Subject: General Tech | February 23, 2019 - 03:08 PM | Tim Verry
Tagged: TSMC, lithography, euv, asml, 7nm, 5nm
According to Hexus, chip manufacturing giant TSMC will begin mass production of its enhanced 7nm process node as soon as next month. The new "CLN7FF+, N7+" mode incorporates limited use of EUV (extreme ultraviolet lithography) on four non-critical layers using specialized equipment from ASML to offer 20% higher transistor density and between six to twelve percent lower power consumption at the same complexity/frequency. Those numbers are versus TSMC's current 7nm process node (CLN7FF, N7) which uses DUV (deep ultraviolet lithography) with ArF (Argon Fluoride) excimer lasers.
TSMC is reportedly buying up slightly more than half of ASML's production of EUV equipment for 2019 with the chip maker reserving 18 of the 30 EUV units that will ship this year. It will use the ASML Twinscan NXE step and scan machines to produce its enhanced 7nm node and allow TSMC to familiarize themselves with the technology and dial it in for use with its upcoming 5nm node (and beyond) which will more heavily incorporate EUV with it being used on up to 14 layers of the 5nm process node manufacturing. AnandTech reports that the 5nm EUV node will bring 1.8-times the transistor density (45% area reduction) of the non-EUV 7nm node along with either 20% less power usage or 15% more performance at the same chip complexity and frequency.
Interestingly, while 7nm production accounted for roughly 9% of TSMC's output in 2018, it will reportedly be up to a quarter of all TSMC's chip shipments in 2019.
Mass production of the 7nm EUV node will begin as soon as March with risk production of 5nm chips slated to being in April with the first chip designs being taped out within the first half of the year. Volume production of 5nm chips is not expected until the first half of 2020, however, though that would put it just in time for AMD's Zen 2+ architecture. Of course, AMD, Apple, HiSilicon, and Xilinx are TSMC's big customers for the current 7nm node (especially AMD who is using TSMC for its 7nm CPU and GPU orders), and Huawei / HiSilicon may well be TSMC's first customer for the EUV incorporating CLN7FF+, N7+ node.
With GlobalFoundries backing off of leading-edge process techs and shelving 7nm, Intel and Samsung are TSMC's competition in this extremely complicated and expensive space. 2020 and beyond are going to be very interesting as EUV production ramps up and is pushed as far as it can go to bring process technologies as close to the theoretical limits that the market will bear. I think we still have a good while left for process shrinks, with some of these lower node numbers being attributed to marketing (with some elements being that small but depending on what and how they measure these nodes) but it is definitely going to get expensive and I am curious who will continue on and carry the ball to the traditional manufacturing process finish line or if we will need some other exotic materials or way of computing paradigm shift to happen before we even attempt to get there simply due to unrealistic R&D and other costs not making it worth it enough for even the big players to pursue.
In talking with Josh Walrath, he clarified that EUV does not, by itself, offer performance enhancements, but it does cut down on exposures/patterning and reduces the steps where things can go wrong which can lead to improved yields when implemented correctly. Using extreme ultraviolet lithography isn't a magic bullet though, as the fabrication equipment is expensive and uses a lot of power driving up manufacturing costs. TSMC is using EUV on its N7+ node to get "tighter metal pitch" and more density along with lower power consumption. Performance improvements are still unknown at this point (to the public, anyway), but as Mr. Walrath said performance isn't going to increase simply from moving to EUV. When moving to 5nm, TSMC does claim performance improvements, but most of those gains are likely attributed to the much higher density of the resulting chips. Using EUV to get yields up at that small of a node is likely the biggest reason for utilizing EUV to get enough useable wafer and dies per wafer. TSMC must believe that the costs [of EUV] versus trying to do it [5nm] without working in EUV into the processis worth it. Stay tuned to this week's PC Perspective podcast if you are interested in additional thoughts from JoshTekk and the team (or check out our Discord server).
What are your thoughts?
Subject: General Tech | April 5, 2018 - 04:06 PM | Tim Verry
Tagged: snapdragon 855, Semiconductor, Samsung, qualcomm, process tech, lithography, euv, 7nm, 5nm
According to an article on sedaily.com (translated) Samsung is almost six months ahead of schedule with its 7nm EUV process technology and has managed to complete the development phase as well as secure its first customer in Qualcomm. Samsung is pushing hard and fast with its process technology as it competes with TSMC and other semiconductor foundries and has invested $6 billion in a dedicated EUV line at its foundry in Hwaseong, Korea that is slated for completion in the second half of next year with production ramp-up in 2020.
