Subject: General Tech | January 6, 2016 - 04:31 AM | Ken Addison
Tagged: video, spec alpha, podcast, msi, GT72S Tobii, GS40 Phantom, gigabyte, corsair, CES 2016, CES, carbide, brix, arm, 400Q, 400C
CES 2016 Podcast Day 2 - 01/06/16
Join us for announcements from MSI, Gigabyte, Corsair, and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
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Hosts: Ryan Shrout, Josh Walrath, Ken Addison and Sebastian Peak
Program length: 1:02:45
Looking Towards 2016
ARM invited us to a short conversation with them on the prospects of 2016. The initial answer as to how they feel the upcoming year will pan out is, “Interesting”. We covered a variety of topics ranging from VR to process technology. ARM is not announcing any new products at this time, but throughout this year they will continue to push their latest Mali graphics products as well as the Cortex A72.
Trends to Watch in 2016
The one overriding trend that we will see is that of “good phones at every price point”. ARM’s IP scales from very low to very high end mobile SOCs and their partners are taking advantage of the length and breadth of these technologies. High end phones based on custom cores (Apple, Qualcomm) will compete against those licensing the Cortex A72 and A57 parts for their phones. Lower end options that are less expensive and pull less power (which then requires less battery) will flesh out the midrange and budget parts. Unlike several years ago, the products from top to bottom are eminently usable and relatively powerful products.
Camera improvements will also take center stage for many products and continue to be a selling point and an area of differentiation for competitors. Improved sensors and software will obviously be the areas where the ARM partners will focus on, but ARM is putting some work into this area as well. Post processing requires quite a bit of power to do quickly and effectively. ARM is helping here to leverage the Neon SIMD engine and leveraging the power of the Mali GPU.
4K video is becoming more and more common as well with handhelds, and ARM is hoping to leverage that capability in shooting static pictures. A single 4K frame is around 8 megapixels in size. So instead of capturing video, the handheld can achieve a “best shot” type functionality. So the phone captures the 4K video and then users can choose the best shot available to them in that period of time. This is a simple idea that will be a nice feature for those with a product that can capture 4K video.
Subject: Processors, Mobile | December 1, 2015 - 07:30 AM | Scott Michaud
Tagged: TSMC, SoC, LG, Intel, arm
So this story came out of nowhere. Whether the rumors are true or false, I am stuck on how everyone seems to be talking about it with a casual deadpan. I spent a couple hours Googling whether I missed some big announcement that made Intel potentially fabricating ARM chips a mundane non-story. Pretty much all that I found was Intel allowing Altera to make FPGAs with embedded ARM processors in a supporting role, which is old news.
Image Credit: Internet Memes...
The rumor is that Intel and TSMC were both vying to produce LG's Nuclon 2 SoC. This part is said to house two quad-core ARM modules in a typical big.LITTLE formation. Samples were allegedly produced, with Intel's part (2.4 GHx) being able to clock around 300 MHz faster than TSMC's offering (2.1 GHz). Clock rate is highly dependent upon the “silicon lottery,” so this is an area that production maturity can help with. Intel's sample would also be manufactured at 14nm (versus 16nm from TSMC although these numbers mean less than they used to). LG was also, again allegedly, interesting in Intel's LTE modem. According to the rumors, LG went with TSMC because they felt Intel couldn't keep up with demand.
Now that the rumor has been reported... let's step back a bit.
I talked with Josh a couple of days ago about this post. He's quite skeptical (as I am) about the whole situation. First and foremost, it takes quite a bit of effort to port a design to a different manufacturing process. LG could do it, but it is questionable, especially for a second chip ever sort of thing. Moreover, I still believe that Intel doesn't want to manufacture chips that directly compete with them. x86 in phones is still not a viable business, but Intel hasn't given up and you would think that's a prerequisite.
So this whole thing doesn't seem right.
Subject: General Tech | November 18, 2015 - 12:47 AM | Tim Verry
Tagged: SFF, hdmi stick, hdmi, chromebit, chrome os, asus, arm
Small form factor PCs are big this year, and Google is about to get into the game with its own HDMI dongle PC running Chrome OS. Google has partnered with Asus to release the Chromebit CS10 which is now avaialble for $85.
