The recent iOS 11 updates are a little patchy when it comes to security

Subject: General Tech | December 4, 2017 - 01:45 PM |
Tagged: security, ios 11, apple

Two issues have arisen with the recent patches Apple released.  The first issue is the possible return of the blank root password issue, as it seems if you install the security patch before upgrading your Mac from 10.13 to 10.13.1 you are once again vulnerable.  Thankfully the fix described at The Inquirer is rather simple; reboot if you have recently upgraded and the patch will reinstall.

The second issue is a little more complex and harder to solve.  The Register heard from a security researcher about an issue that the new iOS update creates, the ability to create a brand new encrypted phone backup without needing the password of the current backup.  Previously once you created a backup of your phone on iTunes, you needed to enter the password you chose at that time in order to create a new one.  With the new iOS that is no longer necessary, you can create a completely new one at any time, a problem if someone circumvents the devices PIN as that backup contains a huge amount of data about your phone as well as any and all software on it.  As the backup can be stored remotely, this gives an attacker all the time in the world to peruse any accounts and passwords stored on your phone.  It doesn't seem like this is something Apple plans to fix, either.

Encrypt-iPhone-backup-copy.png

"Oleg Afonin, a security researcher for password-cracking forensic IT biz Elcomsoft, in a blog post on Wednesday called iOS 11 "a horror story" due to changes the fruit-themed firm made to its mobile operating system that stripped away a stack of layered defenses."

Here is some more Tech News from around the web:

Tech Talk

 

Source: The Register

Intel Announces New CPUs Integrating AMD Radeon Graphics

Subject: Processors | November 6, 2017 - 02:00 PM |
Tagged: radeon, Polaris, mobile, kaby lake, interposer, Intel, HBM2, gaming, EMIB, apple, amd, 8th generation core

In what is probably considered one of the worst kept secrets in the industry, Intel has announced a new CPU line for the mobile market that integrates AMD’s Radeon graphics.  For the past year or so rumors of such a partnership were freely flowing, but now we finally get confirmation as to how this will be implemented and marketed.

Intel’s record on designing GPUs has been rather pedestrian.  While they have kept up with the competition, a slew of small issues and incompatibilities have plagued each generation.  Performance is also an issue when trying to compete with AMD’s APUs as well as discrete mobile graphics offerings from both AMD and NVIDIA.  Software and driver support is another area where Intel has been unable to compete due largely to economics and the competitions’ decades of experience in this area.

intel-8th-gen-cpu-discrete-graphics-2.jpg

There are many significant issues that have been solved in one fell swoop.  Intel has partnered with AMD’s Semi-Custom Group to develop a modern and competent GPU that can be closely connected to the Intel CPU all the while utilizing HBM2 memory to improve overall performance.  The packaging of this product utilizes Intel’s EMIB (Embedded Multi-die Interconnect Bridge) tech.

EMIB is an interposer-like technology that integrates silicon bridges into the PCB instead of relying upon a large interposer.  This allows a bit more flexibility in layout of the chips as well as lowers the Z height of the package as there is not a large interposer sitting between the chips and the PCB.  Just as interposer technology allows the use of chips from different process technologies to work seamlessly together, EMIB provides that same flexibility.

The GPU looks to be based on the Polaris architecture which is a slight step back from AMD’s cutting edge Vega architecture.  Polaris does not implement the Infinity Fabric component that Vega does.  It is more conventional in terms of data communication.  It is a step beyond what AMD has provided for Sony and Microsoft, who each utilize a semi-custom design for the latest console chips.  AMD is able to integrate the HBM2 controller that is featured in Vega.  Using HBM2 provides a tremendous amount of bandwidth along with power savings as compared to traditional GDDR-5 memory modules.  It also saves dramatically on PCB space allowing for smaller form factors.

intel_tech_manu_embedded_multi_die_interconnect_bridge-100715607-orig.jpg

EMIB provides nearly all of the advantages of the interposer while keeping the optimal z-height of the standard PCB substrate.

Intel did have to do quite a bit of extra work on the power side of the equation.  AMD utilizes their latest Infinity Fabric for fine grained power control in their upcoming Raven Ridge based Ryzen APUs.  Intel had to modify their current hardware to be able to do much the same work with 3rd party silicon.  This is no easy task as the CPU needs to monitor and continually adjust for GPU usage in a variety of scenarios.  This type of work takes time and a lot of testing to fine tune as well as the inevitable hardware revisions to get thing to work correctly.  This then needs to be balanced by the GPU driver stack which also tends to take control of power usage in mobile scenarios.