Reportedly, Samsung's first 7nm product will be a 7nm LPP (low power plus) node achieved using Extreme Ultraviolet Lithography or EUV. Samsung has set up production conditions and finalized the development of the 7nm EUV process on its Hwaseong S3 line which is located near the future site of the dedicated EUV line mentioned above. The engineers and designers that developed the 7nm process and production line have reportedly shared the design database and methodologies necessary to begin sample production for customers and have moved onto to developing Samsung's 5nm process (which is still in the early stages). Getting the EUV process up and running is an impressive feat and the expertise that Samsung is gaining will be a major breakthrough in the barrier to entry of single-digit nanometer processes.
Samsung has managed to build out 10 extreme ultraviolet lithography units and is allegedly on track to produce the Snapdragon 855 for Qualcomm towards the end of this year or early next year on its new low power 7nm process node. Note that previous reports suggested TSMC would be producing the Snapdragon 855 with SDX50 5G modem so we may have to wait to see how TSMC responds in readying production this year for confirmation on who ultimately wins Qualcomm's orders. As the node number are a bit of marketing speak (they can pick the features they want to measure for the marketing to an extent heh), Samsung notes that its 7nm process can produce dies about 40% smaller than its 10nm process. Further, the smaller process can offer 10% more performance or up to 35% more power efficiency at the same level of performance which will be a huge boost to mobile processors and products! Thanks to the smaller process node, smartphone and tablet manufacturers could produce devices with similar dimensions but larger batteries or thinner devices with the same amount of portable power (I'd vote the former, smartphones are already very thin).
Samsung hopes to press on and complete the development of its 5nm process next year and once the dedicated EUV line in Hwaseong is fully up and running in 2020 the company plans to start mass producing products for its customers on 7nm, 6nm, and 5nm processes!
In all, this is very good news for Samsung and the wider market in general as it will add competition and encourage TSMC, GLOBALFOUNDRIES, and even Intel (with its semi-custom stuff) to continue advancing what is possible and developing and refining the EUV and other even more exotic process technology methods that will be necessary for the extremely complicated and difficult problems they will face in moving beyond 5nm into 3nm and smaller nodes! We are definitely getting to a point where we will within the next decade have to figure out the once-impossible or reinvent the way we process information (e.g. quantum computing) to get things to go any faster. I am very excited and interested to see where the semiconductor industy and global computing as a whole will go from here!
- Samsung Announces 11nm LPP and 7nm LPP Processes
- Samsung Has Announcements for 14nm, 10nm, and 7nm
- You've got to go deep before you can be extreme, TSMC is moving to 7nm
- GlobalFoundries Will Allegedly Skip 10nm and Jump to Developing 7nm Process Technology In House (Updated)
- Samsung Electronics Breaks Ground on New EUV Line in Hwaseong
Subject: General Tech | September 11, 2017 - 05:27 PM | Josh Walrath
Tagged: Vega, TSMC, Samsung, ryzen, Intel, euv, 8nm, 7nm, 14nm, 11nm, 10nm
Subject: General Tech | July 19, 2017 - 12:41 PM | Jeremy Hellstrom
Tagged: TSMC, 7nm, duv, N7, euv
TSMC is preparing for the move to a 7nm process by expanding suppliers and tooling up for Deep UV equipment. Unlike Samsung, who will be using Extreme UV tools for their initial launch of 7nm product in 2018 TSMC have chosen to delay the move to EUV until the technology matures. They will instead use DUV for its launch of their 7nm products, dubbed 7N, in 2018. The difference between the two types of UV is the wavelength, DUV can be produced at 248 and 193 nm while EUV is an impressive 13.5nm, which is why the industry (and ourselves) depend on this process maturing and being adopted by manufacturers. The EUV equipment that is being tested is still relatively new but should produce a better chip in theory, though perhaps not as many usable ones per wafer when first rolled out. You can pop by DigiTimes for a list of the suppliers TSMC is adopting as well as a bit more detail.
"Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according to industry sources."
