Subject: Processors | January 29, 2015 - 03:41 PM | Sebastian Peak
Tagged: rumor, processors, Kaveri, Godavari, cpu, Athlon X4, APU, amd
VR-Zone has published a report with a detailed slide showing upcoming AMD Godavari processors, and the updated lineup includes 12 new models.
The release schedule indicates a spring availability for most of the new APUs, with the Athlon X4 850 and 870K shipping in May. The APU line gets a new flagship desktop part with the A10-8850K, and this appears to be a higher-clocked version of the A10-7850K, with a 100MHz higher boost clock (4.1 GHz vs. 4.0 GHz) and a higher GPU clock of 856 MHz (vs. 720 MHz).
Of particular interest for the potential budget quad-core buyer is the Athlon X4 870K, a new 95W part which would presumably replace the X4 860K - a processor that has seen inconsistent availability (and is currently unavailable on Newegg). With more games being released that require a quad-core to run, these sub-$100 Athlon CPUs present a great value in constructing a low-cost gaming system these days.
The slide does not indicate a change in the 28nm process from Kaveri, and it should be safe to assume these will not represent a significant architectural change. The modest clock increases from Kaveri will result in some performance gains, and this is good for consumers assuming these will sell at the same price points as the outgoing models.
Subject: Processors | January 18, 2015 - 10:16 PM | Sebastian Peak
Tagged: SoC, rumor, processor, leak, iris pro, Intel, graphics, cpu, carrizo, APU, amd
A new report of leaked benchmarks paints a very interesting picture of the upcoming AMD Carrizo mobile APU.
Image credit: SiSoftware
Announced as strictly mobile parts, Carrizo is based on the next generation Excavator core and features what AMD is calling one of their biggest ever jumps in efficiency. Now alleged leaked benchmarks are showing significant performance gains as well, with numbers that should elevate the IGP dominance of AMD's APUs.
Image credit: WCCFtech
"The A10 7850K scores around 270 Mpix/s while Intel’s HD5200 Iris Pro scores a more modest 200 Mpix/s. Carriso scores here over 600 Mpix/s which suggests that Carrizo is more than twice as fast as Kaveri and three times faster than Iris Pro. To put this into perspective this is what an R7 265 graphics card scores, a card that offers the same graphics performance inside the Playstation 4."
While the idea of desktop APUs with greatly improved graphics and higher efficency is tantalizing, AMD has made it clear that these will be mobile-only parts at launch. When asked by Anandtech, AMD had this to say about the possibility of a desktop variant:
“With regards to your specific question, we expect Carrizo will be seen in BGA form factor desktops designs from our OEM partners. The Carrizo project was focused on thermally constrained form factors, which is where you'll see the big differences in performance and other experiences that consumers value.”
The new mobile APU will be manufactured with the same 28nm process as Kaveri, with power consumption up to 35W for the Carrizo down to a maximum of 15W for the ultra-mobile Carrizo-L parts.
Subject: General Tech | January 14, 2015 - 05:32 PM | Jeremy Hellstrom
Tagged: history, cpu, errata, dan luu
A question was asked of Dan Luu about what new tricks silicon has learned since the early days of the eighties. The answer covers a gamut of what tools those who work on low level code such as drivers and UEFI/BIOS now have at their disposal. It is far more than just the fact that we have grown from 8 bit to 64 bit or the frequencies possible now that were undreamed of before but delves into the newer features such as out of order instructions and single instruction, multiple data instructions. If you are not familiar with how CPUs and GPGPUs operate at these low levels it is a great jumping off point for you to learn what the features are called and to get a rough idea of what tasks they perform. If you know your silicon through and through it is a nice look back at what has been added in the last 25 years and a reminder of what you had to work without back in the days when flashing a BIOS was a literal thing. You can also check the comments below the links at Slashdot as they are uncharacteristically on topic.
"An article by Dan Luu answers this question and provides a good overview of various cool tricks modern CPUs can perform. The slightly older presentation Compiler++ by Jim Radigan also gives some insight on how C++ translates to modern instruction sets."
