FMS 2017: Intel's EDSFF 'Ruler' SSD Form Factor Details Emerge - 1 Petabyte in a 1U Chassis!

Subject: Storage, Shows and Expos | August 9, 2017 - 09:19 PM |
Tagged: FMS 2017, ssd, S4600, S4500, ruler, pcie, NVMe, Intel, EDSFF

Yesterday we saw Samsung introduce their 'NGSFF' form factor during yesterday's keynote. Intel has been at work on a similar standard, this one named EDSFF (Enterprise & Datacenter Storage Form Factor), with the simpler working name as 'Ruler', mainly because it bears a resemblance:

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Note that the etching states P4500 Series. P4500 was launched a couple of days ago and is Intel's next generation NVMe PCIe Datacenter SSD. It's available in the typical form factors (U.2, HHHL), but this new Ruler form factor contains the exact same 12 channel controller and flash counts, only arranged differently.

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SFF-TA-1002 connector (aka 'Gen-Z'), shown next to an AA battery for scale. This connector spec is electrically rated for speeds up to 4th and 5th generation PCIe, so future proofing was definitely a consideration here. In short, this is a beefed up M.2 style connector that can handle more throughput and also has a few additional pins to support remote power and power-loss-protection (capacitors outside the Ruler), as well as support for activity LEDs, etc.

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Here is a slide showing the layout of the Ruler. 36 flash packages can be installed, with the possibility of pushing that figure to 42.

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Thermals were a main consideration in the design, and the increased surface area compared to U.2 designs (with stacked PCBs) make for far cooler operation.

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Intel's play here is fitting as much flash as possible into a 1U chassis. 1PB in a 1U is definitely a bold claim, but absolutely doable in the near future.

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I'll leave you with the quick sniper shot I grabbed of their demo system. I'll be posting more details on the P4500 and P4600 series products later this week (remember, same guts as the Ruler), so stay tuned!

FMS 2017: Samsung Announces QLC V-NAND, 16TB NGSFF SSD, Z-SSD V2, Key Value

Subject: Storage, Shows and Expos | August 8, 2017 - 05:37 PM |
Tagged: z-ssd, vnand, V-NAND, Samsung, QLC, FMS 2017, 64-Layer, 3d, 32TB, 1Tbit

As is typically the case for Flash Memory Summit, the Samsung keynote was chock full of goodies:

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Samsung kicked off by stating there are a good 5 years of revisions left in store for their V-NAND line, each with a corresponding increase in speed and capacity.

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While V-NAND V4 was 64-layer TLC, V5 is a move to QLC, bringing per die capacity to 1Tbit (128 GB per die).

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If you were to stack 32 of these new V5 dies per package, and do so in a large enough 2.5" housing, that brings the maximum capacity of such a device to a whopping 128TB!

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Samsung also discussed a V2 of their Z-NAND, moving from SLC to MLC while only adding 2-3 us of latency per request. Z-NAND is basically a quicker version of NAND flash designed to compete with 3D XPoint.

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M.2 SSDs started life with the working title of NGFF. Fed up with the limitations of this client-intended form factor for the enterprise, Samsung is pushing a slightly larger NGSFF form factor that supports higher capacities per device. Samsung claimed a PM983 NGSFF SSD will hold 16TB, a 1U chassis full of the same 576TB, and a 2U chassis pushing that figure to 1.15PB.

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Last up is 'Key Value'. This approach allows the flash to be accessed more directly by the application layer, enabling more efficient use of the flash and therefore higher overall performance.

There were more points brought up that we will be covering later on, but for now here is the full press release that went out during the keynote: (after the break)

FMS 2017: Micron Launches 9200 Series Enterprise Lineup with 3D TLC NAND, x8 PCIe

Subject: Storage, Shows and Expos | August 8, 2017 - 12:02 PM |
Tagged: U.2, pcie, NVMe, micron, HHHL, FMS 2017, 9200, 3d nand

We were extremely impressed with the Micron 9100 Enterprise SSDs. They are still the fastest NAND flash SSDs we've tested to date, but they were built on planar NAND, and we know everyone is replacing their flat flash with more cost efficient 3D NAND. Same goes for the 9200:

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Highlights for the new models are IMFT 3D NAND running in TLC mode and a new controller capable of PCIe 3.0 x8 (HHHL form factor only - U.2 is only a x4 interface). Here are the detailed specs:

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Improvements for the x4 models are marginal upgrades over the 9100, but the x8 variants bump up the maximum performance to 900,000 IOPS and 5.5GB/s! These should be shipping by the end of the month, and we will review them as they come in.

Press blast after the break