Subject: Cases and Cooling | February 22, 2017 - 01:04 AM | Tim Verry
Tagged: Wraith, ryzen, hsf, AMD Wraith, amd
Information recently leaked online detailing how AMD will package its retail Ryzen offerings. In addition to the usual processor-only trays for OEMs and system integrators, AMD will offer retail boxed Ryzen processors with a basic HSF (heatsink-fan), circular 95W Wraith Spire cooler, 140W Wraith Max HSF depending on the processor as well as CPU-only boxes of the X-series (e.g. Ryzen 7 1700X) processors for enthusiasts looking to choose their own air or liquid cooler.
Image via Informtica Cero.
TechPowerUp is reporting that a basic cooler similar to AMD’s pre-Wraith style of heatsinks will be packaged with the lower end Ryzen 3 and Ryzen 5 chips – mainly the 65W models. Moving up the processor lineup, the non-X Ryzen 5 and Ryzen 7 processors (up to Ryzen 7 1700) will be bundled with a new “Wraith Spire” cooler that sports a circular design with curved aluminum fins and an (approximately) 80mm fan. This new HSF is rated at 95W and measures 109mm x 103mm x 54mm and is allegedly engineered to be a low noise cooling solution.
Stepping things up a notch, the “Wraith Max” is a tweaked FX-era Wraith cooler (horizontal boxed design with a single fan) that can handle up to 140W processors and has been designed with noise levels in mind while not sacrificing too much performance. It measures 105mm x 108mm x 85mm so it is a fair bit taller than the Wraith Spire. This cooler will come with the higher end eight core Ryzen chips such as the Ryzen 7 1700X and 1800X.
The X variants will also be available in WOF (without fan-heatsink) packages that come in retail boxes but without any heatsink. These WOF packages should come in a bit cheaper than the processor+HSF multipacks and will be ideal for users wanting to use liquid cooling or a higher end air cooler for overclocking.
Thanks to previous leaks that have revealed the box art, AMD will be clearly marking the retail packages to show which cooler is coming with which processor. Further, XFastest has posted images of the basic Ryzen (non-Wraith) heatsink, and you can see (albeit tiny) images of the Wraith Spire and Wraith Max in the leaked table (above, from Informatica Cero).
Sebastian seemed to be very impressed by the original Wraith cooler where he found it to be a significant improvement over AMD’s previous OEM designs and able to match the Hyper 212 Evo in cooling performance (though the Wraith couldn’t quite match it in noise levels due to its smaller fan). So long as AMD maintains quality control and builds on the previous Wraith’s strengths (and hopefully larger fans, at least on the Max), they should be good little coolers. I am interested to see the new Wraith coolers in detail and how well they perform. I suspect many readers will be opting for the CPU-only packages, but for those readers that just want a simple bundled cooling solution I hope the Wraith Spire and Wraith Max turn out to be good deals.
- AMD Wraith CPU Cooler Review: Cool and Quiet
- Report: Leaked AMD Ryzen 7 1700X Benchmarks Show Strong Performance
Subject: Cases and Cooling | July 4, 2016 - 02:11 AM | Tim Verry
Tagged: Skylake, passive cooling, kinetic cooling, kinetic cooler, hsf, coolchip
Early last year startup CoolChip Technologies partnered with Cooler Master to show off a prototype kinetic cooler at CES 2015. The two companies were allegedly working on a new processor heatsink that would be priced in line with current heatsink + fan designs but would be smaller, quieter, and less prone to collecting dust! Unfortunately that revolutionary HSF product never materialized (just like the Sandia Labs prototype), and while we may still see that cooler some day it appears like it is not going to be anytime soon. With that said, it is not all bad news for fans of these promising processor coolers, because if a recent social media tease by the startup is any indication CoolChip technologies has decided to move forward with its own branded kinetic cooler!
Specifically, CoolChip teased a new and upcoming product launch aimed at cooling Intel Skylake CPUs with up to 70W TDPs. Along with the statement that the kinetic cooler is “coming soon!” the company posted three images of the new cooler, and it looks awesome.
