Biostar Launches X370GT7 Flagship Motherboard For Ryzen CPUs

Subject: Motherboards | February 21, 2017 - 10:16 AM |
Tagged: ryzen, M.2, ddr4, biostar, amd, AM4

Biostar is gearing up for AMD's Ryzen release with the launch of several new AM4 motherboards using the X370 and B350 chipsets. At the top of the product stack is the flagship X370GT7 motherboard.

Biostar X370GT7.jpg

The X370GT7 is part of Biostar's racing series and features a black PCB with checkered flag artwork and LED-backlit "armor" over the rear IO edge. The motherboard surrounds the AMD AM4 socket with two large heat spreaders cooling a 8+4 Digital Power+ power phase (PowIRstage IC), four DDR4 slots (up to 64GB at 2667 MHz), and a M.2 (32 Gbps) slot with bundled SSD heat spreader that matches the racing and carbon fiber aesthetic.

The bottom half of the AM4 Motherboard houses the X370 chipset, six SATA 3 ports, two PCI-E 3.0 x16 slots (running 1 at x16 or both at x8 with Ryzen, Bristol Ridge is limited to one x8 slot), one PCI-E 2.0 x16 (electrically x4) slot, and three PCI-E 2.0 x1 slots. Biostar also highlights the inclusion of 5050 LED headers and a USB 3.1 front panel header with "Lightning Charger" which supports Quick Charge 2.0 (12V@1.5A) as well as Apple devices (5V@2.4A).

Around back, the X370GT7 has the following rear IO ports:

  • PS/2
  • 1 x USB 3.1 Type-C
  • 1 x USB 3.1 Gen 2
  • 4 x USB 3.1 Gen 1 (USB 3.0)
  • 3 x Video Outputs:
    • 1 x DisplayPort (4K@60Hz)
    • 1 x HDMI 2.0 (4K@60Hz)
    • 1 x DVI-D (1200p@60Hz)
  • 1 x Gigabit Ethernet (Realtek RTL8118AS)
  • Audio (Realtek ALC1220, 8 channel Blu Ray Audio, "Biostar Hi-FI")
    • 5 x Analog out
    • 1 x S/PDIF

While an Intel NIC would have been nice to see, the Biostar board looks to offer up a decent package of connections and the Realtek audio codec has been around for a while and should be fairly well developed at this point though we will have to see how well Biostar's Hi-Fi implementation fares. Further, Biostar also offers a small touch panel on the board called GT Touch that lets users switch UEFI profiles between performance and eco-friendly modes as well as power and reset buttons for testing outside of a case. For LED fans Biostar bundles software called "LED DJ" that lets you configure an LED light show that responds to music being played on the PC. (Yes, this is a thing now hehe.)

It is nice to see Biostar rising to the occasion and offering up more options for Ryzen CPUs. Unfortunately as is the case with more things there is no word on pricing or availability yet though rumors would suggest an early march release to coincide with Ryzen processors hitting store shelves.

Also read:

Source: Biostar

AMD Details Zen at ISSCC

Subject: Processors | February 9, 2017 - 02:38 AM |
Tagged: Zen, Skylake, Samsung, ryzen, kaby lake, ISSCC, Intel, GLOBALFOUNDRIES, amd, AM4, 14 nm FinFET

Yesterday EE Times posted some interesting information that they had gleaned at ISSCC.  AMD released a paper describing the design process and advances they were able to achieve with the Zen architecture manufactured on Samsung’s/GF’s 14nm FinFETT process.  AMD went over some of the basic measurements at the transistor scale and how it compares to what Intel currently has on their latest 14nm process.

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The first thing that jumps out is that AMD claimes that their 4 core/8 thread x86 core is about 10% smaller than what Intel has with one of their latest CPUs.  We assume it is either Kaby Lake or Skylake.  AMD did not exactly go over exactly what they were counting when looking at the cores because there are some significant differences between the two architectures.  We are not sure if that 44mm sq. figure includes the L3 cache or the L2 caches.  My guess is that it probably includes L2 cache but not L3.  I could be easily wrong here.

