Subject: General Tech | April 9, 2018 - 11:20 PM | Tim Verry
Tagged: micron, manufacturing, IMFT NAND, flash memory, fab, cleanroom, 64-Layer, 3d nand
Micron Technologies recently began construction on a multi-billion-dollar cleanroom facility for research and development of its 3D NAND technologies. The new facility is being built adjacent to Micron’s existing NAND fabrication complex at 1 North Coast Drive where Micron invested $4 Billion to expand in 2016. Micron did not disclose its exact investment in the new cleanroom space except to say that it was a multi-billion-dollar project.
Micron’s expanded 300mm 3D NAND manufacturing complex is part of its NAND Center of Excellence, and the new facility that is under construction will expand the company’s ability to increase its research and development efforts and allow Micron to push “even more intricate designs” according to Sanjay Mehrotra (Micron President and CEO). for its 3D flash memory. The new facility will be staffed by the new hires which will mainly be engineers and technicians specializing in 3D NAND manufacturing and will include as many as 600 fresh graduates.
Construction of the new manufacturing and cleanroom space is slated for completion in mid-2019 with initial wafer output by the fourth quarter of next year. Unfortunately, this facility is not intended to add additional wafer capacity (at least at this time) so those hoping for increased supply of NAND chips and cheaper SSDs will have to keep waiting. Rather, this facility is going to be used for R&D and its manufacturing will be used to produce more advanced flash and experiment with new manufacturing methods for increasingly complicated stacked and denser die designs instead of beefing up supply of its current memory chips that are being used in current products.
Satellite view of Micron's existing 300mm NAND fabrication facility in northern Singapore.
Along with the new 3D NAND facility, Micron will be adding 1,000 new jobs to its existing workforce in Singapore of 7,500 over the next five years per a deal with Singapore’s Economic Development Board. Business Times and Channel News Asia note that over the past 20 years Micron has invested heavily in Singapore – north of $20 billion.
I am glad to see Micron pushing forward with its 3D NAND especially following the breakup with Intel wherein the two companies have decided to complete the development of third generation 3D NAND together and then to develop 3D NAND independently. Interestingly, Intel and Micron did not totally dissolve the IMFT joint venture as they will continue collaborating on 3D XPoint at the fab in Lehi, Utah which according to Intel is now entirely focused on XPoint memory. That was something I was curious about when first reading of the breakup early this year and happened to come across when writing this story. That press release notes that Intel and Micron are currently producing second generation 64-layer IMFT flash and developing higher density third generation flash which is slated for production next year (after which Micron and Intel will go their separate ways on NAND), so this may be a major reason for Micron building out new multi-billion-dollar fab space for NAND R&D.
Subject: General Tech | July 12, 2011 - 11:15 AM | Jeremy Hellstrom
Tagged: new york, GLOBALFOUNDRIES, fab 8, fab 1, dresden, cleanroom
Milpitas, Calif. – July 12, 2011 – Just over one year after revealing plans for a major global capacity expansion, GLOBALFOUNDRIES today announced its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment. Achieving “Ready for Equipment” (RFE) status marks the transition from the construction phase to the operations phase—a significant milestone on the path to volume manufacturing in these new facilities.
“At GLOBALFOUNDRIES, we continue to invest aggressively in driving sustained growth on advanced technologies,” said GLOBALFOUNDRIES CEO Ajit Manocha. “The build-out of our 300mm manufacturing campuses in New York and Dresden is supporting growing customer demand for advanced technologies, while creating hundreds of jobs and providing a significant boost to the economies in the surrounding regions. By completing these massive construction projects on schedule and on budget, we are continuing to deliver on our commitment to being the only truly global foundry.”
At Fab 1 in Dresden, Germany, GLOBALFOUNDRIES has completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project will add more than 110,000 square feet of cleanroom space to the site and will allow Fab 1 to operate as one integrated cleanroom. This extension will make Dresden the largest wafer fab in Europe for leading-edge technology.
At Fab 8, GLOBALFOUNDRIES’ newest semiconductor manufacturing facility under construction at the Luther Forest Technology Campus in Saratoga County, New York, the RFE date was moved up by nearly two months to meet heavy customer demands. Last week, GLOBALFOUNDRIES moved into the facility’s Admin 1 office building and broke ground on the Admin 2 building. Once completed, Fab 8 will stand as the most technologically advanced wafer fab in the world and the largest leading-edge semiconductor foundry in the United States. When fully built-out and ramped, the total available cleanroom space will be approximately 300,000 square feet and will be capable of a total output of approximately 60,000 wafers per month. The total facility, including cleanroom support infrastructure and office space, includes approximately 1.9 million square feet of space and is expected to come online in 2012 with volume production targeted for early 2013. Fab 8 will focus on leading-edge manufacturing at 28nm and below.