Here is some more Tech News from around the web:
- CES 2015: Dell, Lenovo and HP showcase potential of Intel’s 5th-gen Core chips @ The Inquirer
- Insert 'Skeleton Key', unlock Microsoft Active Directory. Simples – hackers @ The Register
- Lego Avengers Assemble to the Helicarrier! @ Hack a Day
- TechwareLabs CES 2015 Event Coverage: Thermaltake
- Toshiba tosses out uber-slim THREE TERABYTE HDD @ The Register
- BlackBerry adopts the iPhone for promotional Twitter campaign @ The Inquirer
- The BenQ W1080ST+ & W1070+ Home Cinema Projector Launch Event @ TechARP
Since the introduction of the Haswell line of CPUs, the Internet has been aflame with how hot the CPUs run. Speculation ran rampant on the cause with theories abounding about the lesser surface area and inferior thermal interface material (TIM) in between the CPU die surface and the underside of the CPU heat spreader. It was later confirmed that Intel had changed the TIM interfacing the CPU die surface to the heat spreader with Haswell, leading to the hotter than expected CPU temperatures. This increase in temperature led to inconsistent core-to-core temperatures as well as vastly inferior overclockability of the Haswell K-series chips over previous generations.
A few of the more adventurous enthusiasts took it upon themselves to use inventive ways to address the heat concerns surrounding the Haswell by delidding the processor. The delidding procedure involves physically removing the heat spreader from the CPU, exposing the CPU die. Some individuals choose to clean the existing TIM from the core die and heat spreader underside, applying superior TIM such as metal or diamond-infused paste or even the Coollaboratory Liquid Ultra metal material and fixing the heat spreader back in place. Others choose a more radical solution, removing the heat spreader from the equation entirely for direct cooling of the naked CPU die. This type of cooling method requires use of a die support plate, such as the MSI Die Guard included with the MSI Z97 XPower motherboard.
Whichever outcome you choose, you must first remove the heat spreader from the CPU's PCB. The heat spreader itself is fixed in place with black RTV-type material ensuring a secure and air-tight seal, protecting the fragile die from outside contaminants and influences. Removal can be done in multiple ways with two of the most popular being the razor blade method and the vise method. With both methods, you are attempting to separate the CPU PCB from the heat spreader without damaging the CPU die or components on the top or bottom sides of the CPU PCB.
Subject: Processors | May 27, 2014 - 10:58 PM | Sebastian Peak
Tagged: X99, rumors, octocore, lga2011, Intel, Haswell-E, cpu
As with any high-profile release there have been rumors circulating around Intel's upcoming high-end desktop processors for the X99 chipset, and a report today from Chinese site Coolaler claims to have the specs on these new Haswell-E CPU's.
Of particular interest are the core counts, which appear to have been increased compared to the current Ivy Bridge-E products. The lineup will reportedly include a 6-core i7-5820K, 6-core i7-5930K, and 8-core i7-5960X. Yep, not only are we looking at an octo-core desktop part but now even the "entry-level" Extreme part might have 6 cores.
Nothing wrong with more cores (and this will be especially attractive if we see the same MSRP's as Ivy Bridge-E) but there might be one caveat with the i7-5820K, as the reported specs show fewer PCIe lanes on this CPU with 28, compared to the 40 lanes found on the higher Haswell-E parts (and all current Ivy-Bridge-E parts).
Haswell-E would still provide more lanes than the current desktop i7 parts (an i7-4770K has only 16), but the disparity would create an interesting quandary for a potential adopter. Though x8 connections for multi-GPU setups is par for the course already on non-X79 desktop systems, the SATA Express and M.2 standards will put more of a premium on PCIe lane allocation for storage going forward.
Of course no official word from Intel on the matter yet, and only speculation on pricing. This is completely unsubstantiated, but is certainly of interest - particularly as hex-core i7's previously commanded the pricing of a more premium part in each prior iteration.
Subject: Processors | June 21, 2013 - 01:39 PM | Tim Verry
Tagged: Intel, haswell, cpu, Broadwell, 14nm
Alongside the good news of 8-core Haswell-E parts, VR-Zone revealed an updated Intel road map that makes no mention of the 14nm Haswell architecture die shrink Broadwell. Broadwell was originally intended to be the next "tick" in Intel's yearly "tick-tock" chip release schedule set to release next year. If recent reports are true, this will no longer be the case. Instead, 2014 will be dominated (at least on the Intel side of things) by consumer Haswell and enthusiast-grade Haswell-E chips.
What is going on with Broadwell?