Resembling something a Predator might be using to cool their PC, the CoolChip cooler has a stationary base plate with a motor that spins a small array of fins in a manner that facilitates heat transfer from the base plate to the spinning heatsink (which is in lieu of a fan -- the heatsink is the fan) via a very thin layer of air that keeps the heatsink balanced as well. That spinning heatsink portion is then further surrounded by stationary rings of fins likely connected to the base plate using heatpipes for that extra bit of cooling potential. The inner impeller (vertical) fins are angled one direction while the outer stationary ring of horizontal fins are angled the opposite direction. The impeller pulls cool air in and pushes it outwards through the stationary fins and out into the case where case fans will then exhaust that hot air out of the case. CoolChips has an animated illustration of how this impeller design cools versus a traditional heatsink and fan design which is available on their website.
Other features of the small kinetic cooler include a braided cable with fan header to get power from the CPU_Fan header on the motherboard. It is not clear if this connector is 4 pin and supports PWM or not though. One of the more promising bits of this teaser is the photo of the cooler in retail packaging which adds at least a little bit of credence that we might actually see this product launch at some point. The package appears to include the 1U Low Profile Kinetic Cooler itself, a motherboard backplate, and a small tube of thermal paste (TIM).
Possibly the coolest (heh) part of this teased product is the third photo which suggests that there will be multiple color options for the impeller which would allow users to customize the heatsink color to match their PC’s design scheme.
You can check out the post for yourself here. I am really excited to finally see new information on kinetic cooling, and this CoolChip cooler in particular looks really interesting and I hope that it actually materializes and I can finally read some reviews on it! What are your thoughts on kinetic cooling for PCs?
- CoolChip Technologies and Cooler Master Show Kinetic Cooling - CES 2015 [Video]
- The fanless heatsink: Silent, dust-immune, and almost ready for prime time @ ExtremeTech
Subject: Cases and Cooling | July 20, 2013 - 02:03 AM | Tim Verry
Tagged: v8 gts, Intel, hsf, cpu cooler, cooler master, amd
Cooler Master has unveiled a massive CPU cooler called the V8 GTS. The new high end air cooler measures 154 x 140 x 153.5mm and weighs 1.9 pounds. It combines a horizontal vapor chamber, eight heat pipes, triple aluminum fin stacks, and two shrouded PWM fans with red LEDs.
The V8 GTS is compatible with both Intel and AMD CPU sockets, including LGA 775, 1150 1155, 1156, 1366, and 2011 on the Intel side and AM2, AM3, AM3+, FM1, and FM2 on the AMD side. A horizontal vapor chamber is used for the CPU baseplate to effectively move heat away from the processor an into the heatpipes.
Eight 6mm heat pipes further transfer heat to three total aluminum fin stacks. Further, two 140mm PWM-controlled fans move cool air across the fins to facilitate cooling high end and overclocked processors. The fans can spin between 600 and 1,600 RPM and are rated for between approximately 28 and 82 CFM respectively.
Other features of the Cooler Master V8 GTS include red LEDs and a black shroud. The cooler is designed to allow plenty of room for clearance around the RAM area to allow for memory with heatspreaders to be used. It is rated to be able to cool up to 250W. It may be rather heavy and may or may not be a hemi, but it certainly looks cool (heh)!
The CM V8 GTS is model number RR-V8VC-1GPR-R1 and comes with a 2 year warranty. Cooler Master has not yet detailed pricing or availability. In the meantime, Hardware Secrets managed to get their hands on the massive cooler to put its performance to the test.
Subject: Cases and Cooling | June 10, 2013 - 11:54 AM | Tim Verry
Tagged: streacom db4, streacom, hsf, Fanless PSU, fanless, cpu cooler
Streacom recently showed off a new cube-shaped case called the DB4. The new case measures 250 x 250 x 250mm (a bit under 10 inches cubed) and doubles as a passive heatsink for internal components.
The Streacom DB4 is a large cube with vertical finned sides that is held aloft by a thin angled bar. The case is intended to be used as the base for a passively cooled desktop PC. Each side of the cube-shaped DB4 case can cool 65W TDP parts, for a total cooling potential of 260W. In addition to being able to cool processors and low-end graphics cards passively, the case also cools the bundled ZeroFlex 250W fanless power supply.
Unfortunately, Streacom is not showing off the internals or detailing how the PC components are connected to the side(s) of the case. When asked for details by Fanless Tech, Streamcom responded that "we will reveal the internal alyout after all patents are through."
Streacom expects to have the case available for sale sometime between late September or early October for 200 Euros. This is a neat case that is not only fanless, but a work of art. I could see myself using this. What do you think about the Streacom DB4?