Going down the table we see that AMD and Samsung/GF are able to get their SRAM sizes down smaller than what Intel is able to do.  AMD has double the amount of L2 cache per core, but it is only about 60% larger than Intel’s 256 KB L2.  AMD also has a much smaller L3 cache as well than Intel.  Both are 8 MB units but AMD comes in at 16 mm sq. while Intel is at 19.1 mm sq.  There will be differences in how AMD and Intel set up these caches, and until we see L3 performance comparisons we cannot assume too much.

Zen-comparison.png

(Image courtesy of ISSCC)

In some of the basic measurements of the different processes we see that Intel has advantages throughout.  This is not surprising as Intel has been well known to push process technology beyond what others are able to do.  In theory their products will have denser logic throughout, including the SRAM cells.  When looking at this information we wonder how AMD has been able to make their cores and caches smaller.  Part of that is due to the likely setup of cache control and access.

One of the most likely culprits of this smaller size is that the less advanced FPU/SSE/AVX units that AMD has in Zen.  They support AVX-256, but it has to be done in double the cycles.  They can do single cycle AVX-128, but Intel’s throughput is much higher than what AMD can achieve.  AVX is not the end-all, be-all but it is gaining in importance in high performance computing and editing applications.  David Kanter in his article covering the architecture explicitly said that AMD made this decision to lower the die size and power constraints for this product.

Ryzen will undoubtedly be a pretty large chip overall once both modules and 16 MB of L3 cache are put together.  My guess would be in the 220 mm sq. range, but again that is only a guess once all is said and done (northbridge, southbridge, PCI-E controllers, etc.).  What is perhaps most interesting of it all is that AMD has a part that on the surface is very close to the Broadwell-E based Intel i7 chips.  The i7-6900K runs at 3.2 to 3.7 GHz, features 8 cores and 16 threads, and around 20 MB of L2/L3 cache.  AMD’s top end looks to run at 3.6 GHz, features the same number of cores and threads, and has 20 MB of L2/L3 cache.  The Intel part is rated at 140 watts TDP while the AMD part will have a max of 95 watts TDP.

If Ryzen is truly competitive in this top end space (with a price to undercut Intel, yet not destroy their own margins) then AMD is going to be in a good position for the rest of this year.  We will find out exactly what is coming our way next month, but all indications point to Ryzen being competitive in overall performance while being able to undercut Intel in TDPs for comparable cores/threads.  We are counting down the days...

Source: AMD

AMD Announces Q4 2016 and FY 2016 Results

Subject: Editorial | February 1, 2017 - 04:14 AM |
Tagged: Vega, ryzen, quarterly results, Q4 2016, Q4, FY 2016, amd, AM4

Today AMD announced their latest quarterly earnings.  There was much speculation as to how well or how poorly the company did, especially in light of Intel’s outstanding quarter and their record year.  Intel has shown that the market continues to be strong, even with the popular opinion that we are in a post-PC world.  Would AMD see a strong quarter, or would Intel take further bites out of the company?

icon.jpg

The results for AMD are somewhere in between.  It was not an overly strong quarter, but it was not weak either.  AMD saw strength in the GPU market with their latest RX series of GPUs for both desktop and mobile applications.  Their CPU sales seemingly were flat with limited new products in their CPU/APU stack.  AMD is still primarily shipping 32nm and 28nm products and will not introduce 14nm products until Ryzen in late Q1 of this year.  While AMD has improved their APU offerings at both mobile and desktop TDPs, they still rely on Carrizo and the Bristol Ridge derivative to provide new growth.  The company’s aging Piledriver based Vishera CPUs still comprise a significant portion of sales for the budget and midrange enthusiast markets.

The company had revenues of $1.11B US for Q4 with a $51M net loss.  Q3 featured revenues of $1.31B, but had a much larger loss of $293M.  The primary factor for that loss was the $340M charge for the adjusted wafer start agreement that AMD has with GLOBALFOUNDRIES.  AMD did make less this past quarter, but they were able to winnow their loss down to the $51M figure.  