Broadwell is essentially supposed to be a CPU using the Haswell micro-architecture that is built on a (impressively) smaller 14nm manufacturing process. There may be a few minor tweaks to the architecture or updates to the instruction set extensions, but the big difference between Broadwell and Haswell is the die shrink from 22nm to 14nm. The die shrink will allow for better low-power performance and will be beneficial in battery-powered mobile devices first and foremost. Likely as a result of the main benefits being mobile parts, Intel has previously announced that Broadwell chips would be BGA only, which means that there would not be a traditional LGA socket-ed desktop part. Broadwell chips would only come soldered onto motherboards in bare-bones systems, laptops, and tablets for example.
Despite the small architectural differences, the die shrink alone is a monumental task. Intel needs to not only be able to shrink Haswell and its wealth of transistors to 14nm, but it has to do so in a way that allows them to get the yields and power efficiency characteristics that they want. This is extremely hard, and the move to manufacturing nodes below 22nm is going to get exceedingly difficult. Intel accomplished 22nm with its Tri-gate 3D transistors, but with 14nm they are going to have to push beyond that, and even with its huge money vault, physics is working against them in a big way here. As a result of the huge challenges of moving to 14nm, it seems at this point that Broadwell will not be ready in time for a 2014 launch after all. Instead, Intel is now shooting for a 2015 launch of the BGA Broadwell chips alongside the LGA (socket-ed) 14nm Sky Lake processors (the "tock" to Broadwell's "tick").
Some enthusiasts and media have painted the Broadwell delay to be, at least in part, due to less competition from AMD. That is possible, but I can't help but thinking that slowing down Broadwell is the last thing Intel would want to do. The sooner Intel is able to move its Haswell (and future) micro-architecture-based chips to 14nm and beyond, the sooner AMD is put all that much farther behind. If Intel had managed 14nm Broadwell in 2014, AMD would have been screwed out of a lot of SFF NUC-type systems as well as mobile devices as they would not really be able to compete on performance or power efficiency! (Then Intel could happily focus on trying to bring down ARM in the mobile space, which it seems to want to do heh.) In some internal discussion with PC Perspective's Josh Walrath, I think that Intel would have loved to bring 14nm chips next year but, because of manufacturing process woes, the chips are simply not ready.
The new plan: Refresh Haswell in 2014 with a new Z97 chipset
Now, with the launch of Broadwell moved back to at least 2015, consumers will now be presented with a refresh of 22nm Haswell chips on the consumer side around Q2 2014 and the upcoming launch of enthusiast-platform Haswell-E processors in the second half of 2014.
The Haswell (LGA 1150) refresh will include better binned chips with a lineup that is likely to see a slight speed bump in stock clockspeed across the board as well as an updated Z97 chipset. The new chipset will support 1000 MB/s SATA Express and boot-level malware protection technology in the form of Intel Device Protection and Boot Guard. Granted motherboards using the updated Z97 chipset are not going to be all that alluring to those users already running Z87 chipsets with their Haswell processors. However, users that have not yet upgraded might as well go with the newer chipset and enjoy the small tweaks and benefits that go along with it. In other words, if you were holding out waiting to upgrade to a Broadwell CPU plus motherboard combo, you are going to be waiting at least another year. You will be able to grab a refreshed Haswell CPU and a Z87 or Z97 chipset-based motherboard next year though (which should still be a healthy upgrade if you have a pre-Sandy Bridge system).
Also worth noting is that if you have already upgraded to Haswell, you can rest easy knowing that you have at least another year of your chip being the newest model--quite a feat considering how fast the tech world traditionally moves!
On the other hand, if Haswell just isn't fast enough, there is always Haswell-E to look forward to in 2014! Haswell-E will bring 8-core, 16-thread chips with 20MB of L3 cache (up to ~140W TDP) and the X99 chipset, which should keep the top-end enthusiast market happy no matter the state of Broadwell.
I'm looking forward to more details regarding the 14nm manufacturing process, and hoping that once the chips are on the way the company will be willing to talk about some of the challenges and issues they faced moving to such a small process node (perhaps at IDF? One can hope.) In the mean time, Haswell has another year to shine and make Intel money while AMD works on its HSA and APU strategies.
What do you think about the 14nm Broadwell delay? Does it impact you, or were you waiting for Haswell-E anyway?
Subject: General Tech | May 3, 2013 - 12:59 PM | Tim Verry
Tagged: zero load, PSU, Intel, haswell, enermax, cpu, c6, c5
Earlier this week, it was revealed that Intel’s upcoming Haswell processors would feature new C6 and C7 sleep states that draw as little as 0.05A on the 12V rail. Such low power draw on the 12V rail may cause problems for existing power supplies, which are not accustomed to facilitating such low power draw (especially on the 12V line). In an attempt to clear up a bit of the confusion for its customers, Enermax has put together a list of its mid-range and high-end power supplies that meet the standards required to support the new low-power processor states.
