going to be able to get a lot more bang for a two-socket box thanks to the launch of the "Ivy Bridge-EP" Xeon E5-2600 v2 processors by Intel."
Here is some more Tech News from around the web:
- Intel reveals 14nm PC, declares Moore's Law 'alive and well' @ The Register
- Fujitsu femto boost promises to double LTE speeds @ The Register
Subject: Processors, Shows and Expos | September 10, 2013 - 02:47 PM | Ryan Shrout
Tagged: idf, idf 2013, Intel, keynote, live blog
We are preparing for the second day of keynotes at IDF so sign up below to get a reminder for our live blog! After the first keynote saw the introduction of Intel Quark SoCs, showcases of the first 14nm Broadwell processor and a 22nm LTE smartphone, day 2 could be even more exciting!
The event starts at 9am PT / 12pm ET on Wednesday the 11th!
Subject: Processors, Shows and Expos | September 10, 2013 - 02:31 PM | Ryan Shrout
Tagged: quark, Intel, idf 2013, idf
In a very interesting and surprising announcement at the first Intel Developer Forum keynote this morning, Intel's new CEO Brian Krzanich showed the first samples of Quark, a new SoC design that will enter into smaller devices that even Atom can reach.
Quark is the family name for the new line of SoCs that are open, synthesizable and support with industry standard software. An open SoC is simply one that will allow third-party IP integration with the processor cores while a synthesizable one can be moved and migrated to other production facilities as well. This opens up Intel to take Quark outside of its own fabrication facilities (though Krzanich said they would prefer not during Q&A) and allow partners to more easily integrate their own silicon with the Quark DNA. Intel had previously announced that Atom would be able to integrate with third-party IP but that seems to have been put on the back burner in favor of this.
Quark will not be an open core design in the same way that ARM's core can be, but instead Intel is opening up the interface fabric for direct connection to computing resources.
The Quark SoC is square in the middle
Krzanich showed off the chip on stage that is 1/5 the size of Atom and 1/10 the power levels of Atom (though I am not sure if we are referring to Clover Trail or Bay Trail for the comparison). That puts it in a class of products that only ARM-based designs have been able to reach until now and Intel displayed both reference systems and wearable designs.
UPDATE: Intel later clarified with me that the "1/5 size, 1/10 power" is for a Quark core against an Atom core at 22nm. It doesn't refer to the entire SoC package.
Intel hasn't yet told us what microarchitecture Quark is based on but if I were a betting man I would posit that it is related to the Silvermont designs we are looking at on Bay Trail but with a cut down feature set. Using any other existing design from Intel would result in higher than desired power consumption and die size levels but it could also be another ground up architecture as well.
I'll be poking around IDF for more information on Quark going forward but for now, it appears that Intel is firmly planting itself on a collision course with ARM and Qualcomm.
UPDATE 1: I did get some more information from Intel on the Quark SoC. It will be the first product based on the 14nm manufacturing process and is a 32-bit, single core, single thread chip based on a "Pentium ISA compatible CPU core." This confirms that it is an x86 processor though not exactly what CPU core it is based on. More soon!
Subject: General Tech | September 10, 2013 - 02:29 PM | Tim Verry
Tagged: Intel, idf 2013, idf, haswell, fanless, convertible tablet, Broadwell, 14nm
New Intel CEO Brian Krzanich took the stage at IDF 2013 to talk about Intel's future and the PC market. The CEO believes that there is more innovation in the PC than ever before as the company introduces new Haswell and Broadwell chips, new form factors are being experimented with, and Intel moves from traditional CPU to SoC type of architectures.
Two such chips that Intel showed off that are aimed at consumer PCs include a new Haswell-Y chip and the launch of a 14nm Broadwell SoC.
