AMD Shows Off Trinity APU based on Bulldozer, APU for Tablets

Subject: Processors, Shows and Expos | June 1, 2011 - 09:28 AM |
Tagged: trinity, llano, fusion, computex, bulldozer, APU, amd

While talking up the new 900-series of chipset and the branding for the upcoming AMD Llano APU launch, AMD did surprise us by showing off a bit more of the future than typical.  Rick Bergman, general manager of the AMD Product Group, pulled a Trinity-based APU out of his pocket to demonstrate the conviction of staying on a "one-APU-per-year" cycle in the years to come.

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While it looks just like any other AMD processors from a distance, this Trinity APU is based on the Bulldozer x86 architecture (which will see the first release as a CPU only later this year) and combines some amount of SIMD-units (aka Radeon cores) for a CPU/GPU combo.  This will be the part that succeeds Llano, due out in a few short days.

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This roadmap shows the cadence of once a year will be the norm for AMD going forward and that AMD plans to introduce an APU for the tablet market sometime in 2012.  It will be interesting to see how late to the game AMD is in this arena and if they can compete with what ARM is doing or even what Intel will be doing with Medfield. 

Computex 2011 Coverage brought to you by MSI Computer and Antec

Source: AMD

AMD Announces Two New G Series APU For Embedded Systems

Subject: Processors | May 24, 2011 - 01:50 PM |
Tagged: processor, cpu, APU, amd

Recently, AMD launched two new AMD Embedded G-Series APUs (Accelerated Processing Units). The two new chips have a TDP rating of 5.5 and 6.4 watts, which represent a 39% improvement in power savings over the previous iterations. The 361mm² chip package is capable of being used in embedded systems without the need for a fan to cool it. The embedded chips include one or two low power x86 Bobcat processors and a discrete class DirectX 11 GPU on a single die.

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AMD currently has three systems utilizing the new APUs, including a Pico-ITX form factor computer, a Qseven form factor computer, and a digital sign system. Buddy Broeker, the Director of Embedded Solutions for AMD stated that "today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement."

The two new chips are named the T40R and the T40E.  The chips both run at 1.00GHz; however, the 6.4 watt TDP T40E is a dual core chip and the 5.5 watt TDP T40R is a single core variant.  Both chips include an AMD Radeon 6250 GPU, a 64KB L1 cache, and a 512KB L2 cache per each CPU core.  Further, the chips feature an integrated DDR3 memory controller that can support up to 667MHz solder-down SODIMMs or two DIMM slots.  More details on the series as a whole can be found here.

Mobile and embedded processors continue to get smaller and faster. Have you seen any AMD powered embedded technology in your town?

Source: AMD