According to the press release (seen below), the Enermax power supplies use so-called Zero Load technology that uses a DC to DC converter to support low wattage power draw. This technology has been in Enermax power supplies since the Revolution85+ series which was launched in 2008. The company claims that the power supplies deliver “rock solid voltages” down to 0W load, which is within the Intel specification of 0.05A for the CPU alone.
The list of compatible Enermax power supplies is as follows:
Enermax Platimax Series
- Platimax 500W (EPM500AWT)
- Platimax 600W (EPM600AWT)
- Platimax 750W (EPM750AWT)
- Platimax 850W (EPM850EWT)
- Platimax 1000W (EPM1000EWT)
- Platimax 1200W (EPM1200EWT)
- Platimax 1500W (EPM1500EGT)
Enermax Revolution87+ Series
- Revolution87+ 550W (ERV550AWT-G)
- Revolution87+ 650W (ERV650AWT-G)
- Revolution87+ 750W (ERV750AWT-G)
- Revolution87+ 850W (ERV850EWT-G)
- Revolution87+ 1000W (ERV1000EWT-G)
Enermax MaxRevo Series
- MaxRevo 1200W (EMR1200EWT)
- MaxRevo 1350W (EMR1350EWT)
- MaxRevo 1500W (EMR1500EGT)
Enermax Triathlor Series
- Triathlor 385W (ETA385AWT)
- Triathlor 450W (ETA450AWT)
- Triathlor 550W (ETA550AWT)
Enermax Revolution85+ Series
- Revolution85+ 850W (ERV850EWT)
- Revolution85+ 920W (ERV920EWT)
- Revolution85+ 950W (ERV950EWT)
- Revolution85+ 1020W (ERV1020EWT)
- Revolution85+ 1050W (ERV1050EWT)
- Revolution85+ 1250W (ERV1250EGT)
Enermax Modu87+ Series
- Modu87+ 500W (EMG500AWT)
- Modu87+ 600W (EMG600AWT)
- Modu87+ 700W (EMG700AWT)
- Modu87+ 800W (EMG800EWT)
- Modu87+ 900W (EMG900EWT)
Enermax Pro87+ Series
- Pro87+ 500W (EPG500AWT)
- Pro87+ 600W (EPG600AWT)
The list includes power supplies from a number of series over the past few years that range from 500W to 1250W. I'm sure between now and the launch of Haswell in the first week of June that other PSU manufacturers will be announcing which models are compatible and which are not. Stay tuned to PC Perspective as more information becomes available!
Subject: Processors | April 18, 2013 - 01:48 AM | Tim Verry
Tagged: overclocking, intel ivr, intel hd graphics, Intel, haswell, cpu
During the Intel Developer Forum in Beijing, China the X86 chip giant revealed details about how overclocking will work on its upcoming Haswell processors. Enthusiasts will be pleased to know that the new chips do not appear to be any more restrictive than the existing Ivy Bridge processors as far as overclocking. Intel has even opened up the overclocking capabilities slightly by allowing additional BCLK tiers without putting aspects such as the PCI-E bus out of spec.
The new Haswell chips have an integrated voltage regulator, which allows programmable voltage to both the CPU, Memory, and GPU portions of the chip. As far as overclocking the CPU itself, Intel has opened up the Turbo Boost and is allowing enthusiasts to set an overclocked Turbo Boost clockspeed. Additionally, Intel is specifying available BCLK values of 100, 125, and 167MHz without putting other systems out of spec (they use different ratios to counterbalance the increased BCLK, which is important for keeping the PCI-E bus within ~100Mhz). The chips will also feature unlocked core ratios all the way up to 80 in 100MHz increments. That would allow enthusiasts with a cherry-picked chip and outrageous cooling to clock the chip up to 8GHz without overclocking the BCLK value (though no chip is likely to reach that clockspeed, especially for everyday usage!).
