Subject: Processors | February 4, 2017 - 01:22 AM | Sebastian Peak
Tagged: titan x, ryzen, report, processor, nvidia, leak, cpu, benchmark, ashes of the singularity, amd
AMD's upcoming 8-core Ryzen CPU has appeared online in an apparent leak showing performance from an Ashes of the Singularity benchmark run. The benchmark results, available here on imgur and reported by TechPowerUp (among others today) shows the result of a run featuring the unreleased CPU paired with an NVIDIA Titan X graphics card.
It is interesting to consider that this rather unusual system configuration was also used by AMD during their New Horizon fan event in December, with an NVIDIA Titan X and Ryzen 8-core processor powering the 4K game demos of Battlefield 1 that were pitted against an Intel Core i7-6900K/Titan X combo.
It is also interesting to note that the processor listed in the screenshot above is (apparently) not an engineering sample, as TechPowerUp points out in their post:
"Unlike some previous benchmark leaks of Ryzen processors, which carried the prefix ES (Engineering Sample), this one carried the ZD Prefix, and the last characters on its string name are the most interesting to us: F4 stands for the silicon revision, while the 40_36 stands for the processor's Turbo and stock speeds respectively (4.0 GHz and 3.6 GHz)."
March is fast approaching, and we won't have to wait long to see just how powerful this new processor will be for 4K gaming (and other, less important stuff). For now, I want to find results from an AotS benchmark with a Titan X and i7-6900K to see how these numbers compare!
Cooler Master's MasterLiquid Maker 92 is a unique liquid CPU cooler that fits all of its parts into one cluster atop the processor, and does it with a clever, hinged construction that allows it to be switched from an upright to a horizontal position at will. While the Maker 92 only occupies about as much space as a large tower air cooler in its upright position, the ability to fold it down provides both enhanced clearance and the option of directing airflow down to help cool motherboard components. But the big question for this cooler is just how effective can a closed-loop system be when it’s this compact? We’re about to find out!
Let's get part out if the way right off the bat: specialty small form-factor products generally don't offer competitive price/performance numbers, and critics are quick to point to this aspect of SFF computing. The small form-factor side of enthusiast PC building is a pretty small niche, and a product like the Maker 92 might not be for you; but what is important to consider when looking at a specialty product like this is the performance for its size, as designs of the most compact cooling components typically sacrifice something in this regard given their reduced surface area, smaller fan diameter, etc.
Most SFF solutions for processor cooling are of the air variety, with liquid being an option if a given enclosure supports your AiO (or custom loop) cooling of choice. Ultra low-profile CPU air coolers are popular for slim builds, and a product like the Maker 92 isn’t going to replace one of these if your enclosure of choice has a very low profile. Any system using a standard height PCI Express graphics card will work, though that top fan may have to come off depending on the case - which of course will affect cooling performance (in theory, anyway). But enough speculation! Let’s take a close look at this cooler and test out the fit and cooling prowess in both orientations.
Ryzen coming in 2017
As much as we might want it to be, today is not the day that AMD launches its new Zen processors to the world. We’ve been teased with it for years now, with trickles of information at event after event…but we are going to have to wait a little bit longer with one more tease at least. Today’s AMD is announcing the official branding of the consumer processors based on Zen, previously code named Summit Ridge, along with a clock speed data point and a preview of five technology that will help it be competitive with the Intel Core lineup.
The future consumer desktop processor from AMD will now officially be known as Ryzen. That’s pronounced “RISE-IN” not “RIS-IN”, just so we are all on the same page. CEO Lisa Su was on stage during the reveal at a media event last week and claimed that while media, fans and AMD fell in love with the Zen name, it needed a differentiation from the architecture itself. The name is solid – not earth shattering though I foresee a long life of mispronunciation ahead of it.
Now that we have the official branding behind us, let’s get to the rest of the disclosed information we can reveal today.
We already knew that Summit Ridge would ship with an 8 core, 16 thread version (with lower core counts at lower prices very likely) but now we know a frequency and a cache size. AMD tells us that there will be a processor (the flagship) that will have a base clock of 3.4 GHz with boost clocks above that. How much above that is still a mystery – AMD is likely still tweaking its implementation of boost to get as much performance as possible for launch. This should help put those clock speed rumors to rest for now.
The 20MB of cache matches the Core i7-6900K, though obviously with some dramatic architecture differences between Broadwell and Zen, the effect and utilization of that cache will be interesting measure next year.