While AMD stayed steady with the CPU/APU and GPU markets, their biggest decline came in the semi-custom products.  This is understandable due to the longer lead times on these products as compared to AMD’s CPUs/APUs and GPUs.  The console manufacturers purchase these designs and then pay out royalties as the chips are produced.  Sony and Microsoft each had new console revisions for this holiday season that feature new SoC designs from AMD for each.  To hit the holiday rush these companies made significant orders in Q2 and Q3 of this year to allow delivery in Q4.  Once those deliveries are made then Sony and Microsoft dramatically cut orders to allow good sell-through in Q4 and not have massive unsold quantities in Q1 2017.  With royalties down with fewer chips being delivered, AMD obviously suffers at the hand of seasonality typically one quarter sooner than Intel or NVIDIA does.

am4_01.jpg

For the year AMD had nearly $300M more in revenue as compared to 2015.  2016 ended at $4.27B as compared to 2015’s $3.99B.  This is generally where AMD has been for the past decade, but is lower than they have seen in years past with successful parts like Athlon and their Athlon 64 parts.  In 2005 AMD had $5.8B in revenue.  We see that AMD still has a way to go before matching some of their best years as a company.

One of the more interesting aspects is that even through these quarterly losses AMD has been able to increase their cash on hand.  AMD was approaching some $700M a few years back and with the losses they were taking it would not be all many years before liquidity was non-existent.  AMD has been able to build that up to $1.26B at the end of this quarter, giving them more of a cushion to rely upon in tight times.

AMD’s year on year improvement is tangible, but made more impressive when considering how big of an impact the $340M charge that the WSA incurred.  This shows that AMD has been very serious about cutting expenses and monetizing their products to the best of their ability.

This coming year should show further improvement for AMD due to a more competitive product stack in CPUs, APUs, and GPUs.  AMD announced that Ryzen will be launching sometimes this March, hitting the Q1 expectations that the company had in the second half of 2016.  Previous to that AMD thought they could push out limited amounts of Ryzen chips in late Q4 2016, but that did not turn out to be the case.  AMD has shown off multiple Ryzen samples running anywhere from 3.2 GHz base with a potential engineering sample with a boosted speed up to 4 GHz.  Ryzen looks far more competitive against Intel’s current and upcoming products than AMD has in years.

am4_03.png

The GPU side will also be getting a boost in the first half of 2017.  It looks like the high end GPU Vega will be launching in Q2 2017.  AMD has addressed the midrange and budget markets with the Polaris based chips but has been absent at the high end with 14nm chips.  AMD still produces and sells Fury and Nano based offerings that somewhat address the area above the midrange, but they do not adequately compete with the NVIDIA GTX 1070 and 1080 products.  Vega looks to be competitive with what NVIDIA has at the high end, and there is certainly a pent up demand for an AMD card in that market.

AMD had a solid 2016 that showed that the current management team could successfully lead the company through some very challenging times.  The company continues to move forward and we shall see new products with CPUs, GPUs, and motherboards that should all materially contribute to and expand AMD’s bottom line.

Source: AMD

Podcast #432 - Kaby Lake, Vega, CES Review

Subject: Editorial | January 12, 2017 - 09:42 PM |
Tagged: Vega, Valerie, snapdragon, podcast, nvidia, msi, Lenovo, kaby lake, hdr, hdmi, gus, FreeSync2, dell, coolermaster, CES, asus, AM4, acer, 8k

PC Perspective Podcast #432 - 01/12/17

Join us this week as we DasKeyboard, Samsung 750 EVO, CES predictions and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts:  Ryan Shrout, Allyn Malventano, Josh Walrath, Jermery Hellstrom

Program length: 1:45:28

Podcast topics of discussion:
 
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
    1. Jeremy: 1:42:11 They did it, they beat the hairbrush
  4. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

Source:

CES 2017: Gigabyte Teases New AM4 Platform Motherboards

Subject: Motherboards | January 12, 2017 - 02:31 AM |
Tagged: x370, x300, ryzen, gigabyte, CES 2017, CES, b350, AM4, a320

Last week AMD provided additional details on the chipsets and AM4 platform (JoshTekk article link) that will support the company's upcoming Ryzen processors. On tap are the X370, B350, A320 for enthusiast, mid range, and budget markets respectively and the odd-man-out and somewhat mysterious pinky sized X300 chipset specifically geared for Mini ITX and other small form factor motherboards. Gigabyte answered some of Josh and I's questions on what actual motherboards will look like and what features manufacturers would take advantage of when it unveiled (nearly) its full lineup of AM4 motherboards at CES 2017.