Remember that the CPU clockspeed is determined by the BCLK value times a pre-set multiplier. Unlocked processors will allow enthusiasts to adjust the multiplier up or down as they please, while non-K edition chips will likely only permit lower multipliers with higher-than-default multipliers locked out. Further, Intel will allow the adventurous to overclock the BLCK value above the pre-defined 100, 125, and 167MHz options, but the chip maker expects most chips will max out at anywhere between five-to-seven percent higher than normal. PC Perspective’s Morry Teitelman speculates that slightly higher BCLK overclocks may be possible if you have a good chip and adequate cooling, however.
Similar to current-generation Ivy Bridge (and Sandy Bridge before that) processors, Intel will pack Haswell processors with its own HD Graphics pGPU. The new HD Graphics will be unlocked and the graphics ratio will be able to scale up to a maximum of 60 in 50MHz steps for a potential maximum of 3GHz. The new processor graphics cards will also benefit from Intel’s IVR (programmable voltage) circuitry. The HD Graphics and CPU are fed voltage from the integrated voltage regulator (IVR), and is controlled by adjusting the Vccin value. The default is 1.8V, but it supports a recommended range of 1.8V to 2.3V with a maximum of 3V.
Finally, Intel is opening up the memory controller to further overclocking. Intel will allow enthusiasts to overclock the memory in either 200MHz or 266MHz increments, which allows for a maximum of either 2,000MHz or 2,666MHz respectively. The default voltage will depend on the particular RAM DIMMs you use, but can be controlled via the Vddq IVR setting.
It remains to be seen how Intel will lock down the various processor SKUs, especially the non-K edition chips, but at least now we have an idea of how a fully-unlocked Haswell processor will overclock. On a positive note, it is similar to what we have become used to with Ivy Bridge, so similar overclocking strategies for getting the most out of processors should still apply with a bit of tweaking. I’m interested to see how the integration of the voltage regulation hardware will affect overclocking though. Hopefully it will live up to the promises of increased efficiency!
Are you gearing up for a Haswell overhaul of your system, and do you plan to overclock?
Subject: General Tech | December 27, 2012 - 08:37 PM | Ken Addison
Tagged: video, ssd, podcast, picks of the year, memory, gpu, editors choice, cpu, case, best of the year
PC Perspective Podcast #232 - 12/27/2012
Join us this week as we discuss our picks for Best Products of 2012!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Josh Walrath, Allyn Malventano and Scott Michaud
Program length: 1:40:13
Podcast topics of discussion:
- Welcome to our Best Of 2012 Episode!
- Rules explanation: there are no rules!!
0:07:30 Best CPU
- AMD Trinity A10 APU
- Intel Core i7-3770K
- Intel Ultrabook mobile CPU
- Qualcomm Krait Mobile CPU
0:20:00 Best Motherboard
- MSI Z77 MPower
- ASUS Rampage IV Extreme
- ASUS Z77 Mini ITX
- EVGA dual Xeon board
- Asus Crosshair Formula Z
0:31:20 Best GPU
- GeForce GTX 680 2GB
- GeForce GTX 660 Ti 2GB
- Radeon HD 7970 3GB
- Radeon HD 7870 2GB
- 0:44:00 This Podcast is brought to you by MSI!
0:45:00 Best Storage
- Samsung 840 Pro SSD
- OCZ Vector SSD
- WD Red HDD
- WD 4TB Enterprise
1:05:00 Best Case
- Corsair Carbide 300R
- Corsair Obsidian 550D
- Cooler Master Cosmos II
- Mineral Oil Case
1:12:00 Best Price Drop
- AMD Radeon 7000 GPUs
- Good IPS displays ($199 - $400)
- 2560x1440 27-in panels
- System Memory
1:22:00 Best Newly Popular Technology
- High-res monitors (Korean or otherwise)
- Cherry style keyboards
- Mini ITX Motherboards
- Touch screen?
1:35:00 Best Lenovo Laptop on my Desk
- Thinkpad Twist
- Thinkpad X1 Carbon
- Thinkpad X230
- Yoga 13
- 1-888-38-PCPER or email@example.com
- http://twitter.com/ryanshrout and http://twitter.com/pcper
Subject: Processors | November 6, 2012 - 06:15 PM | Tim Verry
Tagged: server, piledriver, opteron, datacenter, cpu, amd
AMD announced new server processors on Monday based on the same Piledriver architecture used in the Trinity APUs and Vishera desktop CPUs we recently reviewed. With the release of the Opteron 6300 series, AMD is bringing Piledriver to the server room.