Haswell Y is an ultra low power variant of the Haswell processors that have been avaialble in desktops since June. This new chip is a 4.5W TDP chip that will enable fanless mobile devices such as laptops and slate tablets. The x86-64 chip will allow fanless mobiles that run Windows and should be a good bit more powerful than current Atom-powered Windows mobiles!
A fanless Haswell Y system.
In addition to Haswell Y, Intel is introducing a 14nm Broadwell SoC. The Broadwell chips will be used in both servers and consumer products in 2014.
The 14nm Broadwell SoC.
Interestingly, it looks like Intel is well on its way to shipping chips as Intel showed off a working laptop with the Broadwell chip at IDF today. Further, Intel announced that the Broadwell chips will be shipping by the end of the year!
A 14nm Broadwell-powered laptop.
Stay tuned to PC Perspective for more information!
Subject: General Tech, Mobile | September 10, 2013 - 01:38 PM | Tim Verry
Tagged: tablet, smartphone, LTE, Intel, idf 2013, idf, Bay Trail, 22nm
This year at the Intel Developer Forum, Intel is announcing a slew of new products. Among the fray is a sneak peek at some of the mobile devices that will be utilizing the company's Bay Trail Atom SoCs.
The first device Intel showed off was a small Lenovo branded tablet that is likely the Intel-powered alternative to the current ARM-powered S5000 that was announced at IFA 2013 in Berlin. The Intel powered tablet is using a Bay Trail Atom SoC.
The mysteriously specc'd Lenovo tablet is not the only kit to use Bay Trail, however. Intel claims that there will be a number of new tablets on the way, including models that will be available for under $100 in time for this holiday season. Of course, beyond that specs were not announced.
Intel also showed off a new prototype smartphone that is powered by a new 22nm SoC. Ryan speculates that the chip is an Intel Merrifield-based SoC which is a mobile architecure derived from Silvermont. The company claims that the move to a 22nm manufacturing process for these mobile chips results in a 50% battery life improvement. Impressive, if those numbers hold true!
The smartphone further features an LTE radio, and Intel shared a speed test of the LTE modem during the conference. Today, the smartphone uses LTE for data and 3G for voice calls, but by the end of the year products will be able to use the LTE radio for both data and voice connections.
Stay tuned to PC Perspective for more IDF good-ness as it develops!
Subject: Processors, Shows and Expos | September 10, 2013 - 11:02 AM | Ryan Shrout
Tagged: live blog, keynote, Intel, idf 2013, idf
UPDATE: You can see the replay of our live blog below from Day 1 of IDF but be sure you head over to the Day 2 Live Blog page to set a reminder! Join us on Wednesday at 9am PT / 12pm ET!!
Today is the beginning of the 2013 Intel Developer Forum in San Francisco! Join me at 9am PT for the first of three live blogs of the main Intel keynotes where we will learn what direction Intel is taking on many fronts!
Subject: General Tech | July 25, 2013 - 01:52 PM | Jeremy Hellstrom
Tagged: Intel, idf 2013
DigiTimes wrangled up some information on part of the upcoming IDF, a teaser on Intel's expected mobile announcements. Intel powered smartphones developed with Lenovo, ZTE, Acer and Asustek Computer will be on display though it is unclear what processor will be inside, it is unlikely to be the 22nm Merrifield as that is still months away but you never know with Intel. Wearable computing, voice recognition and gesture controllers will also be making an appearance so Ryan should have an interesting trip again this year.
"Intel is set to host Intel Developer Forum (IDF) 2013 in San Francisco, the US from September 10-12 to further discuss its 2-in-1 device plans as well as its latest progress in Android smartphone and tablet development, according to sources from the upstream supply chain."
Here is some more Tech News from around the web:
- Google Nexus 7 (2013) vs Apple iPad Mini specs comparison @ The Inquirer
- Flash slab lab blab: NVMe-friendly PCIe spotted on HGST's cards @ The Register
- Windows 8 Beats Ubuntu Linux For Intel "Haswell" OpenGL Performance @ Phoronix