This combination of EMIB, Intel Kaby Lake CPU, HBM2, and a current AMD GPU make this a very interesting combination for the mobile and small form factor markets.  The EMIB form factor provides very fast interconnect speeds and a smaller footprint due to the integration of HBM2 memory.  The mature AMD Radeon software stack for both Windows and macOS environments provides Intel with another feature in which to sell their parts in areas where previously they were not considered.  The 8th Gen Kaby Lake CPU provides the very latest CPU design on the new 14nm++ process for greater performance and better power efficiency.

This is one of those rare instances where such cooperation between intense rivals actually improves the situation for both.  AMD gets a financial shot in the arm by signing a large and important customer for their Semi-Custom division.  The royalty income from this partnership should be more consistent as compared to the console manufacturers due to the seasonality of the console product.  This will have a very material effect on AMD’s bottom line for years to come.  Intel gets a solid silicon solution with higher performance than they can offer, as well as aforementioned mature software stack for multiple OS.  Finally throw in the HBM2 memory support for better power efficiency and a smaller form factor, and it is a clear win for all parties involved.

intel-8th-gen-cpu-discrete-graphics.jpg

The PCB savings plus faster interconnects will allow these chips to power smaller form factors with better performance and battery life.

One of the unknowns here is what process node the GPU portion will be manufactured on.  We do not know which foundry Intel will use, or if they will stay in-house.  Currently TSMC manufactures the latest console SoCs while GLOBALFOUNDRIES handles the latest GPUS from AMD.  Initially one would expect Intel to build the GPU in house, but the current rumor is that AMD will work to produce the chips with one of their traditional foundry partners.  Once the chip is manufactured then it is sent to Intel to be integrated into their product.

Apple is one of the obvious candidates for this particular form factor and combination of parts.  Apple has a long history with Intel on the CPU side and AMD on the GPU side.  This product provides all of the solutions Apple needs to manufacture high performance products in smaller form factors.  Gaming laptops also get a boost from such a combination that will offer relatively high performance with minimal power increases as well as the smaller form factor.

core-radeon-leak.png

The potential (leaked) performance of the 8th Gen Intel CPU with Radeon Graphics.

The data above could very well be wrong about the potential performance of this combination.  What we see is pretty compelling though.  The Intel/AMD product performs like a higher end CPU with discrete GPU combo.  It is faster than a NVIDIA GTX 1050 Ti and trails the GTX 1060.  It also is significantly faster than a desktop AMD RX 560 part.  We can also see that it is going to be much faster than the flagship 15 watt TDP AMD Ryzen 7 2700U.  We do not yet know how it compares to the rumored 65 watt TDP Raven Ridge based APUs from AMD that will likely be released next year.  What will be fascinating here is how much power the new Intel combination will draw as compared to the discrete solutions utilizing NVIDIA graphics.

To reiterate, this is Intel as a customer for AMD’s Semi-Custom group rather than a licensing agreement between the two companies.  They are working hand in hand in developing this solution and then both profiting from it.  AMD getting royalties from every Intel package sold that features this technology will have a very positive effect on earnings.  Intel gets a cutting edge and competent graphics solution along with the improved software and driver support such a package includes.

Update: We have been informed that AMD is producing the chips and selling them directly to Intel for integration into these new SKUs. There are no royalties or licensing, but the Semi-Custom division should still receive the revenue for these specialized products made only for Intel.

Source: Intel

Podcast #470 - Intel VROC, AMD TR RAID, Google Pixel 2, and more!

Subject: General Tech | October 5, 2017 - 10:39 AM |
Tagged: Zotac Zbox, Z370 Godlike, VROC, video, usb 3.2, Samsung Odyssey, ryzen, PS2000e, podcast, Pixel 2 XL, Pixel 2, Pinnacle, msi, lumberyard, Intel, Grado, google, Glaive, cryorig h5 ultimate, corsair, Cooler Master Cosmos C700P, AWS, apple, amd, a11

PC Perspective Podcast #470 - 10/05/17

Join us for discussion on Intel VROC, AMD TR RAID, Google Pixel 2, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jermey Hellstrom, Josh Walrath, Allyn Malventano

Peanut Gallery: Alex Lustenberg

Program length: 1:41:19

Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
    1. Allyn: 1:38:20 Want a big SATA SSD?
  4. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

Source:

A handy list of tricks you might have forgotten you knew

Subject: General Tech | October 2, 2017 - 12:44 PM |
Tagged: microsoft, windows, apple

TechSpot posted an article compiling a variety of tips on making Windows and MacOS do what you want as well as numerous applications you can use for a variety of tasks.  The recommendations run from the classic obfuscated Windows "God Mode" folder which contains links to the majority of the tools you can use on your system to basic keyboard shortcuts.  If you are trying to figure out where all your storage space went, Space Sniffer for Windows or GrandPerspective for Macs will help you far more than random searches for large folders.  You will probably already know a great number of these tips but it is nice to have a long list compiled in a single location.