The small stick PC weighs 75 grams (2.6 ounces) and will come in black, orange, and eventually blue colors. The Chromebit is about the size of a flash drive with an HDMI port on one end, DC power input on one side, and a single USB 2.0 port on the other end. A removeable cap protects the HDMI output. It is small enough that you can toss it into a bag or tuck it behind a monitor or kiosk permanently. Asus includes an AC power adapter (18W, 1.5 amps) and a flexible HDMI connector (or a short extension cable depending on the region) along with velco stickers in the box.
The Chromebit CS10 is powered by a quad core Rockchip 3288-C SoC featuring four ARM Cortex A17 CPU cores and a Mali T624 GPU. The SoC is paired with 2GB of LPDDR3 memory and 16GB of eMMC storage. Connectivity includes 802.11ac Wi-Fi and Bluetooth 4.0 radios along with the USB 2.0 port. Users can hook up a bluetooth keyboard and mouse and use the USB port for extra storage, or hook up even more devices using a USB hub.
So far, reviews are positive and generally state that (for example) while the Rockchip ARM processor is no racehorse, it is good enough for basic web browsing, media streaming, and document editing.
Of course, the Chromebit runs the Chrome web browser, but it also can run any of the apps from the Chrome Web Store including Netflix, Office, and any number of free games. Asus is aiming the Chromebit at digital signage, kiosk, thin clients for schools, and for on-the-go travelers.
The Chromebit CS10 is available soon (it is listed as out of stock on Newegg and has not shown up on Amazon or other sites yet) for $85 in the US, UK, Australia, Canada, Denmark, Finland, Japan, New Zealand, Norway, Spain, Sweden, and Taiwan. Business customers can further purchase the ability to use the Chromebit in a locked down single-app kiosk mode for $24 per user, per year from CDW.
- Intel Compute Stick Review
- Kangaroo is a Pocket-Sized Battery-Powered Windows 10 PC
- Google Chromecast coverage
Subject: General Tech | October 29, 2015 - 02:16 PM | Jeremy Hellstrom
Tagged: open source, arm, Cortex A9, debian, Novena
A pair of engineers in Singapore, Andrew "Bunny" Huang and Sean Cross, have developed a working laptop which was designed to be completely open sourced, with no proprietary drivers or software of any kind. The Novena laptop is powered by a Cortex A9 and an FPGA and runs Debian, even communications are handled by a software-defined radio board. This is more of a proof of concept than a marketable machine but the links at The Register will take you to the details on how you could build one yourself. Even the bezel is open source and modifiable, it is a laptop with an upgradable screen!
"This week, the pair developing the Novena open laptop have provided an update on their work. The idea is to develop a usable system that is completely open to customization and scrutiny – from the electronics to the firmware to the operating system to the applications."
Here is some more Tech News from around the web:
- Ex-Microsoft craft ale buffs rattle tankard for desktop brewery @ The Register
- Siri Won't Answer Some Questions If You're Not Subscribed To Apple Music @ Slashdot
- Microsoft fires Arrow, it's first official Android Launcher @ The Inquirer
Subject: Processors | October 12, 2015 - 12:24 PM | Sebastian Peak
Tagged: servers, qualcomm, processor, enterprise, cpu, arm, 24-core
Another player emerges in the CPU landscape: Qualcomm is introducing its first socketed processor for the enterprise market.
Image credit: PC World
A 24-core design based on 64-bit ARM architecture has reached the prototype phase, in a large LGA package resembling an Intel Xeon CPU.
From the report published by PC World:
"Qualcomm demonstrated a pre-production chip in San Francisco on Thursday. It's a purpose-built system-on-chip, different from its Snapdragon processor, that integrates PCIe, storage and other features. The initial version has 24 cores, though the final part will have more, said Anand Chandrasekher, Qualcomm senior vice president."
Image credit: PC World
Qualcomm built servers as proof-of-concept with this new processor, "running a version of Linux, with the KVM hypervisor, streaming HD video to a PC. The chip was running the LAMP stack - Linux, the Apache Web server, MySQL, and PHP - and OpenStack cloud software," according to PC World. The functionality of this design demonstrate the chip's potential to power highly energy-efficient servers, making an obvious statement about the potential cost savings for large data companies such as Google and Facebook.