Except for an X300-based motherboard which was absent from their booth, Gigabyte teased four new motherboards using each of AMD's new chipsets. Specifically, there will be two Aorus-branded high end X370-based motherboards known as GA-AX370-Gaming 5, GA-AX370-Gaming K5, a midrange B350-based Gigabyte AB350-Gaming 3 motherboard, and a budget micro ATX A320M-HD3 using the lower end A320 chipset.

All four of the motherboards surround the 1331-pin AM4 processor socket with four dual channel DDR4 DIMM slots, six SATA 6Gbps ports, at least one M.2 slot, at least two PCI-E 3.0 x16 slots, and modern USB 3.1 external IO connections.

Gigabyte GA-AX370 Aorus Gaming 5.jpg

Tech Report takes a look at Gigabyte's planned AM4 motherboard lineup.

The Gigabyte GA-AX370-Gaming 5 is the company's highest end motherboard and is clad in silver and black with white heatspreaders and "armor" plating. Being part of the Aorus brand, the motherboard has RGB LEDs and is reportedly at feature parity with Gigabyte's RGB-lit Z270 offerings. Powered by a 24-pin ATX and 8-pin EPS, the Gaming 5 uses a 10-phase VRM along with large heat spreaders to facilitate overclocking. The board features three PCI-E 3.0 x16 slots that are electrically wired as x16/x8/x4 with support for CrossFireX and SLI (though only AMD will let you go to three cards on the third x4 slot) and three PCI-E x1 slots. The storage subsystem includes a single U.2 port and two SATA Express connectors (part of the total six SATA 6Gbps, not in addition to).

External I/O includes:

  • 1x PS/2
  • 6x USB 3.1 Gen 1
  • 4x USB 3.1 Gen 2 (1 x Type-C)
  • 2x Gigabit Ethernet
    • 1x Intel
    • 1x Killer Ethernet 2500
  • 6x Audio
    • 5x Analog out
    • 1x SPDIF

Other little features like a BIOS code readout display and hybrid fan headers are part of the higher end boards but absent on the lower end ones.

Moving from the Gaming-5 to the GA-AX370-Gaming K5, the heat spreaders are scaled back and the color scheme is black and silver instead of white, silver, and black. Further, the power phases are less robust at seven phases, there is no LED display for error codes, no U.2 port, and no Killer Networks Ethernet. The slightly lower end board does keep the M.2 slot, SATA Express connectors, and PCI-E slots of the Gaming 5, however.

The Gigabyte AB350-Gaming 3 is where things start to noticeably change in the feature set. The VRM area is scaled back further with seven phases and a smaller heatsink. There is no U.2 or SATA Express, and one fewer PCI-E x1 slot than the X370 offerings. The motherboard does have three PCI-E 3.0 x16 slots (I am guessing still wired as x16/x8/x4 but AMD's slide from Josh's story is a bit unclear in this regard) but officially CrossFire and SLI are not supported according to AMD's slide. Around back, the board differs from the higher end models by including display outputs and lacking S/PDIF audio outputs. Specifically, the Gaming 3 board features:

  • 2x USB 2.0
  • 1x PS/2
  • 4x Video outputs
    • 1x VGA
    • 1x DVI
    • 1x DisplayPort 1.2
    • 1x HDMI 2.0 [updated 10:32]
  • 4x USB 3.1 Gen 1
  • 2x USB 3.1 Gen 2
  • 1x Intel Gigabit Ethernet
  • 3x Analog audio outputs (AmpUp! audio)

Finally, the lowest end A320M-HD3 is a micro ATX motherboard with four DDR4 slots, six SATA port, two PCI-E 3.0 x16 slots (likely wired as x8/x4), a single M.2 slot, and a PCI slot of all things. The all black board uses a 7 phase VRM and thanks to most of the connectivity being housed in the processor and A320 chipset, the PCB looks rather barren. This does have the positive effect of allowing AMD to still put four DIMM slots on the board and two PCI-E slots with room to spare. External I/O on this board is identical to the AB350-Gaming 3 above.