Windows_7_godmode.PNG

"Many hardcore computer users might consider themselves above learning new tricks, but there are always new ways to sharpen your skills on the PC and we bet that you will find at least one useful thing here that you didn't know before."

Here is some more Tech News from around the web:

Tech Talk

 

Source: Techspot
Subject: Processors, Mobile
Manufacturer: Apple

A New Standard

With a physical design that is largely unchanged other than the addition of a glass back for wireless charging support, and featuring incremental improvements to the camera system most notably with the Plus version, the iPhone 8 and 8 Plus are interesting largely due to the presence of a new Apple SoC. The upcoming iPhone X (pronounced "ten") stole the show at Apple's keynote annoucement earlier this month, but the new A11 Bionic chip powers all 2017 iPhone models, and for the first time Apple has a fully custom GPU after their highly publicized split with Imagination Technologies, makers of the PowerVR graphics found in previous Apple SoCs.

A11_Bionic_Keynote.jpg

The A11 Bionic powering the 2017 iPhones contains Apple’s first 6-core processor, which is comprised of two high performance cores (code-named ‘Monsoon’) and four high efficiency cores (code-named ‘Mistral’). Hugely important to its performance is the fact that all six cores are addressable with this new design, as Apple mentions in their description of the SoC:

"With six cores and 4.3 billion transistors, A11 Bionic has four efficiency cores that are up to 70 percent faster than the A10 Fusion chip, and two performance cores that are up to 25 percent faster. The CPU can even harness all six cores simultaneously when you need a turbo boost."

It was left to improvments to IPC and clock speed to boost the per-core performance of previous Apple SoCs, such as the previous A10 Fusion part, which contained a quad-core CPU split in an even arrangement of 2x performance + 2x efficiency cores. Apple's quad-core effort did not affect app performance beyond the two performance cores, with additional cores limited to background tasks in real-world use (though the A10 Fusion did not provide any improvement to battery life over previous efforts, as we saw).

A11_iFixit.jpg

The A11 Bionic on the iPhone 8 system board (image credit: iFixit)

Just how big an impact this new six-core CPU design will have can be instantly observed with the CPU benchmarks to follow, and on the next page we will find out how Apple's in-house GPU solution compare to both the previous A10 Fusion PowerVR graphics, and market-leading Qualcomm Adreno 540 found in the Snapdragon 835. We will begin with the CPU benchmarks.

Continue reading our look at the performance of Apple's A11 SoC!

Podcast #467 - NVIDIA WhisperMode, HyperX Keyboard, iPhone 8/X, and more!

Subject: General Tech | September 14, 2017 - 12:01 PM |
Tagged: whispermode, video, shadow rock 2, Seasonic FOCUS, Samsung, podcast, nvidia, nuc, MX Ergo, macchina, logitech, iphone x, iphone 8, Intel, hyperx, GTX 1070Ti, Dawson Canyon, Cites: Skylines, BeQuiet, ASUS ZenFone 4 Max, apple, 7nm, 11nm

PC Perspective Podcast #467 - 09/13/17

Join us for discussion on  NVIDIA WhisperMode, HyperX Mechanical Keyboards, iPhone 8/X and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Allyn Malventano

Peanut Gallery: Ken Addison, Alex Lustenberg

Program length: 1:27:20

Podcast topics of discussion: 
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
    1. 1:12:20 Ryan: Logitech MX Ergo
    2. 1:17:15 Jeremy: Macchina is shipping
    3. 1:22:45 Allyn: Alternative black air cooler? (be quiet Shadow Rock 2)
    4. 1:23:45 Alex: Cities: Skylines
  4. Closing/outro
 

Source:

Apple 2017 iPhone Keynote from the PC Perspective - 12:45pm ET / 9:45am PT

Subject: Mobile | September 12, 2017 - 10:01 AM |
Tagged: live, video, apple, keynote, iphone, iphone x, iphone 8

Today we are going to re-broadcast and talk over the Apple keynote, giving you some perspective on the new announcements from a more technical standpoint. We will look into the new CPU and GPU architectures as much as Apple will allow us, and we have a diverse crowd of Apple and Android users to discuss and dissect the new features that the iPhones, Apple TV, Apple Watches, etc. might provide.