The new chips – similar to the desktop counterparts – bring several performance improvements over the previous generation 6200 series Opterons based on the Bulldozer architecture. AMD is positioning the chips as a upgrade path to existing servers and on merits of performance-per-dollar efficiency. As is AMD's fashion, the new chips are competitively priced and "good enough" performance-wise. With 6300, AMD has stated the goal is to reduce the TCO, or Total Cost of Ownership for servers used in data centers, supercomputers, and enterprises by being compatible with existing AMD server platforms with a BIOS upgrade and representing efficiency improvements over previous chips.
The Opteron 6300 series CPUs themselves build upon the Vishera desktop parts by adding more cores and more L3 cache. The server parts will have up to 16 cores clocked at 2.8GHz base and 3.2GHz turbo. They will have TDP ratings between 85W and 140W and will feature prices from $500 to $1,400. On the cache front, the chips have a 16KB L1 data cache per core, 64KB L1 instruction cache per module, 1MB L2 cache per core, and a shared 16MB cache per socket. AMD has included a quad channel memory controller that supports DDR3 up to 1866 MHz and 1.5TB per server in 4P configurations. AMD has rounded out the chips with four x16 HyperTransport 3.0 links rated at 6.4 GT/s per link. Up to 4 processors per server will be supported, which means a maximum of 64 cores.
With Piledriver, AMD added a number of new instructions including FMA3, BMI, and F16c. The company has also implemented server tweaks to the Bulldozer design to improve branch prediction, instructions per clock, scheduling, and reduced the power draw at higher clockspeeds allowing for the chps to clock higher while staying within the same power envelope of the Bulldozer-based Opteron 6200 series.
AMD is using the same socket as the 6200 series processors, and the new chips can be deployed as an upgrade to the old servers without needing a new motherboard.
When pitting the new Opteron 6380 to the previous-generation 6278, AMD is claiming a number of performance increases, including a 24-percent and 40-percent improvement in SPECjob2005 and SPECpower_ssj2008 respectively.
Further, the company is claiming competitive performance in server workloads with the Intel competition. AMD offers up benchmarks showing the Opteron 6380 and Xeon E5-2690 trading wins, with the AMD part being slower in the STREAM benchmark, but being slightly faster in LAMPS and NAMD. The allure of the Opteron, according to AMD is that the AMD part is almost half the price of the Intel processor, and is hoping the lower priced parts will encourage adoption. AMD argues that the money saved could easily go towards more RAM or more storage (or simply be saved of course).
The company has announced that its first major design win is Big Red II supercomputer at Indiana University. Built by Cray, the Big Red II will feature 21,000+ Opteron 6300-series CPU cores paired with NVIDIA GPUs. It represents a massive increase in computing power over IU’s previous Big Red supercomputer with 4,100 CPU cores, and will be used for medical, physics, chemistry, and climate research. Beyond that, AMD has stated more that 30 hardware vendors are slated to introduce servers based on the new Piledriver-based Opteron processors including HP, Dell, Cray, SGI, Supermicro, Sugon, and (of course) SeaMicro. On the software side of things, AMD is working with Microsoft, VMware, Xen, Red Hat, and Openstack. The company also stated that it is leaning on the experience and knowledge gained from the HSA Foundation to improve software support and guide the future direction of Opteron development.
The Opteron 6300 series is an interesting release that brings several improvements to the company’s server chip offerings. At launch, there are 10 processors to choose from, ranging from the quad core 6308 clocked at 3.5GHz for $501 to the top-end 6386 SE with 16 cores (2.8GHz base, 3.5GHz max turbo) and a $1,392 price tag. The 6366HE is an interesting part as well. It is the same price as the 12-core, 115W TDP Opteron 6348, but its has 16 lower-clocked cores and an 85W TDP. With the non-HE edition processors with 16 cores starting at $703, the 6366HE for $575 is a decent deal if you need multi-threading more than a fewer number of higher clocked cores.
Another bit that I found intriguing is that in a few years, AMD will (likely, if all goes according to plan) be offering processors for just about every type of server. They will have low cost, low power ARM Cortex-A57 based chips, Accelerated Processing Units (APUs) well suited to mixed workloads including GPU-accelerated tasks, and CPU-only chips with lots of traditional x86-64 cores. It seems that Intel will continue to hold the high end on pure performance, but AMD and its SeaMicro server division have not given up competing in the server room by a long shot.
The Piledrive architecture and Vishera desktop CPU review and The future of AMD: Vishera and Beyond at PC Perspective.