Computex 2017: ASUS Announces Prime and TUF Intel X299 Motherboards

Subject: Motherboards | May 30, 2017 - 08:00 AM |
Tagged: x299, VROC, skylake-x, raid, NVMe, LiveDash, kaby lake-x, Intel, HEDT, computex 2017, asus, 802.11ad

Alongside the announcement of Intel's Core i9 Skylake-X and Kaby Lake-X CPUs, ASUS has unveiled details of their X299 motherboards. While we've already taken a look updates to the Republic of Gamers line of products, ASUS also released details about their "Prime" and "TUF" X299 products.

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ASUS PRIME

The Prime line of motherboards from ASUS are their entry-level options for any given platform. However just because they are the lowest cost boards doesn't mean that they are lacking in features.

All X299 Prime motherboards feature 3-way SLI thanks to the additional PCIe lanes available in the X299 platform (supported 44 lane CPUs are required). These available x16 slots are all reinforced with ASUS SafeSlot technology to help prevent heavy GPUs from damaging your motherboard.

The new Prime motherboards also feature the Realtek S1220A which we first saw on ASUS's Z270 products. ASUS claims that the S1220A paired with high-quality audio components on board help produce an onboard sound that rivals some dedicated sound cards.

Additionally, all X299 boards feature RGB LED headers with Aura Sync compatibility for maximum customizability. 

For the storage-focused, Intel VROC technology found on ASUS's X299 boards will allow for high-speed M.2 NVMe SSD RAIDs without being bottlenecked by chipset bandwidth, unlike on the Z270 platform.

Though the use of an add-in card users will be able to RAID multiple M.2 SSDs into a bootable array, utilizing full bandwidth from the available CPU PCIe lanes. ASUS even says that you can link multiple of these VROC cards together! 

In addition to these features, the Prime X299-Deluxe adds some very exciting features

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Wireless networking has seen an enhancement with the adoption of integrated 802.11ad Wi-Fi. This brand new wireless technology capable of 4.6Gbps transfer speeds uses spectrum in the 60Ghz range. While these high-speed radio waves cannot penetrate surfaces like walls, for applications like super fast file transfer between PCs in one room, or high-quality video streaming to wireless displays this should be ideal.

Along with Intel VROC support, the Prime X299-Deluxe has dual onboard M.2 Slots and a single U.2 Slot for high-speed storage options.

The new LiveDash display is a small OLED panel on the motherboard that allows you to display system statistics as well as custom animations and text for additional customization.

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In addition to the features on the motherboard, ASUS is including their ThunderboltEX 3 expansion card with the Prime X299-Deluxe so that owners can utilize Thunderbolt 3 technology with up to 40Gbps of bandwidth.

ASUS TUF X299

The TUF line has always been focused on ultimate reliability and durability. This is accomplished with high-quality components and more stringent testing standards than other products. 

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The ASUS TUF X299 Mark 1 is the all-new flagship motherboard for the TUF line. Redesigned Thermal Armor design helps to streamline airflow across the motherboard while also providing cooling to the onboard M.2 slot.

The Fortifier backplate uses a carefully shaped metal plate to stiffen the board to prevent warping. A removable GPU holder is also supplied to help support the weight of heavy graphics cards.

The new version of ASUS TUF Detective software allows users to perform diagnostics wirelessly over an included USB Bluetooth adapter rather than depending on a wired connection like the previous implementation.

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The TUF X299 Mark 2 removes the Thermal Armor and Fortifier, but retains all of the great reliability and durability aspects of the TUF Mark 2,

ASUS Prime X299-Deluxe, Prime X299-A and TUF X299 Mark 1 motherboards will be available at leading resellers in North America starting in late June

Source: ASUS

AMD's 16-Core Ryzen Threadripper CPUs Coming This Summer

Subject: Processors | May 16, 2017 - 07:22 PM |
Tagged: Zen, Threadripper, ryzen, processor, HEDT, cpu, amd

AMD revealed their entry into high-end desktop (HEDT) with the upcoming Ryzen "Threadripper" CPUs, which will feature up to 16 cores and 32 threads.

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Little information was revealed along with the announcement, other than to announce availablility as "summer 2017", though rumors and leaks surrounding Threadripper have been seen on the internet (naturally) leading up to today's announcement, including this one from Wccftech. Not only will Threadripper (allegedly) offer quad-channel memory support and 44 PCI Express lanes, but they are also rumored to be released in a massive 4094-pin package (same as "Naples" aka EPYC) that most assuredly will not fit into the AM4 socket.

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Image credit: Wccftech

These Threadripper CPUs follow the lead of Intel's HEDT parts on X99, which are essentially re-appropriated Xeons with higher clock speeds and some feature differences such as a lack of ECC memory support. It remains to be seen what exactly will separate the enthusiast AMD platform from the EPYC datacenter platform, though the rumored base clock speeds are much higher with Threadripper.

Source: AMD

Report: Intel Broadwell-E Flagship i7-6950X a 10 Core, 20 Thread CPU

Subject: Processors | November 13, 2015 - 06:40 PM |
Tagged: X99, processor, LGA2011-v3, Intel, i7-6950X, HEDT, Haswell-E, cpu, Broadwell-E

Intel's high-end desktop (HEDT) processor line will reportedly be moving from Haswell-E to Broadwell-E soon, and with the move Intel will offer their highest consumer core count to date, according to a post at XFastest which WCCFtech reported on yesterday.

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Image credit: VR-Zone

While it had been thought that Broadwell-E would feature the same core counts as Haswell-E (as seen on the leaked slide above), according to the report the upcoming flagship Core i7-6950X will be a massive 10 core, 20 thread part built using Intel's 14 nm process. Broadwell-E is expected to provide an upgrade to those running on Intel's current enthusiast X99 platform before Skylake-E arrives with an all-new chipset.

WCCFtech offered this chart in their report, outlining the differences between the HEDT generations (and providing a glimpse of the future Skylake-E variant):

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Intel HEDT generations compared (Credit: WCCFtech)

It isn't all that surprising that one of Intel's LGA2011-v3 processors would arrive on desktops with 10 cores as these are closely related to the Xeon server processors, and Haswell based Xeon CPUs are already available with up to 18 cores, though priced far beyond what even the extreme builder would probably find reasonable (not to mention being far less suited to a desktop build based on motherboard compatibility). The projected $999 price tag for the Extreme Edition part with 10 cores would mark not only the first time an Intel desktop processor reached the core-count milestone, but it would also mark the lowest price to attain one of the company's 10-core parts to date (Xeon or otherwise).