Introduction and Motherboard Layout
For the launch of the Intel H370 chipset motherboards, GIGABYTE chose their AORUS brand to lead the charge. The AORUS branding differentiates the enthusiast and gamer friendly products from other GIGABYTE product lines, similar to how ASUS uses the ROG branding to differentiate their high performance product line. The H370 AORUS Gaming 3 WIFI is among GIGABYTE's intial release boards offering support for the latest Intel consumer chipset and processor lines. Built around the Intel H370 chlipset, the board supports the Intel LGA1151 Coffee Lake processor line and Dual Channel DDR4 memory running at up to 2667MHz speeds. The H370 AORUS Gaming 3 WIFI can be found in retail with an MRSP of $139.99.
The HS370 AORUS Gaming 3 WIFI motherboard features a black PCB with black and chrome colored heat sinks covering all the necessary board components. The AORUS series logos are emblazoned on the chipset heat sink and the rear panel cover. Further, a large rendering of the logo is silk-screened in the upper left quadrant of the board. The ATX form factor provides more than enough surface area to house the integrated features, as well as giving the board compatibility with most available consumer enclosures.
The board's back is completely free of components, posing no problems with case mounting or mounting the CPU backplate.
GIGABYTE designed the H370 AORUS Gaming 3 WIFI motherboard with a 10-phase digital power system in an 8+2 configuration. The CPU VRMs are passively cooled by dual aluminum heat sinks above and to the upper right of the CPU socket.