Business Model Based on Partnerships
|Alexandru Voica works for Imagination Technologies. His background includes research in computer graphics at the School of Advanced Studies Sant'Anna in Pisa and a brief stint as a CPU engineer, working on several high-profile 32-bit processors used in many mobile and embedded devices today. You can follow Alex on Twitter @alexvoica.|
Some months ago my colleague Rys Sommefeldt wrote an article offering his (deeply) technical perspective on how a chip gets made, from R&D to manufacturing. While his bildungsroman production covers a lot of the engineering details behind silicon production, it is light on the business side of things; and that is a good thing because it gives me opportunity to steal some of his spotlight!
This article will give you a breakdown of the IP licensing model, describing the major players and the relationships between them. It is not designed to be a complete guide by any means and some parts might already sound familiar, but I hope it is a comprehensive overview that can be used by anyone who is new to product manufacturing in general.
The diagram below offers an analysis of the main categories of companies involved in the semiconductor food chain. Although I’m going to attempt to paint a broad picture, I will mainly offer examples based on the ecosystem formed around Imagination (since that is what I know best).
A simplified view of the manufacturing chain
Let’s work our way from left to right.
Traditionally, these are the companies that design and sell silicon IP. ARM and Imagination Technologies are perhaps the most renowned for their sub-brands: Cortex CPU + Mali GPU and MIPS CPU + PowerVR GPU, respectively.
Given the rapid evolution of the semiconductor market, such companies continue to evolve their business models beyond point solutions to become one-stop shops that offer more than for a wide variety of IP cores and platforms, comprising CPUs, graphics, video, connectivity, cloud software and more.
Subject: Editorial | May 21, 2015 - 03:34 PM | Ken Addison
Tagged: podcast, video, amd, hbm, Fiji, g-sync, ips, XB270HU, corsair, Oculus, supermicro, asus, gladius, jem davies, arm, mali
PC Perspective Podcast #350 - 05/21/2015
Join us this week as we discuss AMD's plan for HBM, IPS G-SYNC, GameWorks and The Witcher 3, and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
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Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano
Program length: 1:24:12
Week in Review:
News item of interest:
Hardware/Software Picks of the Week:
Sebastian: Aukey Quick Charge 2.0 Portable Charger
Subject: Mobile | May 15, 2015 - 01:56 PM | Ryan Shrout
Tagged: video, mali, jem davies, interview, arm
Have you ever wondered how a mobile GPU is born? Or how the architecture of a mobile GPU like ARM Mali differs from the technology in your discrete PC graphics card? Perhaps you just want to know if ideas like HBM (high bandwidth memory) are going to find their way into the mobile ecosystem any time soon?
Josh and I sat down (virtually) with ARM's VP of Technology and Fellow, Jem Davies, to answer these questions and quite a bit more. The resulting interview will shed light on the design process of a mobile GPU, how you get the most out of an SoC that measures power by the milliwatt, what the world of mobile benchmarking needs to do to clean up its act and quite a bit more.
You'd be hard pressed to find a better way to spend the next hour of your day as you will without a doubt walk away more informed about the world of smartphones, tablets and GPUs.
Some Fresh Hope for 2016
EDIT 2015-05-07: A day after the AMD analyst meeting we now know that the roadmaps delivered here are not legitimate. While some of the information is likely correct on the roadmaps, they were not leaked by AMD. There is no FM3 socket, rather AMD is going with AM4. AMD will be providing more information throughout this quarter about their roadmaps, but for now take all of this information as "not legit".
SH SOTN has some eagle eyes and spotted the latest leaked roadmap for AMD. These roadmaps cover both mobile and desktop, from 2015 through 2016. There are obviously quite a few interesting tidbits of information here.
On the mobility roadmap we see the upcoming release of Carrizo, which we have been talking about since before CES. This will be the very first HSA 1.0 compliant part to hit the market, and AMD has done some really interesting things with the design in terms of performance, power efficiency, and die size optimizations. Carrizo will span the market from 15 watts to 35 watts TDP. This is a mobile only part, but indications point to it being pretty competent overall. This is a true SOC that will support all traditional I/O functions of older standalone southbridges. Most believe that this part will be manufactured by GLOBALFOUNDIRES on their 28 nm HKMG process that is more tuned to AMD's APU needs.
Carrizo-L will be based on the Puma+ architecture and will go from 10 watts to 15 watts TDP. This will use the same FP4 BGA connection as the big Carrizo APU. This should make these parts more palatable for OEMs as they do not have to differentiate the motherboard infrastructure. Making things easier for OEMs will give more reasons for these folks to offer products based on Carrizo and Carrizo-L APUs. The other big reason will be the GCN graphics compute units. Puma+ is a very solid processor architecture for low power products, but these parts are still limited to the older 28 nm HKMG process from TSMC.