Subject: Cases and Cooling | April 26, 2013 - 12:30 AM | Tim Verry
Tagged: noctua, nh-l9a, hsf, cooler, mini-itx, low profile cooler
Noctua, an Austrian company known for its high-end air CPU coolers has announced that it will be offering up alternatvie mounting kits to users of its low profile NH-L9a cooler that have incompatible motherboards. Certain mini-ITX motherboards that place components on the back of the motherboard around the processor socket are incompatible with the company’s existing SecureFirm 2 mounting kit because the backplate cannot be installed.
The new alternative mounting system for the NH-L9a CPU cooler uses Noctua’s NM-APS3 spacers that go in place of the standard backplate. The spacers go in between the motherboard and screws, but are small enough to not run into any components installed in the area normally reserved for a CPU backplate. Two such boards that Noctua has found to be incompatible are the mini-ITX AsRock FM2A75M-ITX and AsRock FM2A85X-ITX.
Users with an incompatible motherboard and NH-L9a cooler can obtain the alternative mounting kit for free by contacting Noctua’s customer service line and providing them with a proof of purchase (scan, photo, or electronic invoice) receipt for both the Noctua cooler and an incompatible motherboard. Additionally, Noctua will be including both the standard SecureFirm 2 and alternative mounting kits in the retail NH-L9a cooler box from now on.
It is nice to see Noctua continuing its tradition of good customer care. They many not be as popular as other cooler vendors in the US but it seems they are a company willing to go the extra mile for its enthusiast customers.
Subject: Cases and Cooling | April 10, 2013 - 06:53 AM | Tim Verry
Tagged: slimhero, hsf, Gelid, fm2, cpu cooler, 1155
Hong Kong-based PC cooling company GELID Solutions launched a new low-profile CPU cooler yesterday called the SlimHero. The new SlimHero cooler joins the existing Silent HSF series, and is a mere 59mm high.
The low profile cooler measures 131 x 123 x 59mm including the fan and weighs 352g. The SlimHero cooler features four copper heatpipes connecting a copper block to a horizontal aluminum fin array. A 120mm fan is then mounted on top of the heatsink to push cool air over the fins and VRM area surrounding the processor. It is rated to cool processors up to 136 TDPs and is compatible with all of Intel and AMD's latest consumer sockets. On the AMD side, the cooler can be mounted in one of four directions on AM2, AM2, AM3, AM3+, FM1, and FM2.Further, it is compatible with Intel's LGA 775, 1156, 1366, and 1155 sockets.
The heatsink comes bundled with a 120mm fan and GC-2 thermal compound. The fan is PWM controlled and can spin at anywhere between 750 and 1600 RPM. GELID rates the 120mm fan at 52.4 CFM and 12-25.4 dBA.
The new cooler is designed to work with small form factor systems without getting in the way of RAM or VRM heat-spreaders. It comes with a 5 year warranty and is available now for an MSRP of $32 USD (25 EUR).
Subject: General Tech | March 20, 2013 - 12:05 AM | Tim Verry
Tagged: noctua, lga 1150, hsf, heatsink, haswell, cpu cooler
Noctua has recently announced that the company is providing free mounting kits to owners of existing coolers to make them compatible with Intel's latest LGA 1150 (Haswell) motherboards. The new NM-i115x mounting kit will allow enthusiasts to recycle their older Noctua coolers with the new platform without issue. The kit includes a new back plate with fixed struts and the necessary connectors (screws, springs, et al) to make alignment and mounting easier than previous setups.
Because the LGA 1150 socket keeps the same mounting hole spacing as the current LGA 1156 and LGA 1155 sockets, many newer Noctua cooler will not need the mounting kit upgrade, and can simply be installed into the Haswell machine as is. In other words, if the heatsink worked with your Lynnfield, Sandy Bridge, or Ivy Bridge-based system, it will work in a Haswell system as well. According to Noctua, the following coolers are already compatible with Haswell:
NH-C14, NH-D14, NH-C12P SE14, NH-L12, NH-L9i, NH-U12P SE2, NH-U9B SE2
If your cooler was released prior to LGA 1156, you will need to grab the NM-i115x mounting kit upgrade by filling out this form. Noctua will make the kit available on its website as well as in retail stores (for a minimal charge, though the company did not provide specific pricing). You will need to provide proof of purchase for your existing cooler by sending Noctua a scan or screenshot of your invoice or receipt.