In all, it is refreshing to see an updated AMD motherboard platform with the latest storage and graphics connectivity options, and while SATA Express and even U.2 aren't as useful as they could be (not many products actually use those connectors, M.2 has really stolen the show here) the inclusion of native USB 3.1 Gen 2 is great as is the ability to use all six SATA 6Gbps ports along with dual graphics cards (things get dicer when adding PCI-E storage and/or using the 4th x16 slot which may reduce the number of available SATA ports but that is a bit beyond this article.) It is nice to see these features coming from AMD directly and not having to rely on third party chips for modern features as AMD's AM3 platform had to. Seeing the initial launch boards take advantage of the new features fully is promising as well though I expect to see different configurations in the audio, M.2, and external I/O departments from future Gigabyte boards and their competitors. 

I am curious to see how well the chipsets perform versus Intel's in the USB 3.1 and PCI-E storage departments as well as how overclocking will work with Ryzen and how far the AM4 platform boards will be able to push the new chips. It appears that AM4 has Zen off to a good start, and here's hoping that the AM4 platform will carry Zen into the future and help Ryzen, ahem, rise up to the task of delivering on all those performance promises from AMD!

For more photos and information on Gigabyte's AM4 offerings, The Tech Report got a first look at the boards last week and Gamer's Nexus shot some video footage of them on the CES show floor.

Coverage of CES 2017 is brought to you by NVIDIA!

PC Perspective's CES 2017 coverage is sponsored by NVIDIA.

Follow all of our coverage of the show at https://pcper.com/ces!

Author:
Subject: Motherboards
Manufacturer: AMD

AM4 Edging Closer to Retail

Many of us were thinking that one of the bigger stories around CES would be the unveiling of a goodly chunk of AM4 motherboards.  AM4 has been around for about half a year now, but only in system integrator builds (such as HP).  These have all been based around Bristol Ridge APU (essentially an updated Carrizo APU).  These SOCs are not exactly barn burners, but they provide a solid foundation for a low-cost build.  The APUs features 2 modules/4 cores, a GCN based GPU, and limited southbridge I/O functionality.

am4_01.jpg

During all this time the motherboards available from these OEMs are very basic units not fit for retail.  Users simply could not go out and buy a Bristol Ridge APU and motherboard for themselves off of Newegg, Amazon, and elsewhere.  Now after much speculation we finally got to see the first AM4 retail style boards unveiled at this year’s CES.  AMD showed off around 16 boards based on previously unseen B350 and X370 chipsets.

AMD has had a pretty limited number of chipsets that they have introduced over the years.  Their FM2+ offerings spanned the A series of chipsets, but they added very little in terms of functionality as compared to the 900 series that populate the AM3+ world.  The latest offering from AMD was the A88x which was released in September 2013.  At one time there was supposed to be a 1000 series of chipsets for AM3+, but those were cancelled and we have had the 900 series (which are identical to the previous 800 series) since 2011.  This has been a pretty stagnant area for AMD and their partners.  3rd party chips have helped shore up the feature divide between AMD and Intel’s regular release of new chipsets and technologies attached to them.

am4_02.jpg

There are three primary chipsets being released as well as two physical layer chips that allow the use of the onboard southbridge on Ryzen and Bristol Ridge.  The X370 for the enthusiast market, the B350 for the mainstream, and then the budget A320.  The two chipset options for utilizing the SOC’s southbridge functionality are the X300 and A/B300.

Before we jump into the chipsets we should take a look at what kind of functionality Ryzen and Bristol Ridge have that can be leveraged by motherboard manufacturers.  Bristol Ridge is a true SOC in that it contains the GPU, CPU, and southbridge functionality to stand alone.  Ryzen is different in that it does not have the GPU portion so it still requires a standalone graphics card to work.  Bristol Ridge is based off of the older Carrizo design and does not feature the flexibility in its I/O connections that Ryzen does.

am4_03.png

Bristol Ridge features up to 8 lanes of PCI-E 3.0.  The I/O on it includes 2 native SATA6G ports as well as the ability to either utilize two more PCI-e lanes or have them as x2 NVME.  That is about as flexible as it gets.  It also natively supports four USB 3.1 gen 1 ports.  For a chip that was designed to be a mobile focused SoC it makes sense that it will not max out PCI-E lanes or SATA ports.  It still is enough to satisfy most mobile and SFF builds.