We already knew that Ryzen will be utilizing the AM4 platform, but it’s nice to see it reiterated a modern feature set and expandability. DDR4 memory, PCI Express Gen3, native USB 3.1 and NVMe support – there are all necessary building blocks for a modern consumer and enthusiast PC. We still should see how many of these ports the chipset offers and how aggressive motherboard companies like ASUS, MSI and Gigabyte are in their designs. I am hoping there are as many options as would see for an X99/Z170 platform, including budget boards in the $100 space as well as “anything and everything” options for those types of buyers that want to adopt AMD’s new CPU.
Subject: Processors | September 19, 2016 - 02:35 PM | Sebastian Peak
Tagged: Socket AM4, processor, FX, cpu, APU, amd, 1331 pins
Image credit: Bit-Tech via HWSW
AMD's newest socket will merge the APU and FX series CPUs into this new AM4 socket, unlike the previous generation which split the two between AM3+ and FM2+. This is great news for system builders, who now have the option of starting with an inexpensive CPU/APU, and upgrading to a more powerful FX processor later on - with the same motherboard.
The new socket will apparently require a new cooler design, which is contrary to early reports (yes, we got it wrong, too) that the AM4 socket would be compatible with existing AM3 cooler mounts (manufacturers could of course offer hardware kits for existing cooler designs). In any case, AMD's new socket takes more of the delicate copper pins you love to try not to bend!
Subject: General Tech | April 30, 2016 - 04:33 AM | Scott Michaud
Tagged: SoC, nfme, gpu, cpu, amd
Nantong Fujitsu Microelectronics Co., Ltd. (NFME) is a Chinese company that packages and tests integrated circuits. Recently, AMD has been working with China to reach that large market, especially given their ongoing cash concerns. This time, AMD sold 85% of its stake in two locations, AMD Penang, Malaysia and AMD Suzhou, Jiangsu, China, to NFME and formed a joint venture with them, called TF-AMD Microelectronics Sdn Bhd.
I see two interesting aspects to this story.
First, AMD gets about $320 million USD in this transaction, after taxes and fees, and it also retains 15% of this venture. I am curious whether this will lead to a long-term source of income for AMD, even though the press release claims that this structure will be “cost neutral”. Either way, clearing a third of a billion dollars should help AMD to some extent. That equates to about two-to-three quarters of net-loss for the company, so it gives them about six-to-nine extra months of life on its own. That's not too bad if the transaction doesn't have any lasting consequences.
Second, NFME now has access to some interesting packaging and testing technologies. NFME's website claims that this allows them to handle dies up to 800mm2, substrates with up to 18 layers, and package sizes up to 75mm. These specifications sound like it pulls from their GPU experience, which could bring all of that effort and knowledge to completely different fields.
The press release states that 1,700 employees will be moved from AMD to this venture. They do not state whether any jobs are affected over and above this amount, though.
Subject: Cases and Cooling, Processors | April 22, 2016 - 03:36 PM | Sebastian Peak
Tagged: Wraith, quiet computing, heatsink, cpu cooler, cpu, AMD Wraith, amd, air cooling
AMD has expanded the CPU lineup featuring their high-performance Wraith air cooling solution, with the quiet cooler now being offered with two more FX-series processors.
Image credit: The Tech Report
"AMD has heard the feedback from reviewers and PC users everywhere: the near-silent, capable AMD Wraith Cooler is a resounding success. The question they keep asking is, 'When will the Wraith Cooler be available on more AMD Processors?'
We’re pleased to announce that the wait is over. The high-performance AMD FX 8350 and AMD FX 6350 processors now include a true premium thermal solution in the AMD Wraith Cooler, and each continues to deliver the most cores andthe highest clock rates in its class."
The lineup featuring AMD's most powerful air solution now includes the following products:
- AMD FX 8370
- AMD FX 8350
- AMD FX 6350
- AMD A10-7890K
The Wraith cooler initially made its debut with the FX-8370 CPU, and was added to the new A10-7890K APU with the FM2+ refresh last month.
Subject: Processors | March 15, 2016 - 04:52 PM | Sebastian Peak
Tagged: TSMC, SoC, servers, process technology, low power, FinFET, datacenter, cpu, arm, 7nm, 7 nm FinFET
ARM and TSMC have announced their collaboration on 7 nm FinFET process technology for future SoCs. A multi-year agreement between the companies, products produces on this 7 nm FinFET process are intended to expand ARM’s reach “beyond mobile and into next-generation networks and data centers”.