We will have the live chat open to take questions and comments as we go! (You can find the live chat over on our PCPer Live! page right here.)

Join us at 12:45pm ET / 9:45am PT!

Source: PCPer Live!

Depth-sensing tech from Qualcomm challenges Apple

Subject: Mobile | August 15, 2017 - 02:30 PM |
Tagged: qualcomm, spectra, depth sensing, apple

New camera and image processing technology from Qualcomm promises to change how Android smartphones and VR headsets see the world. Depth sensing isn’t new to smartphones and tablets, first seeing significant use in Google’s Project Tango and Intel’s RealSense Technology. Tango uses a laser-based implementation that measures roundtrip times bouncing off surfaces but requires a bulky lens on the rear of the device. Early Tango phones like the Lenovo Phab 2 were hindered by large size requirements as a result. Intel RealSense was featured in the Dell Venue 8 7000 tablet and allowed the camera to adjust depth of field and focal points after the image had been capturing. It used a pair of cameras and calculated depth based on parallax mapping between them, just as the human eye works.

Modern devices like the iPhone 7 Plus and Samsung Galaxy S8 offer faux-depth perception for features like portrait photo modes. In reality, they only emulate the ability to sense depth by use different range camera lenses and don’t provide true depth mapping capability.

New technology and integration programs at Qualcomm are working to improve the performance, capability, and availability of true depth sensing technology for Android-based smartphones and VR headsets this year. For the entry-level market devices that today do not have the ability to utilize depth sensing, a passive camera module was built to utilize parallax displacement and estimate depth. This requires two matching camera lenses and a known offset distance between them. Even low-cost phones will have the ability to integrate image quality enhancements like blurred bokeh and basic mixed or augmented reality, bringing the technology to a mass market.

The more advanced integration of the Qualcomm Spectra module program provides active depth sensing with a set of three devices. A standard high resolution camera is paired with both an infrared projector and an infrared camera that are utilized for high resolution depth map creation. The technology projects an infrared image with a preset pattern into the world, invisible to the human eye, but picked up by the IR camera. The Spectra image processor on the Qualcomm Snapdragon mobile platform then measures the displacement and deformations of the pattern to determine the depth and location of the items in the physical world. This is done in real-time, at high frame rates and high resolution to create a 10,000 data point “cloud” in a virtual 3D space.

depth1.png

For consumers this means more advanced security and advanced features on mobile devices. Face detection and mapping that combines the standard camera input along with the IR depth sensing combination will allow for incredibly accurate and secure authentication. Qualcomm claims that the accuracy level is high enough to prevent photos of faces and even 3D models of faces from unlocking the device thanks to interactions of human skin and eyes with IR light.

3D reconstruction of physical objects will also be possible with active depth sensing, allowing gamers to bring real items into virtual worlds. It also allows designers to accurately measure physical spaces that they can look through in full 3D. Virtual reality and augmented reality will benefit from the increased accuracy of its localization and mapping algorithms, improving the “inside-out” tracking capabilities of dedicated headsets and slot-in devices like Samsung’s Gear VR and Google Daydream.

depth2.png

Though the second generation Qualcomm Spectra ISP (image sensor processor) is required for the complex compute tasks that depth sensing will create, the module program the company has created is more important for the adoption, speed of integration, and cost of the technology to potential customers. By working with companies like Sony for image sensors and integration on modules, Qualcomm has pre-qualified sets of hardware and provides calibration profiles for its licensees to select from and build into upcoming devices. These arrangements allow for Qualcomm to remove some of the burden from handset vendors, lowering development time and costs, getting depth sensing and advanced photo capabilities to Android phones faster.

It has been all but confirmed that the upcoming Apple iPhone 8 will have face detection integrated on it and the company’s push into AR (augmented reality) with iOS 11 points to a bet on depth sensing technology as well. Though Apple is letting developers build applications and integrations with the current A9 and A10 processors, it will likely build its own co-processor to handle the compute workloads that come from active depth sensing and offset power consumption concerns of using a general purpose processor.