Click here to read more about AMD's AM4 platform!

CES 2017: MSI Shows Off X370 XPower Gaming Titanium AM4 Motherboard

Subject: Motherboards | January 6, 2017 - 02:59 AM |
Tagged: x370, msi, CES 2017, CES, amd, AM4

MSI is in full force at CES 2017 this year and in addition to external GPU docks, laptops, and a wall of Z270 motherboards, the company is using the event to show off its AM4 motherboards for the first time. At the top of the pack is the flagship X370 XPower Gaming Titanium clad in shimmering white and black and ready to support AMD’s upcoming “Ryzen” processors based on the Zen architecture.

Screenshot (115).png

Image Source: eTeknix (video)

Armed with AMD’s highest end X370 chipset, the flagship motherboard supports Ryzen CPUs as well as 7th generation APUs. There are four DDR4 memory slots on the board that MSI claims can operate in dual channel mode at up to 2667 MHz when overclocked. The board is rather powerful as well in that there are a lot of power connections. The usual 24-pin ATX and 8-pin EPS are joined by a 4-pin ATX up top and a 6-pin PCI-E connector on the bottom to stabilize overclocks. Further, a 10-phase VRM drives the AM4 socket and memory.

The motherboard further features three PCI-E x16 slots, three PCI-E x1 slots, two M.2 (32 Gb/s), one U.2 (32 Gb/s), and six SATA 6 Gbps ports. On the PCI-E front, the first two slots are connected to the processor and run at x8 when both slots are populated while the third slot is connected to the chipset and is electrically x4. As far as the SATA ports, two are directly connected to the processor and four come from the chipset.

MSI is including their own onboard audio solution called Audio Boost 4 as well as Gigabit Ethernet though the Steel Armor is covering the chips so it is hard to say exactly what they are using there. Also, Multi GPU setups are officially supported up to two way SLI HB or three way CrossFireX.

There is a plethora of USB support here with the X370 XPower Gaming Titanium supporting up to four USB 3.1 (one Type-C, three Type-A), eight USB 3.0, and seven USB 2.0 ports. If that is not enough, then you may have an addition to PC accessories (or just really like those USB missle batteries hehe).

Naturally, MSI is staying silent on pricing and availability of the motherboard(s) but I hope to see them out within the first half of the year! The design is certainly polarizing, but the features are there. I look forward to reading our review of this and other AM4 motherboards and how they fare at overclocking!

Coverage of CES 2017 is brought to you by NVIDIA!

PC Perspective's CES 2017 coverage is sponsored by NVIDIA.

Follow all of our coverage of the show at https://pcper.com/ces!

Source: TechPowerUp

Meet AMD's new chipset, the X300 and X370

Subject: Motherboards, Shows and Expos | January 5, 2017 - 04:00 AM |
Tagged: x370, x300, ryzen, CES 2017, CES, amd, AM4

Tonight at CES AMD announced 16 new AM4 motherboards from five manufacturers and new PCs from over a dozen system builders.  The motherboards will all bring support for dual channel DDR4 memory, NVMe, M.2 SATA devices and USB 3.1 support for AMD users. You can also expect at least 24 lanes of PCIe 3.0, perhaps more if we can spot some with bridge chips.

The MSI A320 Pro-VD and B350 Tomahawk (not to scale)

msi.png

MSI will be showing off their A320M Pro-VD, X370 XPower Gaming Titanium, B350 Tomahawk and B350M Mortar. 

Gigabyte's GA-X370 Gaming K5, GA-AX370-Gaming 5 and GA-AB350-Gaming 3.

gigabyte.png

The gang should have updates on the full lineup soon including the Gigabyte A320M-HD3 not pictured above.