Here is some more Tech News from around the web:
- The Top 5 Best Motherboards of All Time @ [H]ard|OCP
- Android Backdoor 'GhostCtrl' Can Silently Record Your Audio, Video and More @ Slashdot
- 5G is not just a radio: Welcome to the fibre-tastic new mobile world @ The Register
- Qualcomm could face £515,000-per-day penalty after losing EC antitrust appeal @ The Inquirer
- AMD Has No Plans To Release PSP Code @ Slashdot
- John McAfee plans to destroy Google. Details? Ummm... @ The Register
Subject: General Tech | November 5, 2016 - 07:01 AM | Scott Michaud
Tagged: Samsung, euv, 7nm, 14nm, 10nm
As the comments usually remind us, the smallest feature size varies in interpretation from company to company, and node to node. You cannot assume how Samsung compares with Intel, GlobalFoundries, or TSMC based on the nanometer rating alone, better or worse. In fact, any specific fabrication process, when compared to another one, might be better in some ways yet worse in others.
With all of that in mind, Samsung has announced the progress they've made with 14nm, 10nm, and 7nm fabrication processes. First, they plan to expand 14nm production with 14LPU. I haven't been able to figure out what this specific branding stands for, but I'm guessing it's something like “Low Power Ultra” given that it's an engineering name and those are usually super literal (like the other suffixes).
As for the other suffixes, Samsung begins manufacturing nodes with Low Power Early (LPE). From there, they improve upon their technique, providing higher performance and/or lower power, and call this new process Low Power Plus (LPP). LPC, which I believe stands for something like Low Power Cost, although I haven't seen this acronym officially expanded, removes a few manufacturing steps to make the end product cheaper. LPU is an extension of LPC with higher performance. Add the appropriate acronym as a suffix to the claimed smallest feature size, and you get the name of the node: xxLPX.
14LPU is still a ways out, though. Their second announcement, 10LPU, is expected to be their cost-reduction step for 10nm, which I interpret to mean they are omitting LPC from their 10nm production. You may think this is very soon, given how 10LPE has just started mass production a few weeks ago. Really, this is a quite early announcement in terms of overall 10nm production. The process design kits (PDKs) for both 14LPU and 10LPU, which are used by hardware vendors to design their integrated circuits, won't ship until 2Q17. As such, products will be a while behind that.
To close out, Samsung reiterated that 7nm is planned to use extreme ultraviolet lithography (EUV). They have apparently created a wafer using 7nm EUV, but images do not seem to be provided.
Development kits for 14LPU and 10LPU are expected to ship in the second quarter of 2017.
GlobalFoundries Will Allegedly Skip 10nm and Jump to Developing 7nm Process Technology In House (Updated)
Subject: Processors | August 20, 2016 - 03:06 PM | Tim Verry
Tagged: Semiconductor, lithography, GLOBALFOUNDRIES, global foundries, euv, 7nm, 10nm
UPDATE (August 22nd, 11:11pm ET): I reached out to GlobalFoundries over the weekend for a comment and the company had this to say:
"We would like to confirm that GF is transitioning directly from 14nm to 7nm. We consider 10nm as more a half node in scaling, due to its limited performance adder over 14nm for most applications. For most customers in most of the markets, 7nm appears to be a more favorable financial equation. It offers a much larger economic benefit, as well as performance and power advantages, that in most cases balances the design cost a customer would have to spend to move to the next node.
As you stated in your article, we will be leveraging our presence at SUNY Polytechnic in Albany, the talent and know-how gained from the acquisition of IBM Microelectronics, and the world-class R&D pipeline from the IBM Research Alliance—which last year produced the industry’s first 7nm test chip with working transistors."
An unexpected bit of news popped up today via TPU that alleges GlobalFoundries is not only developing 7nm technology (expected), but that the company will skip production of the 10nm node altogether in favor of jumping straight from the 14nm FinFET technology (which it licensed from Samsung) to 7nm manufacturing based on its own in house design process.
Reportedly, the move to 7nm would offer 60% smaller chips at three times the design cost of 14nm which is to say that this would be both an expensive and impressive endeavor. Aided by Extreme Ultraviolet (EUV) lithography, GlobalFoundries expects to be able to hit 7nm production sometime in 2020 with prototyping and small usage of EUV in the year or so leading up to it. The in house process tech is likely thanks to the research being done at the APPC (Advanced Patterning and Productivity Center) in Albany New York along with the expertise of engineers and design patents and technology (e.g. ASML NXE 3300 and 3300B EUV) purchased from IBM when it acquired IBM Microelectronics. The APPC is reportedly working simultaneously on research and development of manufacturing methods (especially EUV where extremely small wavelengths of ultraviolet light (14nm and smaller) are used to etch patterns into silicon) and supporting production of chips at GlobalFoundries' "Malta" fab in New York.