One interesting addition here is that AMD will be introducing their "Amur" APU for the low power and ultra-low power markets. These will be comprised of four Cortex-A57 CPUs combined with AMD's GCN graphics units. This will be the first time we see this combination, and the first time AMD has integrated with ARM since ATI spun off their mobile graphics to Qualcomm under the "Adreno" branding (anagram for "Radeon"). What is most interesting here is that this APU will be a 20 nm part most likely fabricated by TSMC. This is not to say that Samsung or GLOBALFOUNDRIES might be producing it, but those companies are expending their energy on the 14 nm FinFET process that will be their bread and butter for years to come. This will be a welcome addition to the mobile market (tablets and handhelds) and could be a nice profit center for AMD if they are able to release this in a timely manner.
2016 is when things get very interesting. The Zen x86 design will dominate the upper 2/3 of the roadmap. I had talked about Zen when we had some new diagram leaks yesterday, but now we get to see the first potential products based off of this architecture. In mobile it will span from 5 watts to 35 watts TDP. The performance and mainstream offerings will be the "Bristol Ridge" APU which will feature 4 Zen cores (or one Zen module) combined with the next gen GCN architecture. This will be a 14nm part, and the assumption is that it will be GLOBALFOUNDRIES using 14nm FinFET LPP (Low Power Plus) that will be more tuned for larger APUs. This will also be a full SOC.
The next APU will be codenamed "Basilisk" that will span the 5 watt to 15 watt range. It will be comprised of 2 Zen cores (1/2 of a Zen module) and likely feature 2 to 4 MB of L3 cache, depending on power requirements. This looks to be the first Skybridge set of APUs that will share the same infrastructure as the ARM based Amur SOC. FT4 BGA is the basis for both the 2015 Amur and 2016 Basilisk SOCs.
Finally we have the first iteration of AMD's first ground up implementation of ARM's ARMv8-A ISA. The "Styx" APU features the new K12 CPU cores that AMD has designed from scratch. It too will feature the next generation GCN units as well as share the same FT4 BGA connection. Many are anxiously watching this space to see if AMD can build a better mousetrap when it comes to licensing the ARM ISA (as have Qualcomm, NVIDIA, and others).
2015 shows no difference in the performance desktop space, as it is still serviced by the now venerable Piledriver based FX parts on AM3+. The only change we expect to see here is that there will be a handful of new motherboard offerings from the usual suspects that will include the new USB 3.1 functionality derived from a 3rd party controller.
Mainstream and Performance will utilize the upcoming Godavari APUs. These are power and speed optimized APUs that are still based on the current Kaveri design. These look to be a simple refresh/rebadge with a slight performance tweak. Not exciting, but needs to happen for OEMs.
Low power will continue to be addressed by Beema based APUs. These are regular Puma based cores (not Puma+). AMD likely does not have the numbers to justify a new product in this rather small market.
2016 is when things get interesting again. We see the release of the FM3 socket (final proof that AM3+ is dead) that will house the latest Zen based APUs. At the top end we see "Summit Ridge" which will be composed of 8 Zen cores (or 2 Zen modules). This will have 4 MB of L2 cache and 16 MB of L3 cache if our other leaks are correct. These will be manufactured on 14nm FinFET LPE (the more appropriate process product for larger, more performance oriented parts). These will not be SOCs. We can expect these to be the basis of new Opterons as well, but there is obviously no confirmation of that on these particular slides. This will be the first new product in some years from AMD that has the chance to compete with higher end desktop SKUs from Intel.
From there we have the lower power Bristol Ridge and Basilisk APUs that we already covered in the mobile discussion. These look to be significant upgrades from the current Kaveri (and upcoming Godavari) APUs. New graphics cores, new CPU cores, and new SOC implementations where necessary.
AMD will really be shaking up the game in 2016. At the very least they will have proven that they can still change up their game and release higher end (and hopefully competitive) products. AMD has enough revenue and cash on hand to survive through 2016 and 2017 at the rate they are going now. We can only hope that this widescale change will allow AMD to make some significant inroads with OEMs on all levels. Otherwise Intel is free to do what they want and what price they want across multiple markets.