Intel, Micron Jointly Announce QLC NAND FLASH, 96-Layer 3D Development

Subject: Storage | May 21, 2018 - 04:31 PM |
Tagged: ssd, QLC, NVMe, nand, Intel, Floating Gate, flash, die, 1Tbit

In tandem with Micron's launch of their new enterprise QLC SSDs, there is a broader technology announcement coming out of Intel today. This release covers the fact that Intel and Micron have jointly developed shippable 64-Layer 3D QLC NAND.

IMFT_Micron 3D NAND.png

IMFT's 3D NAND announcement came back in early 2015, and Intel/Micron Flash Technologies have been pushing their floating gate technology further and further. Not only do we have the QLC announcement today, but with it came talks of progress on 96-layer development as well. Combining QLC with 96-Layer would yield a single die capacity of 1.5 Tbit (192GB), up from the 1 Tbit (128GB) capacity of the 64-Layer QLC die that is now in production.

progression-3-.png

This new flash won't be meant for power users, but should be completely usable in a general use client SSD, provided there is a bit of SLC (or 3D XPoint???) cache on the front end. QLC does store 33% more data per the same die space, which should eventually translate to a lower $/GB once development costs have been recouped. Here's hoping for lower cost SSDs in the future!

Press blast after the break!