Advanced Patterning and Productivity Center in Albany, NY where Global Foundries, SUNY Poly, IBM Engineers, and other partners are forging a path to 7nm and beyond semiconductor manufacturing. Photo by Lori Van Buren for Times Union.
Intel's Custom Foundry Group will start pumping out ARM chips in early 2017 followed by Intel's own 10nm Cannon Lake processors in 2018 and Samsung will be offering up its own 10nm node as soon as next year. Meanwhile, TSMC has reportedly already tapped out 10nm wafers and will being prodction in late 2016/early 2017 and claims that it will hit 5nm by 2020. With its rivals all expecting production of 10nm chips as soon as Q1 2017, GlobalFoundries will be at a distinct disadvantage for a few years and will have only its 14nm FinFET (from Samsung) and possibly its own 14nm tech to offer until it gets the 7nm production up and running (hopefully!).
Previously, GlobalFoundries has stated that:
“GLOBALFOUNDRIES is committed to an aggressive research roadmap that continually pushes the limits of semiconductor technology. With the recent acquisition of IBM Microelectronics, GLOBALFOUNDRIES has gained direct access to IBM’s continued investment in world-class semiconductor research and has significantly enhanced its ability to develop leading-edge technologies,” said Dr. Gary Patton, CTO and Senior Vice President of R&D at GLOBALFOUNDRIES. “Together with SUNY Poly, the new center will improve our capabilities and position us to advance our process geometries at 7nm and beyond.”
If this news turns out to be correct, this is an interesting move and it is certainly a gamble. However, I think that it is a gamble that GlobalFoundries needs to take to be competitive. I am curious how this will affect AMD though. While I had expected AMD to stick with 14nm for awhile, especially for Zen/CPUs, will this mean that AMD will have to go to TSMC for its future GPUs or will contract limitations (if any? I think they have a minimum amount they need to order from GlobalFoundries) mean that GPUs will remain at 14nm until GlobalFoundries can offer its own 7nm? I would guess that Vega will still be 14nm, but Navi in 2018/2019? I guess we will just have to wait and see!
- To 7nm And Beyond (Interview @ Semiconductor Engineering)
- GloFo Looks For 7nm Leadership @ Electronics Weekly
- GlobalFoundries develops 7nm and 10nm technologies in-house @ KitGuru
- SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology @ GlobalFoundries (PR)
- AMD GPU Roadmap: Capsaicin Names Upcoming Architectures @ PC Perspective
- Next Gen Graphics and Process Migration: 20 nm and Beyond @ PC Perspective
Subject: General Tech | February 27, 2014 - 11:37 AM | Jeremy Hellstrom
Tagged: euv, photolithography, Intel, TSMC, DSA
A recent test at TSMC proved their experimental extreme UV lithography process is a little too extreme after a misaligned laser caused serious internal damage to their prototype. This is rather sad news for TSMC as EUV has been touted as the best way to reduce the chip making process below 10nm. Intel has been hedging their bets about EUV, they have invested heavily in the development of the technology but recently have teamed up with ASML Holdings and Arkema to work on directed self assembly, where the chips are convinced to form out of solution on a molecular basis. We are not quite talking Von Neumann machines but it is certainly within the same realm of thought. Other researchers are working on electron etching; forsaking light and its comparatively large wavelength for much smaller etching tools. You can read more about how companies such as Intel are trying to keep Moore's law alive at The Register.
"A recent test of the next-generation chip-etching technology known as extreme ultraviolet lithography (EUV) has come a cropper at chip-baking giant Taiwan Semiconductor Manufacturing Company (TSMC)."
Here is some more Tech News from around the web:
- AMD Press Talks Up Major Open-Source Linux Driver Features, But Fails @ Phoronix
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- Mantle no more? GDC sessions point to the next DirectX @ The Tech Report
- BlackBerry brings back call, end keys, touchpad to Q20 keyboard cutie @ The Register
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- Taste-O-Vision Is Now A Thing @ Hack a Day
- The TR Podcast 150: From Mantle to Maxwell, and beyond