TSMC Headquarters (Image credit: AndroidHeadlines)
So when can we expect to see 7nm SoCs on the market? The report from The Inquirer offers this quote from TSMC:
“A TSMC spokesperson told the INQUIRER in a statement: ‘Our 7nm technology development progress is on schedule. TSMC's 7nm technology development leverages our 10nm development very effectively. At the same time, 7nm offers a substantial density improvement, performance improvement and power reduction from 10nm’.”
Full press release after the break.
Subject: Processors | February 5, 2016 - 04:44 PM | Sebastian Peak
Tagged: Intel, Skylake, overclocking, cpu, Non-K, BCLK, bios, SKY OC, asrock, Z170
ASRock's latest batch of motherboard BIOS updates remove the SKY OS function, which permitted overclocking of non-K Intel processors via BCLK (baseclock).
The news comes amid speculation that Intel had pressured motherboard vendors to remove such functionality. Intel's unlocked K parts (i5-6600K, i7-6700K) will once again be the only options for Skylake overclocking on Z170 on ASRock boards (assuming prior BIOS versions are no longer available), and with no Pentium G3258 this generation Intel is no longer a budget friendly option for enthusiasts looking to push their CPU past factory specs.
(Image credit: Hexus.net)
It sounds like now would be a good time to archive that SKY OS enabled BIOS update file if you've downloaded it - or simply refrain from this BIOS update. What remains to be seen of course is whether other vendors will follow suit and disable BCLK overclocking of non-K processors. This had become a popular feature on a number of Z170 motherboards on the market, but ASRock may have been in too weak a position to battle Intel on this issue.
AMD Keeps Q1 Interesting
CES 2016 was not a watershed moment for AMD. They showed off their line of current video cards and, perhaps more importantly, showed off working Polaris silicon, which will be their workhorse for 2016 in the graphics department. They did not show off Zen, a next generation APU, or any AM4 motherboards. The CPU and APU world was not presented in a way that was revolutionary. What they did show off, however, hinted at the things to come to help keep AMD relevant in the desktop space.
It was odd to see an announcement about the stock cooler that AMD was introducing, but when we learned more about it, the more important it was for AMD’s reputation moving forward. The Wraith cooler is a new unit to help control the noise and temperatures of the latest AMD CPUs and select APUs. This is a fairly beefy unit with a large, slow moving fan that produces very little noise. This is a big change from the variable speed fans on previous coolers that could get rather noisy and leave temperatures that were higher in range than are comfortable. There has been some derision aimed at AMD for providing “just a cooler” for their top end products, but it is a push that is making them more user and enthusiast friendly without breaking the bank.
Socket AM3+ is not dead yet. Though we have been commenting on the health of the platform for some time, AMD and its partners work to improve and iterate upon these products to include technologies such as USB 3.1 and M.2 support. While these chipsets are limited to PCI-E 2.0 speeds, the four lanes available to most M.2 controllers allows these boards to provide enough bandwidth to fully utilize the latest NVMe based M.2 drives available. We likely will not see a faster refresh on AM3+, but we will see new SKUs utilizing the Wraith cooler as well as a price break for the processors that exist in this socket.
Subject: Processors | January 24, 2016 - 05:19 PM | Sebastian Peak
Tagged: Tigerlake, rumor, report, processor, process node, Intel, Icelake, cpu, Cannonlake, 10 nm
A report from financial website The Motley Fool discusses Intel's plan to introduce three architectures at the 10 nm node, rather than the expected two. This comes after news that Kaby Lake will remain at the present 14 nm, interrupting Intel's 2-year manufacturing tech pace.
(Image credit: wccftech)
"Management has told investors that they are pushing to try to get back to a two-year cadence post-10-nanometer (presumably they mean a two-year transition from 10-nanometer to 7-nanometer), however, from what I have just learned from a source familiar with Intel's plans, the company is working on three, not two, architectures for the 10-nanometer node."
Intel's first 10 nm processor architecture will be known as Cannonlake, with Icelake expected to follow about a year afterward. With Tigerlake expected to be the third architecture build on 10 nm, and not coming until "the second half of 2019", we probably won't see 7 nm from Intel until the second half of 2020 at the earliest.
It appears that the days of two-year, two product process node changes are numbered for Intel, as the report continues:
"If all goes well for the company, then 7-nanometer could be a two-product node, implying a transition to the 5-nanometer technology node by the second half of 2022. However, the source that I spoke to expressed significant doubts that Intel will be able to return to a two-years-per-technology cycle."
(Image credit: The Motley Fool)
It will be interesting to see how players like TSMC, themselves "planning to start mass production of 7-nanometer in the first half of 2018", will fare moving forward as Intel's process development (apparently) slows.