Biostar's X370 GT7 TOP and B350 GT3 TOP

biostar.png

ASRock's ASRock Fatal1ty X370 Professional Gaming and X370 Taichi.

asrock.png

There are more models on display and ASUS did announce the Asus B350M-C though we did not yet get a picture of it.  All motherboards will offer compatibility with at least some existing coolers, we know for a fact that Corsair's Hydro H60, H100i and H110i as well as Noctua's NH-U12S, NHL9x65 and D15 will all be supported.

 

Coverage of CES 2017 is brought to you by NVIDIA!

PC Perspective's CES 2017 coverage is sponsored by NVIDIA.

Follow all of our coverage of the show at https://pcper.com/ces!

Source: AMD

Mid-Range Gigabyte Socket AM4 (B350 Chipset) Micro ATX Motherboard Pictured

Subject: Motherboards | October 2, 2016 - 03:20 AM |
Tagged: Zen, micro ATX, Excavator, Bristol Ridge, b350, amd, AM4

Thanks to a recent leak over at Bodnara.co.kr (which has since been taken down), pictures emerged online that give a first look at an AMD socket AM4 motherboard using the mid-range B350 chipset. The Gigabyte B350M-DS3H is a Micro ATX motherboard supporting Bristol Ridge processors at launch and Zen-based processors next year.

The mid-range AM4 board has a very simple layout that leaves little mystery. There are no large heatsinks and no northbridge thanks to AMD moving most of the connectivity to the SoC itself. In fact there is only a small passively cooled chip in the bottom right corner (the B350 chipset) that between the SoC and it can offer up PCI-E 3.0, SATA 6.0, USB 3.1, USB 3.0, NVMe SSD, and DDR4 memory support. This post outlines how the duties are split between the processor and southbridge.

Gigabyte AMD AMD4 B350 Chipset Motherboard.jpg

The B350M-DS3H is powered by a 24-pin ATX and 8-pin EPS and Gigabyte is using a seven phase VRM to power the processor and memory. The board hosts a 1331 pin AM4 socket up top with four DDR4 slots to the right. The CMOS battery is placed just above the PCI-E slots in a position that Morry would be proud of (so long as your CPU cooler is not too massive). Below that are two PCI-E 3.0 x16 slots (electrically x16/x4 or x8/x8), a single PCI-E 3.0 x1 slot, and a NVMe M.2 (PCI-E) slot. The bottom right corner of the board hosts six SATA 6 Gbps ports.

Rear I/O on the AMD motherboard includes:

  • 2 x USB 2.0
  • 1 x PS/2
  • 3 x Video Outputs
    • 1 x VGA
    • 1 x DVI
    • 1 x HDMI
  • 4 x USB 3.0
  • 2 x USB 3.1
  • 1 x Gigabit Ethernet                
  • 3 x Audio Jacks

Several websites are reporting that AMD will be unleashing the floodgates of socket AM4 motherboards using the A320 and B350 chipsets in October (it is saving the launch of the enthusiast X370 chipset for next year alongside Summit Ridge). I have to say that it is nice to see an AMD motherboard with updated I/O which is a nice change from the ancient 990X AM3+ platform and even the FM2+ motherboards which were newer but still .ot as full featured as the competition.

Also read:

Source: Fudzilla

Podcast #401 - Gigabyte X99P-SLI, RevoDrive is back, GPU Drivers, Computex, and more!

Subject: General Tech | May 26, 2016 - 09:53 PM |
Tagged: X99P-SLI, toshiba, revodrive, review, RD400, podcast, pcper, ocz, msi, hardware, gigabyte, fdsoi, computex, amd, AM4, am3, am2, 303, 22nm

PC Perspective Podcast #401 - 05/26/2016

Join us this week as we discuss the Gigabyte X99P-SLI, RevoDrive is back, GPU Drivers, Computex, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts:  Allyn Malventano, Jeremy Hellstrom, Josh Walrath, and Sebastian Peak

Program length: 1:07:00
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
    1. Jeremy: #MakeSpaceGreatAgain
    2. Allyn: [the Sequence]
    3. Josh: Last Year’s Model, but still nifty!
    4. Sebastian: A great game, remastered
  4. http://pcper.com/podcast
  5. http://twitter.com/ryanshrout and http://twitter.com/pcper
  6. Closing/outro

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