TSMC finds Samsung to be a competing Foundry

Subject: General Tech | January 19, 2012 - 11:51 AM |
Tagged: TSMC, Samsung, fab

When thinking of foundries one first tends to think of Intel, TSMC and GLOBALFOUNDRIES, but from what TSMC's Chairman revealed yesterday you might start thinking about the Fab 4 instead.  Samsung have been making DRAM and NAND memory for quite a while now as anyone who has inspected their DIMMs or SSD is well aware and their hard drive business is well known.  What has not been in enthusiasts' minds is the System LSI (Large Scale Integration), component of Samsung which designs logic chips for cellphones, SOCs, sensors and many other low powered tasks. 

While TSMC remains much larger than the System LSI portion of Samsung but TSMC feels that Samsung could become a major competitor over the coming year.  TSMC's product lines certainly do overlap some of Samsung's currently and there are new projects in the work that TSMC sees as vulnerable.  DigiTimes specifically mentions the TSV chips powering 3D TVs and the possibility of competition when Apple looks to source the 3D TVs they will be adding to the set top boxes they currently sell.

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"Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest contract chipmaker, has now identified Samsung Electronics as a potential and formidable competitor in the market in which it still controls a dominant share.

During a Q&A session at TSMC's investors meeting on January 18, Morris Chang, TSMC chairman and CEO, said that Samsung will substantially expand what it calls the System LSI division. In addition to servicing its clients, the business also plays a major role in supplying Samsung's own-brand system products such as smartphones and tablets with logic chips, Chang indicated."

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Source: DigiTimes

Good news from TSMC, their new 12 inch Fab is ahead of the game

Subject: General Tech | May 6, 2011 - 12:35 PM |
Tagged: fab, TSMC, 12, inch

At 10 million 8-inch equivalent wafers produced in 2010 and an expected 20 million by 2015 it is a good thing that not only is TSMC not having major production issues anymore but it also ahead schedule with the setup of Fab 15, which will be producing 28nm chips on 12 inch wafers.  Moving from 8 to 12 inches should also mean less cost per chip, though whether the savings will be absorbed by the costs of the new fab or if they will be passed straight on to the consumer is a question that cannot be answered until summer next year when they expect to get production capacity up to full speed.  DigiTimes has the scoop here.

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"Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products slated for the fourth quarter of 2011, according to the foundry.

TSMC previously said it would begin moving equipment into the facility in June, and expected volume production to kick off in the first quarter of 2012.

Pilot runs at the phase 1 facility of Fab 15 are expected to start in the third quarter of 2011, following by volume production in the fourth quarter, said Jason Chen, senior VP of worldwide sales and marketing for TSMC, at a company event held on May 5. With new capacity coming online, TSMC will see its combined 12-inch capacity top 300,000 units a month."

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Source: DigiTimes