Early leaks indicate that Apple will focus its face detection technology on a similar path to the one Qualcomm has paved: security and convenience. By using depth-based facial recognition for both login and security (as a Touch ID replacement), users will have an alternative to fingerprints. That is good news for a device that is having problems moving to a fingerprint sensor design that uses the entire screen.

It now looks like a race to integration for Android and Apple smartphones and devices. The Qualcomm Spectra ISP and module program will accelerate adoption in the large and financially variable Android market, giving handset vendors another reason to consider Qualcomm chipsets over competing solutions. Apple benefits from control over the entire hardware, software, and supply chain, and will see immediate adoption of the capabilities when the next-generation iPhone makes its debut. 

Source:
Author:
Subject: Mobile
Manufacturer: Various

Specifications

In the original premise for today’s story, I had planned to do a standard and straight-forward review of the iPad Pro 10.5-inch model, the latest addition to Apple’s line of tablet devices. After receiving the 12.9-in variant, with the same processor upgrade but a larger and much more substantial screen, I started using them both as my daily-driver computing device. I was surprised at how well both handled the majority of tasks I tossed their way but there was still some lingering doubt in my mind about the usefulness of the iOS system as it exists today for my purposes.

The next step was for me to acquire an equivalent Windows 10-based tablet and try making THAT my everyday computer and see how my experiences changed. I picked up the new Surface Pro (2017) model that was priced nearly identical to the iPad Pro 12.9-in device. That did mean sacrificing some specifications that I would usually not do, including moving down to 4GB of memory and a 128GB SSD. This brought the total of the iPad Pro + Pencil + keyboard within $90 of the Surface Pro and matching accessories.

IMG_4814.JPG

I should mention at the outset that with the pending release of iOS 11 due in the fall, the Apple iPad Pro line could undergo enough of a platform upgrade to change some of the points in this story. At that time, we can reevaluate our stance and conclusions.

Specifications

Let’s start our editorial with a comparison of the hardware being tested in the specification department. Knowing that we are looking two ARM-based devices and an x86 system, we should realize core counts, clocks, and the like are even less comparable and relatable than in the Intel/AMD debates. However, it does give us a good bearing on how the hardware landscape looks when we get into the benchmarking section of this story.

Surface Pro (2017) vs. iPad Pro (2017) Comparison
Processor Intel Core i5-7300U (Kaby Lake)
2-core/4-thread
Apple A10X
(3x high performance Hurrican, 3x high efficiency Zephyr cores)
Graphics Intel HD Graphics 620 12-core Custom PowerVR
Memory 4GB 4GB
Screen 12.3-in 2736x1824 IPS 12.9-in 2732x2048 IPS 120 Hz
10.5-in 2224x1668 IPS 120 Hz
Storage

128GB SSD

256GB SSD
Camera 5MP Front
8MP Rear
7MP Front
12MP Rear + OIS
Wireless 802.11ac 802.11ac
Connections USB 3.0
Mini DisplayPort
Headphone
Lightning
Headphone
Battery 45 Wh 12.9-in: 41 Wh
10.5-in: 30.4 Wh
Dimensions 11.50-in x 7.93-in x 0.33-in 12.9-in: 12.04-in x 8.69-in x 0.27-in
10.5-in: 9.87-in x 6.85-in x 0.24-in
OS Windows 10 iOS 10
Price $999 - Amazon.com 12.9-in: $899
10.5-in: $749 - Amazon.com

Continue reading our comparison of the 2017 Surface Pro and iPad Pro!

Imagination Technologies Pursues Acquisition Talks

Subject: Graphics Cards, Mobile | June 23, 2017 - 10:45 PM |
Tagged: Imagination Technologies, imagination, apple, gpu

According to a press release from Imagination Technologies, the group has been approached by multiple entities who are interested in acquiring them. None of these potential buyers have been mentioned by name, however. The press release also makes it clear that the group is only announcing that discussions have started, and that other interested parties can contact their financial adviser, Rothschild, to join in.

imaginationtech-logo.png

It’s entirely possible that nothing could come from these discussions, but Imagination Technologies clearly wants as many options to choose from as possible.

This announcement is clearly related to the recent news that Apple plans to stop licensing technology from them, which made up about half of the whole company’s revenue at the time. The press release states that they are still in dispute with Apple with a dedicated, highly visible, single-line paragraph. As far as I know, Apple hasn’t yet provided proof that they are legally clear of Imagination Technology’s licenses, and the press release claims that they still dispute Apple’s claims.

Hopefully we’ll hear more concrete details in the near future.