For more information on the NM-i115x, head over to the Noctua product page.
It is nice to see Noctua standing behind its products like this, even if it only affects a small number of users that will be making the jump for LGA 775/ect to LGA 1150.
Subject: Cases and Cooling | December 1, 2012 - 10:18 PM | Tim Verry
Tagged: vapor-x, sapphire, hsf, cpu cooler, cooling
Sapphire, a popular graphics card add-in-board partner in the US recently announced a new product that strays from the norm. Called the Vapor-X, it is a new tower-style CPU cooler aimed at enthusiasts.
The new cooler has the Vapor-X designation because it uses the company’s vapor chamber heatsink technology to take heat away from the processor into an aluminum fin array. The vapor chamber makes contact with the CPU, and from there four 7mm heatpipes transfer heat to the aluminum fins where two 120mm fans and a black plastic shroud channel cool air through. The fans are rated at 77 CFM and a maximum of 40 dBA. Both fans have variable (PWM) speeds from 495 to 2200 RPM.
The Vapor-X heatsink has a gross weight of 1524.8 grams (approximately 3.4 pounds) including the fans. Dimensions are 135 x 110.4 x 163.5mm, and it is designed to work within the constraints of the LGA 2011 socket without limiting you to low profile memory modules.
Unfortunately, Sapphire does not list a TDP rating for this heatsink, but it is aimed at high end processors with support for the following processor sockets:
- AMD: FM1, FM2, AM2, AM2+, AM3, AM3+
- Intel: LGA 1366, LGA 1155, LGA 1156, LGA 775
While it has yet to show up at Newegg, it is reportedly on its way with a MSRP of $69.99. You can find more photos and specifications on Sapphire's product page.
My first major gaming graphics card was from Sapphire, so it is neat to see the company taking its graphics card cooling expertise and applying it to CPUs. The reviews should be interesting – particularly whether the shroud really helps to lower temps.
Subject: General Tech | November 26, 2012 - 01:00 AM | Tim Verry
Tagged: thermalright, sb-e 2x, hsf, heatsink, cpu cooler
Thermalright has announced a new tower CPU cooler called the Archon SB-E 2X. The new heatsink is a slim tower design, which is designed to not infringe on the RAM slots or PCI-E expansion slots. It measures 170mm x 155mm x 53mm and weighs just over 1.7 pounds (775 grams).
The heatsink itself is 53mm wide. The aluminum fins are attached to the baseplate using eight 6mm copper heatpipes. The contact plate and heatpipes are nickel plated with a mirror finish on the area that makes contact with the processor.
Thermalright is bundling the HSF with two of its silent-series TY-141 140mm fans. The fans are rated at 73.5 CFM and 21 dBA. Using PWM, the fans will spin anywhere between 900 and 1300 RPM. Including the two fans, the heatsink is 79.5mm wide. Thermalright claims that the heatsink will fit on LGA 2011 platforms without touching the RAM slots, however.
The new heatsink uses Thermalright’s VX BTKII mounting system that allows pressure to be adjusted. It supports the LGA 2011, 1366, 1155, 1156, and 775 Intel sockets and the AMD FM1, AM3+, AM2+, AM2, and 939 sockets.
While there is no specific release date mentioned on the Thermalright website, it should be available soon. The Archon SB-E 2X will have an MSRP of $99.95 USD. At that price, it is putting itself into closed-loop watercooling territory. It will be interesting to see how well it performs and stacks up to coolers like the H80 and Noctua DH-14.
Subject: Cases and Cooling | November 15, 2012 - 10:19 AM | Tim Verry
Tagged: zalman, Passive, hsf, cpu cooler
Images have emerged on the Internet of a new cooler coming from Zalman sometime next year. In a brief mention from Zalman, the company named the new passive CPU heatsink as the FX-100. The cube of fins are aligned in a cross, or +, shape and combined with shrouding at the corners, Zalman has created a hollow cube. At the top is a hexagonal-mesh grill. The base-plate is connected to the fin array by four copper heatpipes. The fins are nickel plated and are black pearl in color.
It is designed to be run in fan-less configurations, and Zalman is stating that it will not draw dust as well. The fan-less cube cooler is currently listed as a CES 2013 honoree, so here’s hoping it launches soon and lives up to the claims.
There are no details on pricing, availability or the TDP ratings it is designed to cool yet.
What do you think of the Zalman FX-100 passive cube?